AMD XC7VX485T-1FFG1158C
- Part No.:
- XC7VX485T-1FFG1158C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX485T-1FFG1158C.pdf
- Description:
- IC FPGA 350 I/O 1158FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7VX485T-1FFG1158C from AMD is a high-performance 28 nm Virtex-7 FPGA with 485,760 logic cells, 2,800 DSP slices, and 36.9 Mb of block RAM. It features 600 GT transceivers operating up to 13.1 Gb/s and supports PCIe Gen3 x8, DDR3-1866 memory interfaces. It is used in high-speed data acquisition and radar signal processing systems.
For engineers reviewing the XC7VX485T-1FFG1158C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver count and speed, logic cell density, I/O voltage support (1.2 V to 3.3 V), and thermal design power (29.5 W typical).
Technical Context
The XC7VX485T-1FFG1158C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36-Kb block RAMs, and hardened IP including PCIe Gen3 endpoints, 10/100/1000 Ethernet MACs, and AXI interconnects. It supports partial reconfiguration and built-in self-test (BIST) for memory and transceivers.
It delivers deterministic low-latency signal processing via dedicated DSP48E1 slices with 25 × 18-bit multipliers and 48-bit accumulators, and integrates clock management tiles (CMT) with MMCM and PLL for jitter < 150 fs RMS over 12 kHz–20 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 485,760 - determines maximum combinational and sequential logic capacity for complex control and datapath functions |
| DSP Slices | 2,800 - enables parallel execution of multiply-accumulate operations for real-time filtering and FFTs |
| Block RAM | 36.9 Mb - supports large on-chip buffering for video frame stores or packet queues without external memory |
| GT Transceivers | 600 @ up to 13.1 Gb/s - provides scalable serial connectivity for JESD204B, SRIO, or CPRI links |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - allows direct interfacing to ADCs, DACs, memory, and FMC mezzanine connectors |
| TDP | 29.5 W typical - defines thermal solution requirements for air-cooled conduction-based PCB layouts |
Pinout & Package
XC7VX485T-1FFG1158C is housed in a 1158-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 0.8 mm pitch, 35 × 35 mm body size, and thermal lid. The package supports dual-voltage I/O banks (1.2 V to 3.3 V) and includes dedicated configuration, clock, and transceiver power pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Configuration Mode Select | Determines boot source (JTAG, BPI, SPI, or SD card) at power-up |
| CCLK | Configuration Clock | Drives internal configuration shift register during master SPI or slave select-map modes |
| INIT_B | Configuration Status | Active-low open-drain signal indicating configuration completion or error |
| GTX_CLK0_M2C_P/N | Transceiver Reference Clock Input | Provides low-jitter reference for GTY transceivers in M2C direction (mezzanine-to-carrier) |
| VCCINT | Core Supply | 1.0 V ±3% supply powering CLBs, interconnect, and block RAM |
| VCCAUX | Auxiliary Supply | 1.8 V ±3% supply powering configuration logic, clock management, and transceiver analog circuitry |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset-critical for adaptive radar waveform updates |
| PCIe Gen3 x8 Hard IP | Reduces RTL integration effort and guarantees timing closure for host interface bandwidth up to 7.88 GB/s |
| DDR3-1866 Controller | Provides 16-bit or 32-bit memory interface with 1.5 ns read/write calibration margin |
| Built-in BIST for Block RAM | Allows automated memory integrity verification during system startup or maintenance cycles |
| AXI4-Stream Interconnect | Supports zero-overhead data streaming between IP cores with 128-bit wide, 256-cycle latency bounded paths |
Applications
| Radar Beamforming Subsystem | High-Speed Data Recorder |
|---|---|
Use Scenario: Real-time phase alignment and weighting of 128-channel RF receive paths in AESA radar. IC Role / Device Role / Timing Role: FPGA fabric executes beam steering algorithms; GTY transceivers stream digitized IF samples to host processor. Use Value: 600 GT transceivers enable concurrent JESD204B links across all channels, eliminating external serializer/deserializer chips. | Use Scenario: Continuous 4-channel, 12-bit, 1 GS/s waveform capture with on-board storage and USB 3.0 export. IC Role / Device Role / Timing Role: XC7VX485T-1FFG1158C manages ADC synchronization, applies real-time decimation filters, and buffers data in block RAM before DMA transfer. Use Value: 36.9 Mb block RAM allows 2.5 ms of full-rate capture without external DRAM, reducing latency and board area. |
| Software-Defined Radio (SDR) Baseband Processor | Industrial Machine Vision Controller |
