AMD XC7VX485T-2FFG1157I

Overview

XC7VX485T-2FFG1157I from AMD is a high-performance 28 nm FPGA with 485,760 logic cells, 2,850 DSP slices, and 36.4 Mb of block RAM, configured in a 1157-pin flip-chip BGA package with 0.8 mm pitch and -2 speed grade for industrial temperature operation (-40°C to +100°C). It serves as a reconfigurable system-on-chip in radar signal processing, high-speed data acquisition, and PCIe Gen3-based compute acceleration.

For engineers reviewing the XC7VX485T-2FFG1157I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gbps, and integrated PCI Express® Gen3 x8 endpoint capability.

Technical Context

This device belongs to the Virtex-7 family and implements a 28 nm HKMG process with configurable logic blocks (CLBs), 36-Kb block RAMs, and multi-gigabit transceivers (MGTs) supporting protocols including PCIe Gen3, SRIO Gen2, and 10G Ethernet. It integrates hardened IP including PCIe Gen3 endpoints, 10/100/1000 Ethernet MACs, and clock management tiles with MMCM and PLL.

The XC7VX485T-2FFG1157I supports SelectIO™ standards across 24 I/O banks, includes 40 transceivers operating at up to 13.1 Gbps, and delivers deterministic timing closure via Vivado Design Suite toolchain integration with static timing analysis and bitstream encryption support.

Key Specifications

Pinout & Package

XC7VX485T-2FFG1157I is housed in a 1157-pin flip-chip BGA (FFG1157) package with 35 × 35 mm body size, 0.8 mm ball pitch, and thermal lid. Pin functions are organized into 24 I/O banks, 40 GTY transceiver quads, configuration pins (e.g., INIT_B, PROGRAM_B, CCLK), and dedicated power/ground balls distributed across the array.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC7VX485T-2FFG1157I, XCVU9P-2FLGA2104I offers higher transceiver speed and logic capacity for next-generation protocols, while XC7VX690T-2FFG1927I extends I/O and transceiver count within the same 28 nm process and toolchain-both require PCB redesign but share architectural continuity.

Availability

XC7VX485T-2FFG1157I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and PCIe Gen3 compute acceleration requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XC7VX485T-2FFG1157I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms, including FPGAs, adaptive SoCs, and AI accelerators for data center, aerospace, and industrial applications.

The Virtex-7 family targets high-performance reconfigurable computing in mission-critical systems where deterministic timing, high transceiver bandwidth, and large logic capacity are essential.

FAQ

What is the maximum transceiver line rate supported by XC7VX485T-2FFG1157I?

The XC7VX485T-2FFG1157I supports a maximum transceiver line rate of 13.1 Gbps using its GTY transceivers. This enables compliance with PCIe Gen3, SRIO Gen2, and 10G Ethernet standards. The actual achievable rate depends on board layout, reference clock stability, and signal integrity margins verified during hardware validation.

Does XC7VX485T-2FFG1157I include hardened PCIe Gen3 IP?

Yes, XC7VX485T-2FFG1157I integrates a hardened PCIe Gen3 x8 endpoint block with AXI4 interface. This eliminates the need for soft-core implementations, reduces resource usage, and guarantees sub-1 µs transaction latency. Configuration is managed through Vivado's IP integrator with automatic clocking and reset synchronization.

What I/O standards are supported by XC7VX485T-2FFG1157I?

XC7VX485T-2FFG1157I supports LVDS, SSTL, HSTL, TMDS, and differential signaling standards across its 24 SelectIO™ banks. Each bank operates independently at voltages from 1.2 V to 3.3 V, enabling mixed-voltage interface designs such as DDR3 memory controllers alongside LVDS camera sensors.

What is the operating temperature range for XC7VX485T-2FFG1157I?

XC7VX485T-2FFG1157I is rated for industrial temperature operation from -40°C to +100°C. This rating applies to the -2 speed grade and is validated under JEDEC JESD22-A104 conditions. Thermal management must ensure junction temperature remains within specification during sustained high-utilization operation.

How many block RAM bits does XC7VX485T-2FFG1157I provide?

XC7VX485T-2FFG1157I provides 36.4 Mb of total block RAM capacity, implemented as 36-Kb RAMB36E1 primitives. These can be configured as true dual-port RAM, shift registers, or FIFOs, and support byte-write enable and ECC for critical storage applications.