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AMD XC7VX485T-1FFG1930C
- Part No.:
- XC7VX485T-1FFG1930C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX485T-1FFG1930C.pdf
- Description:
- IC FPGA 700 I/O 1930FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,327
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Product details
Overview
XC7VX485T-1FFG1930C from AMD is a high-performance 28 nm Virtex-7 FPGA with 485,760 logic cells, 2,825 DSP slices, and 34.8 Mb of block RAM. It features 700 GT transceivers operating up to 13.1 Gb/s and supports PCIe Gen3 x8, SATA III, and 10G Ethernet in programmable logic fabric.
For engineers reviewing the XC7VX485T-1FFG1930C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed, on-chip memory depth, DSP resource density, and thermal performance in high-throughput signal processing and protocol bridging designs.
Technical Context
The XC7VX485T-1FFG1930C implements a heterogeneous FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices, and UltraScale-inspired clocking resources including MMCM and PLL blocks. It integrates SelectIO technology supporting LVDS, SSTL, HSTL, and MIPI D-PHY interfaces at up to 1.8 V.
Its GTY transceiver banks support PAM4 and NRZ signaling, PRBS31 pattern generation, and built-in eye scan functionality. The device uses a 1930-pin Flip-Chip BGA (FFG) package with 400 I/Os, 128 GTY transceiver lanes, and dual-supply operation (VCCINT = 0.95 V, VCCAUX = 1.8 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 485,760 - determines maximum combinational/sequential logic capacity for complex state machines and datapaths |
| DSP Slices | 2,825 - enables parallel execution of multiply-accumulate operations in radar, AI inference, and digital beamforming |
| Block RAM | 34.8 Mb - supports large FIFOs, coefficient storage, and frame buffers without external memory |
| GTY Transceivers | 128 lanes @ 13.1 Gb/s - delivers full-duplex serial bandwidth for 100G KR4, CPRI, and JESD204B applications |
| I/O Count | 400 - provides scalable parallel interface connectivity to ADCs, DACs, memory, and FMC mezzanine cards |
| Package | 1930-pin FFG - enables high-density routing and thermal dissipation in air-cooled rack-mounted systems |
| VCCINT / VCCAUX | 0.95 V / 1.8 V - defines power delivery network requirements and voltage regulator selection |
Pinout & Package
The XC7VX485T-1FFG1930C is housed in a 1930-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat transfer.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC / MGTAVTT | Analog transceiver supply | Must be independently filtered and regulated to meet ±3% tolerance for stable 13.1 Gb/s link operation |
| MRCC / SRCC | Multi-/Single-ended clock input | Supports differential clock injection into global clock networks with <150 ps skew across 12 clock regions |
| HPC FMC Connector Pins | High Pin Count mezzanine interface | Provides 160+ user I/Os compatible with VITA 57.1 for rapid prototyping of RF and sensor subsystems |
| VCCINT / VCCAUX | Core and auxiliary supply | Requires separate low-noise VRMs with transient response <50 mV under 2 A/μs load step |
| PROGRAM_B / INIT_B | Configuration control | Active-low signals that manage slave serial configuration flow from SPI flash or JTAG boundary scan |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic swapping in deployed systems without full FPGA reset-critical for mission-critical comms and defense platforms |
| AXI Interconnect Infrastructure | Integrated 64-bit AXI4/AXI4-Lite crossbar supports concurrent master/slave transactions across multiple IP cores |
| UltraScale-Compatible Toolflow | Uses Vivado 2023.1+ with timing closure convergence within 5% of target frequency for 500 MHz system clocks |
| Transceiver Built-in Self-Test | On-chip PRBS generator/checker and eye diagram scanner eliminate need for external BERT in production test |
| PCIe Gen3 x8 Endpoint | Hard IP block delivers <1.5 μs transaction latency and full TLP ordering compliance without soft-core overhead |
Applications
| Radar Signal Processing | 100G Optical Transport |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and synthetic aperture radar (SAR) image formation in airborne platforms. IC Role / Device Role / Timing Role: XC7VX485T-1FFG1930C serves as the primary compute engine executing FFT, CFAR, and beamforming kernels with deterministic latency. Use Value: 2,825 DSP slices enable simultaneous 4K-point FFTs at 200 MS/s while block RAM buffers 16 ms of raw ADC data. | Use Scenario: Line-side aggregation of 4×25G client interfaces into a single 100G KR4 or CAUI-4 optical transport link. IC Role / Device Role / Timing Role: XC7VX485T-1FFG1930C implements forward error correction (FEC), scrambling, and gearbox logic between SerDes lanes. Use Value: 128 GTY transceivers operate at 25.78125 Gb/s with PAM4 encoding, meeting IEEE 802.3cd spec for 100GBASE-KR4. |
| Medical Imaging Acceleration | Defense EW Systems |
Use Scenario: Real-time reconstruction of CT and MRI volumetric datasets using iterative algorithms and GPU-like parallelism. IC Role / Device Role / Timing Role: XC7VX485T-1FFG1930C hosts custom hardware accelerators for back-projection and denoising, interfacing directly to 32-channel ADCs. Use Value: 400 I/Os support LVDS-2000 interfaces to analog front-ends; 34.8 Mb block RAM stores intermediate sinogram matrices. | Use Scenario: Wideband electronic warfare receiver performing real-time channelization, demodulation, and threat classification across 2–18 GHz. IC Role / Device Role / Timing Role: XC7VX485T-1FFG1930C processes digitized IF streams from multi-GHz ADCs and executes adaptive jamming waveform synthesis. Use Value: GTY transceivers used as high-speed data movers between ADC/DAC tiles and DSP fabric; partial reconfiguration allows mode switching in <50 ms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | 1.3M logic cells, 5,520 DSP slices, 42.5 Mb BRAM, 132 GTM transceivers up to 28.1 Gb/s | Higher transceiver speed and logic density suit 400G ZR coherent optics and AI training acceleration | Select when >25 Gb/s serial I/O or >1M logic cells are required; requires PCB redesign due to FLGA2577 package |
| XC7VX690T-2FFG1930I | 690K logic cells, same GTY transceivers and I/O count, but -2 speed grade and industrial temp rating (-40°C to +100°C) | Better thermal margin and higher static timing closure for long-life military avionics deployments | Choose for extended temperature operation; identical pinout enables drop-in replacement where timing budget permits |
Compared with XCVU13P-2FLGA2577E, XC7VX485T-1FFG1930C offers lower power and proven qualification for aerospace-grade cooling; versus XC7VX690T-2FFG1930I, it trades logic capacity for tighter timing margins and commercial-temperature cost optimization.
