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AMD XC7VX485T-1FFG1930I
- Part No.:
- XC7VX485T-1FFG1930I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX485T-1FFG1930I.pdf
- Description:
- IC FPGA 700 I/O 1930FCBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
XC7VX485T-1FFG1930I from AMD is a high-performance 28 nm Virtex-7 FPGA with 485,760 logic cells, 2,825 DSP slices, and 36.9 Mb of block RAM. It features 700 GT transceivers supporting up to 13.1 Gb/s, and operates across industrial temperature range (–40°C to +100°C) for mission-critical infrastructure applications.
For engineers reviewing the XC7VX485T-1FFG1930I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count, I/O bank voltage support (1.2 V to 3.3 V), configuration interface (JTAG/SelectMAP), and thermal design power (TDP = 39.2 W at typical conditions).
Technical Context
The XC7VX485T-1FFG1930I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36-Kb RAM blocks, and hardened PCIe Gen3 x8 endpoint/switch endpoints. Its clocking system includes 24 MMCMs and 12 PLLs for multi-domain frequency synthesis and jitter attenuation.
It supports AXI4 interconnect protocols, DDR3/DDR4 memory interfaces up to 1866 Mbps, and partial reconfiguration via ICAP. Configuration is performed through quad-SPI, BPI, or JTAG, with AES-256 bitstream encryption and HMAC authentication enabled.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 485,760 - determines maximum combinational and sequential logic capacity for complex digital systems |
| DSP Slices | 2,825 - enables high-throughput fixed/floating-point computation for radar, video, and AI inference acceleration |
| Block RAM | 36.9 Mb - supports large on-chip data buffering, FIFOs, and lookup tables without external memory |
| GT Transceivers | 700 lanes @ up to 13.1 Gb/s - delivers scalable serial connectivity for 10G/25G Ethernet, CPRI, and Interlaken |
| I/O Pins | 700 - provides flexible interface aggregation across multiple voltage domains (1.2 V to 3.3 V) |
| TDP | 39.2 W - defines thermal envelope requiring active cooling in dense PCB layouts |
| Configuration Interface | JTAG/SelectMAP/BPI - enables in-system programming, boundary-scan testing, and high-speed parallel configuration |
Pinout & Package
The XC7VX485T-1FFG1930I is housed in a 1930-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm pitch, designed for high-density routing and thermal dissipation in backplane and ASIC-replacement applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot mode (JTAG, Master SPI, Slave SelectMAP) during power-up |
| CCLK | Configuration Clock | Drives internal configuration logic; externally sourced in Master SPI mode |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization |
| INIT_B | Configuration Control | Active-low signal indicating device readiness to accept configuration data |
| GTX/GTH RefClk | Transceiver Reference Clock | Provides low-jitter timing reference for GT transceivers (100–650 MHz) |
| VCCINT/VCCAUX/VCCO | Power Rails | Separate supplies for core logic (1.0 V), auxiliary circuitry (1.8 V), and I/O banks (1.2–3.3 V) |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, reducing system downtime in telecom baseband processing |
| AES-256 Bitstream Encryption | Prevents IP theft by securing configuration data against readback and cloning attacks |
| PCIe Gen3 x8 Hard IP | Reduces RTL integration effort and timing closure risk for host interface subsystems |
| AXI4 Interconnect Compliance | Ensures interoperability with Xilinx/AMD IP cores and third-party SoC subsystems |
| Multi-Voltage I/O Banks | Allows direct interfacing with legacy and next-gen peripherals (e.g., DDR4, QSFP+, CMOS sensors) without level shifters |
Applications
| High-Speed Data Acquisition Systems | 5G Wireless Baseband Processing |
|---|---|
Use Scenario: Real-time digitization and preprocessing of multi-channel RF signals in test equipment and phased-array radar. IC Role / Device Role / Timing Role: FPGA fabric performs sample buffering, FFT acceleration, and digital down-conversion using DSP slices and block RAM. Use Value: 700 GT transceivers enable direct connection to ADC/DAC JESD204B interfaces at 12.5 Gbps, eliminating protocol translation overhead. | Use Scenario: Layer 1 PHY processing in massive MIMO remote radio units (RRUs) with real-time channel estimation and precoding. IC Role / Device Role / Timing Role: Configurable logic implements OFDM modulation/demodulation, MIMO matrix inversion, and CPRI/eCPRI fronthaul bridging. Use Value: 485K logic cells and 2,825 DSP slices deliver deterministic latency < 5 µs for closed-loop beamforming control loops. |
| Avionics Data Concentrators | High-Performance Computing Acceleration |
Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and AFDX traffic into unified avionics networks aboard commercial and military aircraft. IC Role / Device Role / Timing Role: XC7VX485T-1FFG1930I acts as deterministic packet switch and protocol translator with time-triggered scheduling. Use Value: Industrial temperature rating (–40°C to +100°C) and TMR-capable CLBs meet DO-254 Level A hardware assurance requirements. | Use Scenario: Offloading compute-intensive kernels (e.g., matrix multiplication, convolution) from CPU/GPU in edge inference servers. IC Role / Device Role / Timing Role: FPGA serves as reconfigurable accelerator tightly coupled to host via PCIe Gen3 x8 hard IP. Use Value: 36.9 Mb on-chip RAM reduces off-chip memory bandwidth bottlenecks, improving throughput per watt over GPU alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924I | UltraScale architecture; higher DSP density (5,520 slices); lower max transceiver speed (16.3 Gb/s vs. 13.1 Gb/s) | Better suited for newer designs targeting higher algorithmic throughput and PCIe Gen4 | Choose XCKU115 if migrating to 20 nm node for improved power efficiency and larger memory bandwidth |
| XC7VX690T-2FFG1930I | Same Virtex-7 family; larger logic capacity (693,120 cells); higher TDP (47.1 W); identical pinout and package | Used where additional logic resources are required for multi-protocol convergence or larger state machines | XC7VX690T-2FFG1930I is a direct upgrade path within same footprint when scaling logic utilization beyond 85% |
Compared with XCKU115-2FLVD1924I and XC7VX690T-2FFG1930I, the XC7VX485T-1FFG1930I offers optimal balance of transceiver count, logic density, and thermal envelope for cost-sensitive 5G fronthaul and defense electronics where 28 nm maturity and long-term supply stability are critical.
