My Inquiry
My Account
AMD XC7VX485T-2FF1157C
- Part No.:
- XC7VX485T-2FF1157C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX485T-2FF1157C.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,570
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7VX485T-2FF1157C from AMD is a high-performance 28 nm Virtex-7 FPGA with 485,760 logic cells, 2,825 DSP slices, and 36.9 Mb of block RAM; supports PCIe Gen3 x8, DDR3-1866 memory interface, and operates at -2 speed grade (1.2 V core) in industrial temperature range (-40°C to +100°C).
For engineers reviewing the XC7VX485T-2FF1157C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (500 user I/Os), transceiver line rate (13.1 Gb/s), configuration interface (SPIx4/BPI), thermal design power (29.5 W typical), and JTAG boundary-scan compliance per IEEE 1149.1.
Technical Context
The XC7VX485T-2FF1157C implements a hierarchical FPGA architecture with CLBs, distributed RAM, shift registers, and dedicated carry logic; includes 24 GTX transceivers supporting protocols including CPRI, SRIO, and 10G Ethernet. Configuration is performed via Master SPI or BPI mode using external flash.
It integrates hardened IP blocks including PCIe Gen3 Endpoint/Root Complex, Tri-Mode Ethernet MAC, and AXI interconnect infrastructure; supports partial reconfiguration and bitstream encryption for secure deployment in mission-critical systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 485,760 - total configurable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 2,825 - fixed-point arithmetic units with 25×18 multipliers and 48-bit accumulators |
| Block RAM | 36.9 Mb - configurable memory blocks supporting true dual-port operation up to 72 bits wide |
| User I/O Pins | 500 - selectable voltage standards (1.2–1.8 V) with programmable slew rate and drive strength |
| GTX Transceivers | 24 × 13.1 Gb/s - serial I/O supporting protocol stacks without external retimers |
| Speed Grade | -2 - guarantees timing closure at 1.2 V core supply and industrial temperature range |
| TDP | 29.5 W typical - informs thermal solution sizing and power delivery design |
Pinout & Package
XC7VX485T-2FF1157C is housed in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1157) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and standard I/O ball map compatible with Xilinx/AMD Virtex-7 family routing conventions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Configuration Mode Select | Determines boot source (SPI/BPI/JTAG); must be pulled during power-up |
| CCLK | Configuration Clock | Drives internal configuration logic; sourced externally in Master mode |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading |
| INIT_B | Configuration Initialization | Active-low signal indicating device readiness to accept configuration data |
| PROGRAM_B | Configuration Reset | Active-low input that clears configuration memory and restarts boot sequence |
| VRP/VRN | Reference Voltage Inputs | Provide analog reference for differential I/O standards (e.g., LVDS, TMDS) |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint | Hardened root complex or endpoint logic eliminates soft IP resource usage and timing uncertainty |
| AXI Interconnect | Configurable crossbar supporting up to 16 masters and 16 slaves with QoS arbitration |
| Bitstream Encryption | AES-256 decryption engine protects intellectual property against unauthorized readback |
| Partial Reconfiguration | Enables dynamic module swapping without full system reset or downtime |
| Transceiver Calibration | On-chip calibration circuitry maintains signal integrity across voltage/temperature variation |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Primary compute fabric handling FFT, CFAR, and STAP algorithms with deterministic latency. Use Value: 2,825 DSP slices enable concurrent 1024-point FFTs at >100 MHz clock rates; GTX transceivers interface directly to ADC/DAC JESD204B links. | Use Scenario: Multi-channel oscilloscopes and spectrum analyzers capturing >1 GS/s aggregate sample rates. IC Role / Device Role / Timing Role: Time-interleaved ADC controller and real-time decimation filter engine. Use Value: 500 user I/Os support parallel LVDS interfaces to 16+ ADCs; block RAM buffers sustain burst transfers without DRAM latency. |
| 5G Baseband Processing | Industrial Machine Vision |
Use Scenario: Layer 1 PHY acceleration in massive MIMO base stations with CPRI/eCPRI fronthaul. IC Role / Device Role / Timing Role: Hardened GTX transceivers handle 24.33 Gb/s CPRI lanes; AXI interconnect routes data to DDR3 memory and ARM processors. Use Value: PCIe Gen3 x8 enables high-throughput backhaul to host CPU; -2 speed grade ensures timing margin under thermal stress. | Use Scenario: Sub-millisecond defect classification on high-resolution production lines using CNN inference. IC Role / Device Role / Timing Role: Accelerator fabric executing convolution layers with streaming pixel data from CMOS sensors. Use Value: Distributed RAM and LUT-based shift registers implement low-latency image pipelines; 36.9 Mb block RAM stores filter weights and frame buffers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FL1158I | UltraScale+ architecture; higher logic density (1,024K LC), 58 GTY transceivers (up to 32.75 Gb/s), but larger package (1158-pin FCBGA) and higher TDP (42 W) | Better suited for 400G Ethernet switching and AI inference acceleration requiring >200 Gb/s serial bandwidth | Select when migrating to 16 nm node for improved power efficiency per DSP slice and support for PAM4 signaling |
| XC7VX690T-2FF1157I | Same Virtex-7 family, larger logic capacity (693,120 LC), identical FF1157 package and -2 speed grade, but higher TDP (35.2 W) and no additional GTX transceivers | Ideal for designs needing more CLBs without changing PCB layout or thermal design | Choose for direct capacity upgrade path within same footprint and cooling solution |
Compared with XC7VX485T-2FF1157C, the XCVU13P-2FL1158I offers higher serial bandwidth and process node advantage but requires board redesign, while the XC7VX690T-2FF1157I provides seamless logic scalability within identical mechanical and thermal constraints.
