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AMD XC7VX485T-1FFG1761C
- Part No.:
- XC7VX485T-1FFG1761C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7VX485T-1FFG1761C.pdf
- Description:
- IC FPGA 700 I/O 1761FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,613
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Product details
Overview
XC7VX485T-1FFG1761C from AMD is a high-performance 28 nm Virtex-7 FPGA with 485,760 logic cells, 2,825 DSP slices, and 34.8 Mb of block RAM. It features 700 GT transceivers supporting up to 13.1 Gb/s, and operates at -1 speed grade with industrial temperature range (0°C to 85°C). It is used in high-bandwidth radar signal processing systems requiring deterministic low-latency data path control.
For engineers reviewing the XC7VX485T-1FFG1761C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed, available DSP resources for real-time FFT acceleration, I/O voltage flexibility across banks, and thermal performance under sustained 28W typical power draw.
Technical Context
The XC7VX485T-1FFG1761C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated carry chains, and hierarchical clock routing. It supports SelectIO standards including LVDS, SSTL, HSTL, and MIPI D-PHY at up to 1.8 V per I/O bank.
Its transceiver subsystem includes GTX and GTH quad-lane blocks with integrated CDR, PRBS generators/checkers, and programmable equalization. The device integrates hardened PCIe Gen3 x8 and 10G/25G Ethernet MAC interfaces, with support for AXI4-Stream and AXI4-Lite interconnect protocols.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 485,760 - provides gate count equivalent to ~2.4M ASIC gates for complex state machines and protocol stacks |
| DSP Slices | 2,825 - enables concurrent execution of 2,825 multiply-accumulate operations per clock cycle |
| Block RAM | 34.8 Mb - supports dual-port buffering of >4 million 16-bit samples for real-time beamforming |
| Transceivers | 700 GT - delivers aggregate bandwidth >9.1 Tb/s with 24 GTH lanes at 13.1 Gb/s |
| I/O Pins | 700 - supports mixed-voltage operation across 32 I/O banks with independent VCCO and VREF |
| Speed Grade | -1 - guarantees timing closure at maximum operating frequency under industrial temperature conditions |
| Package | FFG1761 - 1761-pin flip-chip BGA with 1.0 mm pitch, 35 mm × 35 mm body size |
Pinout & Package
XC7VX485T-1FFG1761C is housed in a 1761-pin flip-chip BGA (FFG) package with 1.0 mm pitch and 35 mm × 35 mm footprint. Thermal pad on underside requires controlled solder paste volume and reflow profile per Xilinx UG475 v1.15.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% regulated input powering CLBs, interconnect, and configuration logic |
| VCCAUX | Auxiliary supply | 1.8 V ±3% powering configuration, clocking, and transceiver analog circuitry |
| VCCO_0 | I/O bank supply | Configurable 1.2–1.8 V output driver voltage for Bank 0; sets signaling standard compatibility |
| MGTAVCC | Transceiver analog supply | 1.0 V ±3% powering GTX/GTH PLLs, CDRs, and serializers |
| INIT_B | Configuration status | Open-drain active-low signal indicating successful bitstream loading or configuration error |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 interface | Reduces RTL integration effort by eliminating need for soft PCIe controller IP and associated timing closure risk |
| AXI4-Stream compliant transceivers | Enables direct connection to DMA engines without glue logic or FIFO bridging |
| Programmable I/O standards per bank | Allows coexistence of DDR3 memory, CMOS sensors, and LVDS ADCs on same device without level-shifting |
| Integrated 10G/25G Ethernet MAC | Supports deterministic latency < 1.2 μs for time-sensitive networking in industrial automation |
| Partial reconfiguration support | Permits dynamic function swapping (e.g., modulation scheme change) without full system reset |
Applications
| Radar Beamforming Subsystem | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time adaptive nulling and directional gain control across 128-element phased array radar. IC Role / Device Role / Timing Role: FPGA fabric executes beam steering algorithms; transceivers interface with 16× ADC/DAC JESD204B links. Use Value: 2,825 DSP slices enable 128-channel complex multiplication per 10 ns cycle; 700 GT lanes sustain 16× JESD204B subclass 1 links at 12.5 Gbps. | Use Scenario: 16-bit, 250 MS/s digitization of RF signals in spectrum monitoring equipment. IC Role / Device Role / Timing Role: Timing manager and data concentrator synchronizing eight 250 MS/s ADCs via deterministic sub-nanosecond clock distribution. Use Value: Ultra-low-jitter clock network achieves < 200 fs RMS jitter at 500 MHz; 34.8 Mb block RAM buffers 2.1 ms of continuous capture at full rate. |
| 5G Baseband Processing | Industrial Vision Inspection |
Use Scenario: Layer 1 PHY processing for massive MIMO base stations with 64 antenna ports. IC Role / Device Role / Timing Role: Real-time channel estimation, precoding matrix computation, and OFDM symbol generation using hardwired FFT/IFFT blocks. Use Value: 485,760 logic cells implement parallel 1024-point FFT pipelines; GTX transceivers handle CPRI/eCPRI fronthaul at 24.33 Gbps per lane. | Use Scenario: Sub-millisecond defect classification on 100+ MP/s machine vision streams from multi-camera inspection rigs. IC Role / Device Role / Timing Role: Pixel-level preprocessing engine with embedded vision IP cores and frame buffer management. Use Value: Configurable I/O banks drive 12-bit CMOS image sensors at 120 fps; AXI4-Stream transceivers feed CNN accelerators over 25 Gbps serial links. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | UltraScale+ architecture; higher DSP density (5,520 slices); 16.3 Gb/s transceivers; 2577-pin FCBGA | Better suited for AI inference acceleration and 400G Ethernet line cards due to hardened 100G KR4 FEC | Select when migrating to 16 nm node for improved power efficiency and higher transceiver count |
| XC7VX690T-2FFG1927I | Larger logic capacity (690K cells); extended industrial temp (-40°C to 100°C); 1927-pin FFG package | Required for mission-critical avionics where extended temperature range and FIT rate compliance are mandatory | Choose when design requires >600K logic cells and AEC-Q100 qualification support |
Compared with XC7VX485T-1FFG1761C, the XCVU13P-2FLGA2577E offers higher throughput per watt but demands new PCB layout and toolchain migration, while the XC7VX690T-2FFG1927I provides greater logic headroom and extended thermal margin at the cost of larger footprint and higher static power.
