AMD XC7VX485T-2FF1761C

Overview

XC7VX485T-2FF1761C from AMD is a high-performance 28 nm Virtex-7 FPGA with 485,760 logic cells, 2,825 DSP slices, and 36.9 Mb of block RAM. It features 700 I/O pins in a flip-chip fine-pitch BGA package and supports transceivers up to 13.1 Gb/s for high-speed serial communication in radar signal processing systems.

For engineers reviewing the XC7VX485T-2FF1761C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade, I/O bank voltage support, configuration interface type (e.g., SelectMAP, JTAG), and thermal performance under sustained 2.5 W/mm² power density.

Technical Context

The XC7VX485T-2FF1761C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated PCIe Gen3 x8 endpoint capability. It includes dual 10/100/1000 Mbps Ethernet MACs and supports AXI4 interconnect protocols.

Configuration occurs via Master SPI or SelectMAP mode using external flash memory; bitstream encryption and HMAC authentication are supported for secure boot. The device operates across commercial temperature range (0°C to 85°C) with core voltage of 0.95 V ±3%.

Key Specifications

Pinout & Package

XC7VX485T-2FF1761C uses a 1761-pin flip-chip fine-pitch BGA (FF1761) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation in high-clock-rate operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC7VX485T-2FF1761C, the XCVU9P offers greater raw compute density but lacks native PCIe Gen3 support, while the XC7VX690T delivers more I/O and logic at the cost of higher thermal load and no thermal lid-making XC7VX485T-2FF1761C optimal for thermally constrained, PCIe-dependent radar and avionics designs.

Availability

XC7VX485T-2FF1761C is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and avionics communication hub applications requiring stable component supply and long-term industrial lifecycle support.

Supply support for XC7VX485T-2FF1761C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company specializing in adaptive computing, high-performance CPUs, GPUs, and FPGAs for data center, embedded, and aerospace markets.

The Virtex-7 family was designed for high-throughput, low-latency signal processing in defense, scientific instrumentation, and wired/wireless infrastructure where deterministic timing and transceiver integration are critical.

FAQ

What is the operating temperature range for XC7VX485T-2FF1761C?

The XC7VX485T-2FF1761C is rated for commercial temperature operation from 0°C to +85°C ambient. Its thermal lid package and 0.95 V core voltage tolerance support stable functionality under sustained 2.5 W/mm² power density, making it suitable for conduction-cooled avionics enclosures where airflow is limited. Thermal derating is not required within this range when used with specified PCB copper pour and heatsink mounting.

Does XC7VX485T-2FF1761C support JTAG boundary scan?

Yes, XC7VX485T-2FF1761C fully supports IEEE 1149.1 JTAG boundary scan for PCB-level interconnect testing and in-system programming. The TDI, TDO, TMS, TCK, and TRST_B pins are dedicated and electrically isolated from configuration I/O. JTAG mode is selected via M0–M2 pins set to 001, and the device complies with Xilinx BSDL models for automated test pattern generation.

What configuration memory options are compatible with XC7VX485T-2FF1761C?

XC7VX485T-2FF1761C supports Master SPI and SelectMAP configuration modes. Compatible external memory includes Micron MT25QL series (quad-SPI flash), Spansion S25FL series, and Macronix MX25L series. Configuration bitstream sizes range from 12–18 MB depending on design utilization, and AES-256 encryption keys must be stored in on-chip eFUSE for secure boot.

Can XC7VX485T-2FF1761C implement a PCIe Gen3 x8 endpoint without external components?

Yes, XC7VX485T-2FF1761C integrates a hardened PCIe Gen3 x8 endpoint block compliant with PCI Express Base Specification 3.0. It requires only passive AC coupling capacitors and reference clock conditioning circuitry-no external switch, retimer, or serializer/deserializer. The hard IP handles link training, transaction layer packet handling, and MSI-X interrupt generation internally.

What is the maximum supported transceiver data rate for XC7VX485T-2FF1761C?

The XC7VX485T-2FF1761C supports transceiver line rates up to 13.1 Gb/s per channel, validated per Xilinx DS182 specification. This enables compliance with 10GBASE-KR, CPRI Option 7, and SRIO Gen2 protocols. At 13.1 Gb/s, each GTY transceiver achieves <1×10⁻¹² BER with PRBS31 pattern and 100 mVpp differential swing into 100 Ω termination.