Availability
XC7VX485T-1FFG1930I is available at Aetrix Electronics and suitable for 5G wireless infrastructure, avionics data concentrators, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC7VX485T-1FFG1930I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, adaptive SoC, and AI acceleration technologies.
The Virtex-7 family was engineered for high-bandwidth, low-latency signal processing in wired/wireless communications, defense radar, and scientific instrumentation where deterministic timing and I/O flexibility are essential.
FAQ
What is the maximum supported data rate for GT transceivers on the XC7VX485T-1FFG1930I?
The XC7VX485T-1FFG1930I supports GT transceivers operating at up to 13.1 Gb/s. This rate is validated for protocols including 10GBASE-R, CPRI Option 10, and Interlaken. Performance depends on board layout, reference clock quality, and termination; actual link margin must be verified per IBIS-AMI simulation and lab testing.
Does the XC7VX485T-1FFG1930I support partial reconfiguration?
Yes, the XC7VX485T-1FFG1930I fully supports partial reconfiguration via ICAP and PCIe-based runtime updates. This capability allows dynamic replacement of logic modules while maintaining system operation-critical for adaptive radio and real-time signal processing applications where uninterrupted uptime is required.
What configuration modes are supported by the XC7VX485T-1FFG1930I?
The XC7VX485T-1FFG1930I supports JTAG, Master SPI, Slave SelectMAP, and Boundary Scan configuration modes. Mode selection is controlled by M0–M2 pins at power-up. BPI and QSPI interfaces are also available depending on boot source setup and bitstream encryption settings.
Is the XC7VX485T-1FFG1930I qualified for industrial temperature operation?
Yes, the XC7VX485T-1FFG1930I is rated for industrial temperature range (–40°C to +100°C). This qualification applies to the -1 speed grade in the FFG1930 package and is documented in AMD's Virtex-7 DC and AC characteristics datasheet (DS182).
What security features does the XC7VX485T-1FFG1930I provide for bitstream protection?
The XC7VX485T-1FFG1930I includes AES-256 bitstream encryption and HMAC authentication. These features prevent unauthorized readback, cloning, and tampering of configuration data. Key management requires external secure storage or integrated battery-backed SRAM in conjunction with AMD's iMPACT or Vivado tools.
XC7VX485T-1FFG1930I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37950
- Number of Logic Elements/Cells:
- 485760
- Total RAM Bits:
- 37969920
- Number of I/O:
- 700
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1930-FCBGA (45x45)
XC7VX485T-1FFG1930I FAQ
1.How can I place an order for XC7VX485T-1FFG1930I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX485T-1FFG1930I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX485T-1FFG1930I reliable?
The price and inventory of XC7VX485T-1FFG1930I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX485T-1FFG1930I is usually 5 days.
3.What payment methods are accepted for XC7VX485T-1FFG1930I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX485T-1FFG1930I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX485T-1FFG1930I?
XC7VX485T-1FFG1930I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX485T-1FFG1930I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX485T-1FFG1930I?
For technical support, including XC7VX485T-1FFG1930I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX485T-1FFG1930I requirements.
6.How does Aetrix verify that XC7VX485T-1FFG1930I is sourced from the original manufacturer or authorized distributors?
All XC7VX485T-1FFG1930I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX485T-1FFG1930I meets industry standards.
7.What is the process for return or replacement of XC7VX485T-1FFG1930I?
All XC7VX485T-1FFG1930I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX485T-1FFG1930I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX485T-1FFG1930I part is unused and in its original packaging.
Return procedure for XC7VX485T-1FFG1930I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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