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AMD XC7VX485T-1FFG1927I
- Part No.:
- XC7VX485T-1FFG1927I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX485T-1FFG1927I.pdf
- Description:
- IC FPGA 600 I/O 1927FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,394
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Product details
Overview
XC7VX485T-1FFG1927I from AMD is a high-performance 28 nm Virtex-7 FPGA with 485,760 logic cells, 3,600 DSP slices, and 44.8 GB/s transceiver bandwidth (up to 13.1 Gb/s per GT). It integrates PCIe Gen3 x8, DDR3 memory controllers, and supports deterministic low-latency processing in radar signal chain acceleration.
For engineers reviewing the XC7VX485T-1FFG1927I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory depth, I/O bank voltage flexibility, and thermal performance under sustained DSP load.
Technical Context
The XC7VX485T-1FFG1927I implements a segmented architecture with 24 configurable I/O banks supporting LVDS, SSTL, HSTL, and TMDS signaling. Its 36 transceivers are grouped into four GTY quad tiles, each with independent reference clocking and PRBS pattern generation for serial link validation.
Configuration occurs via dual BPI NOR flash or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device includes hardened IP blocks for PCIe Gen3 endpoint/root port, 10/100/1000 Ethernet MAC, and AXI interconnect infrastructure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 485,760 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 3,600 - enables parallel execution of multiply-accumulate operations at up to 350 MHz in radar beamforming |
| Transceiver Speed | 13.1 Gb/s - supports single-lane CPRI v6.1 and JESD204B subclass 1 links without gearbox |
| Block RAM | 45,120 kbit - provides on-die memory for FIR filter coefficient storage and ping-pong buffering |
| I/O Banks | 24 - allows mixed-voltage interface design across multiple standards within one device |
| PCIe Interface | Gen3 x8 - delivers 7.88 GB/s bidirectional throughput for host-FPGA data streaming |
Pinout & Package
XC7VX485T-1FFG1927I uses a 1927-ball Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation in conduction-cooled modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as SDIO, UART, SPI, I2C, or GPIO; shared with PS side in Zynq-7000 compatible boot modes |
| GTY_TXN/P[0:35] | High-speed differential transmitter | Drives 100 Ω differential traces; supports programmable pre-emphasis and common-mode voltage |
| GTY_RXN/P[0:35] | High-speed differential receiver | Includes adaptive equalization and clock-data recovery locked to incoming serial stream |
| VCCINT | Core supply | Requires regulated 0.95–1.05 V supply; total current draw up to 32 A at full utilization |
| VCCAUX | Auxiliary supply | Powers configuration logic, transceiver PLLs, and I/O banks; nominal 1.8 V ±3% |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic swapping without system reset-critical for multi-mode radar waveform adaptation |
| UltraScale-Compatible Bitstream | Allows migration path to UltraScale+ devices while retaining timing-closure methodology |
| AXI4-Stream Interconnect | Provides zero-latency, flow-controlled data movement between IP blocks without software overhead |
| Integrated ADC Monitoring | On-die temperature and supply sensors feed real-time telemetry to XADC controller for thermal throttling |
| Secure Boot with AES-256 | Prevents unauthorized bitstream loading and ensures cryptographic integrity of configuration memory |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based phased array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes matched filtering, CFAR detection, and beam steering algorithms with sub-microsecond latency. Use Value: 3,600 DSP slices enable simultaneous 128-channel FFT + matrix inversion at 10 kHz update rate. | Use Scenario: Digitization and preprocessing of multi-channel oscilloscope front-ends sampling at 5 GS/s. IC Role / Device Role / Timing Role: Acts as real-time decimation engine and trigger logic coordinator between ADCs and DDR3 memory buffer. Use Value: 13.1 Gb/s GTY transceivers capture raw ADC streams directly without deserializer ASIC. |
| Avionics Data Concentrators | Test Equipment Backplanes |
Use Scenario: ARINC 664 (AFDX) end-system aggregation of sensor and actuator traffic in fly-by-wire platforms. IC Role / Device Role / Timing Role: Implements deterministic time-triggered Ethernet switch with hardware timestamping and priority queuing. Use Value: PCIe Gen3 x8 interface enables direct connection to flight control computer with guaranteed 50 μs interrupt latency. | Use Scenario: Modular instrumentation chassis backplane handling mixed-signal stimulus/response across PXIe slots. IC Role / Device Role / Timing Role: Serves as protocol bridge between PXIe Gen3 root complex and custom analog I/O modules via high-speed serial lanes. Use Value: 24 I/O banks support concurrent LVDS, HSTL, and SSTL signaling for legacy and next-gen module interoperability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | 16 nm UltraScale+ architecture; 2,586K logic cells; higher DSP density but lower transceiver count (20 vs 36) | Better suited for AI inference acceleration; less optimal for multi-lane JESD204B baseband processing | Select when algorithm complexity exceeds Virtex-7 capacity and power budget allows 16 nm thermal profile |
| XC7VX690T-2FFG1927I | Same 28 nm node and FFG1927 package; 690K logic cells and 4,400 DSP slices; higher static power and junction temp limit | Targets larger radar aperture systems requiring extended FFT size and wider filter banks | Choose when additional logic resources are required without changing PCB layout or cooling solution |
Compared with XC7VX485T-1FFG1927I, the XCVU9P offers superior compute density but reduced serial I/O scalability, while the XC7VX690T delivers more resources in identical mechanical form factor at higher thermal cost.