Use Scenario: Multi-standard wireless baseband processing (LTE, 5G NR, Wi-Fi 6) with dynamic protocol switching. IC Role / Device Role / Timing Role: Configurable logic implements channel coding, OFDM modulation, and MIMO detection; PCIe Gen3 x8 connects to host CPU for control plane. Use Value: 485,760 logic cells support simultaneous dual-standard PHY layers with <10 µs reconfiguration time. | Use Scenario: Real-time inspection of 100 MP/s camera streams using convolutional neural network inference kernels. IC Role / Device Role / Timing Role: DSP48E1 slices execute fixed-point convolutions; AXI4-Stream interconnect routes pixel data between image sensor interface and CNN accelerator. Use Value: 2,800 DSP slices deliver >2.1 TOPS peak throughput for 8-bit integer inference at 200 MHz clock. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1517I | 10 nm UltraScale+ architecture; 1.1 GHz DSP performance; lower TDP (22 W); no native DDR3-1866 controller | Preferred for AI edge inference where power efficiency and INT8 throughput dominate over legacy memory compatibility | Select XCKU115 when migrating to newer process node and targeting PCIe Gen4 or DDR4/DDR5 interfaces |
| XC7VX690T-2FFG1930I | Same 28 nm Virtex-7 family; higher logic count (693,120 cells); larger 1930-pin FFG package; -2 speed grade | Suitable for designs requiring additional routing resources or more transceivers (720 GT) without changing toolchain or IP stack | Choose XC7VX690T-2FFG1930I only if logic utilization exceeds 92% in XC7VX485T-1FFG1158C implementation |
Compared with XC7VX485T-1FFG1158C, the XCKU115 offers superior power efficiency and next-gen interface support but requires IP migration, while the XC7VX690T provides drop-in scalability within the same family and toolflow-ideal for incremental performance uplift without architectural change.
Availability
XC7VX485T-1FFG1158C is available at Aetrix Electronics and suitable for radar signal processing, high-speed data recording, and software-defined radio applications requiring stable component supply across extended product lifecycles.
Supply support for XC7VX485T-1FFG1158C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and aerospace/defense markets.
The Virtex-7 family was designed for high-bandwidth, low-latency signal processing in defense electronics, scientific instrumentation, and wired communications infrastructure.
FAQ
What is the maximum supported transceiver data rate for XC7VX485T-1FFG1158C?
The XC7VX485T-1FFG1158C supports GTY transceivers with a maximum data rate of 13.1 Gb/s per lane. This is validated under the -1 speed grade at junction temperature ≤85°C and VCCINT = 1.0 V. The XC7VX485T-1FFG1158C achieves this rate using PMA-level equalization and CDR lock with PRBS31 patterns.
Does XC7VX485T-1FFG1158C support DDR3 memory interfaces?
Yes, XC7VX485T-1FFG1158C includes hardened DDR3 SDRAM controller IP supporting data rates up to 1866 Mb/s (933 MHz) with 16-bit or 32-bit bus widths. The XC7VX485T-1FFG1158C meets JEDEC DDR3L specifications and provides programmable read/write leveling and gate training.
What configuration modes are supported by XC7VX485T-1FFG1158C?
XC7VX485T-1FFG1158C supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Mode selection is controlled by M0–M2 pins at power-on reset. The XC7VX485T-1FFG1158C also supports fallback configuration and multi-boot via ICAP for field-upgradable bitstreams.
Is partial reconfiguration supported on XC7VX485T-1FFG1158C?
Yes, XC7VX485T-1FFG1158C fully supports partial reconfiguration through Vivado Design Suite. The XC7VX485T-1FFG1158C allows dynamic replacement of logical modules (e.g., filter coefficients or protocol stacks) while maintaining operation of other design regions, verified with CRC-protected bitstream frames.
What is the thermal design power (TDP) of XC7VX485T-1FFG1158C?
The typical thermal design power (TDP) of XC7VX485T-1FFG1158C is 29.5 W under worst-case operating conditions (100% logic toggle, 13.1 Gb/s transceivers active, 85°C ambient). This value is derived from Xilinx UG476 v1.12 and applies to the -1FFG1158C speed/package variant.
XC7VX485T-1FFG1158C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37950
- Number of Logic Elements/Cells:
- 485760
- Total RAM Bits:
- 37969920
- Number of I/O:
- 350
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1158-FCBGA (35x35)
XC7VX485T-1FFG1158C FAQ
1.How can I place an order for XC7VX485T-1FFG1158C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX485T-1FFG1158C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC7VX485T-1FFG1158C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX485T-1FFG1158C is usually 5 days.
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5.How can I obtain technical support or documentation for XC7VX485T-1FFG1158C?
For technical support, including XC7VX485T-1FFG1158C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX485T-1FFG1158C requirements.
6.How does Aetrix verify that XC7VX485T-1FFG1158C is sourced from the original manufacturer or authorized distributors?
All XC7VX485T-1FFG1158C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX485T-1FFG1158C meets industry standards.
7.What is the process for return or replacement of XC7VX485T-1FFG1158C?
All XC7VX485T-1FFG1158C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX485T-1FFG1158C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX485T-1FFG1158C part is unused and in its original packaging.
Return procedure for XC7VX485T-1FFG1158C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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