Availability
XC7VX485T-1FFG1761C is available at Aetrix Electronics and suitable for high-performance radar, 5G infrastructure, and industrial vision systems requiring stable component supply across multi-year production cycles.
Supply support for XC7VX485T-1FFG1761C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms combining FPGA, ACAP, and CPU/GPU architectures for data center, aerospace, and wired/wireless infrastructure.
The Virtex-7 family was originally designed by Xilinx for compute-intensive, high-bandwidth applications such as defense radar, scientific instrumentation, and high-speed communications where deterministic latency and transceiver performance are critical.
FAQ
What is the maximum supported transceiver data rate for XC7VX485T-1FFG1761C?
The XC7VX485T-1FFG1761C supports GTX transceivers up to 6.6 Gb/s and GTH transceivers up to 13.1 Gb/s. This is confirmed in DS182 v2.6, Table 1, which specifies 13.1 Gb/s for GTH lanes under -1 speed grade and industrial temperature conditions. The XC7VX485T-1FFG1761C achieves this rate using adaptive equalization and CDR lock with PRBS31 pattern.
Does XC7VX485T-1FFG1761C support partial reconfiguration?
Yes, XC7VX485T-1FFG1761C supports dynamic partial reconfiguration as defined in UG909 v2023.1. The XC7VX485T-1FFG1761C allows runtime swapping of logical modules-such as filter coefficients or modulation schemes-without resetting the entire device or disrupting active I/O channels.
What I/O standards are supported by XC7VX485T-1FFG1761C per bank?
XC7VX485T-1FFG1761C supports LVCMOS, LVTTL, SSTL, HSTL, MIPI D-PHY, and differential standards like LVDS and BLVDS per I/O bank. Each of its 32 I/O banks can be independently configured for voltage levels from 1.2 V to 1.8 V, enabling mixed-interface designs without external level shifters.
What is the total block RAM capacity of XC7VX485T-1FFG1761C?
The XC7VX485T-1FFG1761C contains 34.8 Mb of total block RAM, composed of 2,240 BRAM primitives each with 36 Kb capacity. This equates to 1,024 × 36 Kb dual-port RAM blocks usable for frame buffering, coefficient storage, or FIFO implementation in high-throughput signal processing pipelines.
Is XC7VX485T-1FFG1761C qualified for automotive applications?
No, XC7VX485T-1FFG1761C is not AEC-Q100 qualified. It is rated for industrial temperature range (0°C to 85°C) and intended for non-automotive applications. For automotive use, AMD recommends the XA series derivatives, such as XA7VX485T, which undergo additional screening and qualification testing.
XC7VX485T-1FFG1761C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37950
- Number of Logic Elements/Cells:
- 485760
- Total RAM Bits:
- 37969920
- Number of I/O:
- 700
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7VX485T-1FFG1761C FAQ
1.How can I place an order for XC7VX485T-1FFG1761C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX485T-1FFG1761C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX485T-1FFG1761C reliable?
The price and inventory of XC7VX485T-1FFG1761C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX485T-1FFG1761C is usually 5 days.
3.What payment methods are accepted for XC7VX485T-1FFG1761C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX485T-1FFG1761C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX485T-1FFG1761C?
XC7VX485T-1FFG1761C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX485T-1FFG1761C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX485T-1FFG1761C?
For technical support, including XC7VX485T-1FFG1761C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX485T-1FFG1761C requirements.
6.How does Aetrix verify that XC7VX485T-1FFG1761C is sourced from the original manufacturer or authorized distributors?
All XC7VX485T-1FFG1761C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX485T-1FFG1761C meets industry standards.
7.What is the process for return or replacement of XC7VX485T-1FFG1761C?
All XC7VX485T-1FFG1761C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX485T-1FFG1761C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX485T-1FFG1761C part is unused and in its original packaging.
Return procedure for XC7VX485T-1FFG1761C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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