Availability
XC7VX485T-1FFG1927I is available at Aetrix Electronics and suitable for radar signal processing, high-speed test equipment, and avionics data concentrators requiring stable component supply across extended production lifecycles.
Supply support for XC7VX485T-1FFG1927I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace applications through its Adaptive SoC and FPGA portfolio.
The Virtex-7 family targets high-throughput, low-latency signal processing in defense electronics, scientific instrumentation, and wired communications infrastructure.
FAQ
What is the maximum operating junction temperature for XC7VX485T-1FFG1927I?
The XC7VX485T-1FFG1927I has a maximum operating junction temperature of 100°C, validated under worst-case voltage, process, and ambient conditions. Thermal design must ensure that the die temperature remains within this limit during sustained DSP-intensive operation. The XC7VX485T-1FFG1927I includes on-chip temperature sensors accessible via the XADC interface for closed-loop thermal monitoring.
Does XC7VX485T-1FFG1927I support JESD204B subclass 1 operation?
Yes, the XC7VX485T-1FFG1927I supports JESD204B subclass 1 with deterministic latency and SYNC~ alignment across all 36 GTY transceivers. This capability is verified in AMD's PG066 transceiver guide and enables synchronized multi-ADC acquisition in phased array systems. The XC7VX485T-1FFG1927I provides dedicated SYSREF distribution and phase alignment circuitry for subclass 1 compliance.
Can XC7VX485T-1FFG1927I be configured via SPI flash?
No, the XC7VX485T-1FFG1927I does not support primary configuration from SPI flash. It requires BPI (x16) NOR flash or JTAG for configuration. While SPI can be used for secondary functions like firmware updates or auxiliary data storage, the XC7VX485T-1FFG1927I boot process relies on parallel NOR flash or boundary-scan programming.
What I/O standards are supported by XC7VX485T-1FFG1927I in HR banks?
The XC7VX485T-1FFG1927I HR (High Range) I/O banks support LVCMOS, LVTTL, SSTL-15/18, HSTL-I/II, and differential standards including LVDS, BLVDS, and RSDS. Each HR bank operates at 1.2–3.3 V, enabling direct interfacing with DDR3 memory, image sensors, and industrial buses. The XC7VX485T-1FFG1927I allows per-bank voltage assignment and mixed-standard operation within the same bank group.
Is partial reconfiguration supported on XC7VX485T-1FFG1927I?
Yes, partial reconfiguration is fully supported on the XC7VX485T-1FFG1927I using Vivado Design Suite 2019.2 or later. This feature allows runtime replacement of logic modules without resetting the entire device, essential for adaptive radar waveform changes or protocol switching. The XC7VX485T-1FFG1927I includes dedicated configuration access ports and frame-level security controls for safe partial bitstream loading.
XC7VX485T-1FFG1927I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37950
- Number of Logic Elements/Cells:
- 485760
- Total RAM Bits:
- 37969920
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1927-FCBGA (45x45)
XC7VX485T-1FFG1927I FAQ
1.How can I place an order for XC7VX485T-1FFG1927I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX485T-1FFG1927I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX485T-1FFG1927I reliable?
The price and inventory of XC7VX485T-1FFG1927I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX485T-1FFG1927I is usually 5 days.
3.What payment methods are accepted for XC7VX485T-1FFG1927I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX485T-1FFG1927I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX485T-1FFG1927I?
XC7VX485T-1FFG1927I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX485T-1FFG1927I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX485T-1FFG1927I?
For technical support, including XC7VX485T-1FFG1927I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX485T-1FFG1927I requirements.
6.How does Aetrix verify that XC7VX485T-1FFG1927I is sourced from the original manufacturer or authorized distributors?
All XC7VX485T-1FFG1927I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX485T-1FFG1927I meets industry standards.
7.What is the process for return or replacement of XC7VX485T-1FFG1927I?
All XC7VX485T-1FFG1927I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX485T-1FFG1927I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX485T-1FFG1927I part is unused and in its original packaging.
Return procedure for XC7VX485T-1FFG1927I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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