Availability
XC7VX485T-1FFG1930C is available at Aetrix Electronics and suitable for radar signal processing, 100G optical transport, and medical imaging acceleration requiring stable component supply over multi-year production cycles.
Supply support for XC7VX485T-1FFG1930C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and high-performance computing.
The Virtex-7 family was engineered for bandwidth-intensive, low-latency applications in defense, communications infrastructure, and scientific instrumentation where deterministic timing and transceiver flexibility are critical.
FAQ
What is the maximum supported transceiver data rate for XC7VX485T-1FFG1930C?
The XC7VX485T-1FFG1930C supports GTY transceivers operating up to 13.1 Gb/s per lane in NRZ mode. This rate is validated across all 128 transceiver lanes under commercial temperature conditions and meets jitter specifications per ANSI T11.2 Fibre Channel standards. The XC7VX485T-1FFG1930C does not support PAM4 at this speed grade; PAM4 operation begins at 25.78125 Gb/s in higher-speed Virtex UltraScale+ devices.
Does XC7VX485T-1FFG1930C support partial reconfiguration?
Yes, the XC7VX485T-1FFG1930C fully supports partial reconfiguration through Vivado Design Suite 2022.2 and later. This capability allows dynamic swapping of logic modules-such as modulator/demodulator pairs or FFT engines-without resetting the entire device. The XC7VX485T-1FFG1930C implements dedicated configuration port logic and frame-based bitstream addressing to ensure safe, atomic reconfiguration.
What is the I/O standard compatibility of XC7VX485T-1FFG1930C?
The XC7VX485T-1FFG1930C supports 21 I/O standards including LVDS, SSTL-18, HSTL-I, MIPI D-PHY, and differential HCSL. Each bank operates at selectable VCCO voltages from 1.2 V to 1.8 V, enabling direct interfacing with DDR3/DDR4 memory, high-speed ADCs, and FMC mezzanine cards. The XC7VX485T-1FFG1930C does not support 3.3 V I/O standards in any bank.
What thermal management guidance applies to XC7VX485T-1FFG1930C?
The XC7VX485T-1FFG1930C requires a thermal solution capable of dissipating up to 32 W under worst-case switching activity. AMD specifies a maximum junction temperature of 100°C and recommends a 25 mm² copper thermal pad with ≥4 thermal vias under the package center. The XC7VX485T-1FFG1930C thermal lid design supports forced-air convection with ≥200 LFM airflow for sustained operation in telecom chassis environments.
Is XC7VX485T-1FFG1930C qualified for automotive applications?
No, the XC7VX485T-1FFG1930C is rated for commercial temperature range (0°C to +85°C) and is not AEC-Q100 qualified. It lacks automotive-specific screening, failure-in-time (FIT) reporting, and extended reliability testing. For automotive ADAS or infotainment systems, AMD recommends the XA7VX485T variant, which shares the same logic fabric but includes automotive qualification and enhanced ESD protection.
XC7VX485T-1FFG1930C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37950
- Number of Logic Elements/Cells:
- 485760
- Total RAM Bits:
- 37969920
- Number of I/O:
- 700
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1930-FCBGA (45x45)
XC7VX485T-1FFG1930C FAQ
1.How can I place an order for XC7VX485T-1FFG1930C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX485T-1FFG1930C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX485T-1FFG1930C reliable?
The price and inventory of XC7VX485T-1FFG1930C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX485T-1FFG1930C is usually 5 days.
3.What payment methods are accepted for XC7VX485T-1FFG1930C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX485T-1FFG1930C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX485T-1FFG1930C?
XC7VX485T-1FFG1930C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX485T-1FFG1930C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX485T-1FFG1930C?
For technical support, including XC7VX485T-1FFG1930C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX485T-1FFG1930C requirements.
6.How does Aetrix verify that XC7VX485T-1FFG1930C is sourced from the original manufacturer or authorized distributors?
All XC7VX485T-1FFG1930C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX485T-1FFG1930C meets industry standards.
7.What is the process for return or replacement of XC7VX485T-1FFG1930C?
All XC7VX485T-1FFG1930C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX485T-1FFG1930C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX485T-1FFG1930C part is unused and in its original packaging.
Return procedure for XC7VX485T-1FFG1930C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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