Availability
XC7VX485T-2FF1157C is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and high-speed test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC7VX485T-2FF1157C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded, and aerospace/defense markets.
The Virtex-7 FPGA family targets high-bandwidth, low-latency applications such as wireless infrastructure, defense radar, and scientific instrumentation where deterministic performance and I/O flexibility are critical.
FAQ
What is the maximum supported DDR3 memory interface speed for XC7VX485T-2FF1157C?
The XC7VX485T-2FF1157C supports DDR3-1866 (933 MHz) with 16-bit or 32-bit data bus widths using dedicated memory interface logic. This capability is verified in UG473 and applies specifically to the -2 speed grade under industrial temperature conditions. The XC7VX485T-2FF1157C implements hardware-calibrated delay chains and write-leveling circuitry to maintain timing margins across voltage and temperature variation.
Does XC7VX485T-2FF1157C support partial reconfiguration?
Yes, the XC7VX485T-2FF1157C supports dynamic partial reconfiguration as defined in UG909. It allows runtime swapping of logical modules without resetting the entire device or disrupting active functions. This feature is implemented in the XC7VX485T-2FF1157C using frame-based bitstream loading and hierarchical design partitioning, enabling field-upgradable functionality in deployed systems.
What configuration modes are supported by XC7VX485T-2FF1157C?
The XC7VX485T-2FF1157C supports Master SPI, Slave Serial, Slave Parallel, and Boundary Scan (JTAG) configuration modes. Mode selection is controlled by M0–M2 pins at power-up. The XC7VX485T-2FF1157C also supports fallback configuration and multi-boot via external flash addressing, as documented in UG470.
Is XC7VX485T-2FF1157C qualified for automotive applications?
No, the XC7VX485T-2FF1157C is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, failure mode analysis, and qualification documentation required for automotive ECUs. For automotive use, engineers should evaluate AMD's XA (Automotive) variant parts instead of the standard XC7VX485T-2FF1157C.
What is the purpose of VRP and VRN pins on XC7VX485T-2FF1157C?
The VRP and VRN pins on XC7VX485T-2FF1157C provide analog reference voltages for differential I/O standards including LVDS, RSDS, and TMDS. These pins must be connected to a clean, low-noise 1.2 V supply to ensure accurate receiver threshold alignment. Their function is electrically distinct from VCCO and is mandatory for reliable operation of differential inputs in the XC7VX485T-2FF1157C.
XC7VX485T-2FF1157C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37950
- Number of Logic Elements/Cells:
- 485760
- Total RAM Bits:
- 37969920
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7VX485T-2FF1157C FAQ
1.How can I place an order for XC7VX485T-2FF1157C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX485T-2FF1157C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX485T-2FF1157C reliable?
The price and inventory of XC7VX485T-2FF1157C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX485T-2FF1157C is usually 5 days.
3.What payment methods are accepted for XC7VX485T-2FF1157C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX485T-2FF1157C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX485T-2FF1157C?
XC7VX485T-2FF1157C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX485T-2FF1157C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX485T-2FF1157C?
For technical support, including XC7VX485T-2FF1157C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX485T-2FF1157C requirements.
6.How does Aetrix verify that XC7VX485T-2FF1157C is sourced from the original manufacturer or authorized distributors?
All XC7VX485T-2FF1157C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX485T-2FF1157C meets industry standards.
7.What is the process for return or replacement of XC7VX485T-2FF1157C?
All XC7VX485T-2FF1157C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX485T-2FF1157C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX485T-2FF1157C part is unused and in its original packaging.
Return procedure for XC7VX485T-2FF1157C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7VX485T-2FF1157C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
