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AMD XC7VX485T-2FFG1158C

Part No.:
XC7VX485T-2FFG1158C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1156-BBGA, FCBGA
Datasheet:
AetrixXC7VX485T-2FFG1158C.pdf
Description:
IC FPGA 350 I/O 1158FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,157

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Product details

Overview

XC7VX485T-2FFG1158C from AMD is a high-performance 28 nm Virtex-7 FPGA with 485,760 logic cells, 2,825 DSP slices, and 36.9 Mb of block RAM. It features 1158-pin flip-chip BGA packaging, supports transceivers up to 13.1 Gb/s, and targets high-speed serial interface and signal processing applications in radar and wired communications.

For engineers reviewing the XC7VX485T-2FFG1158C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (36), I/O standard support (LVDS, SSTL, HSTL), and speed grade (-2) for timing closure in deterministic latency systems.

Technical Context

The XC7VX485T-2FFG1158C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices, and UltraScale-compatible SelectIO resources. It integrates 36 GTZ transceivers supporting PCIe Gen3, SRIO Gen2, and 10G Ethernet protocols.

Configuration is performed via Master SPI or JTAG, with dual-boot capability and AES-256 bitstream encryption. The device supports partial reconfiguration and includes hardened IP for PCI Express® Gen3 x8 endpoint/root complex operation.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells485,760 - determines maximum combinational/sequential logic capacity for RTL implementation
DSP Slices2,825 - enables parallel multiply-accumulate operations for FIR filters and FFT engines
Block RAM36.9 Mb - supports large on-chip data buffering and FIFOs without external memory
GTZ Transceivers36 × 13.1 Gb/s - provides native support for 10GBASE-R, CPRI, and JESD204B interfaces
I/O Pins600 - delivers high pin-count flexibility for multi-protocol board-level interconnect
Speed Grade-2 - guarantees timing closure at worst-case junction temperature (100°C) and voltage (0.95 V)
PackageFFG1158 - 1158-pin flip-chip BGA with 1.0 mm pitch, thermal lid, and 35×35 mm body

Pinout & Package

The XC7VX485T-2FFG1158C uses a 1158-pin flip-chip BGA (FFG1158) package with integrated thermal lid, 1.0 mm ball pitch, and 35×35 mm footprint. Pin functions are defined per AMD UG475 v1.15 and include configuration, clocking, I/O banks, transceiver quads, and power/ground terminals.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration Clock InputDrives internal configuration state machine during master SPI mode; requires clean 50 MHz source
DONEConfiguration Status OutputOpen-drain signal indicating successful bitstream loading and release of I/O pins
M0–M2Mode Selection InputsSet boot source (SPI, BPI, JTAG) and configuration width (x1/x2/x4) at power-up
VRP/VRNReference Voltage InputsProvide termination reference for differential I/O standards like LVDS and TMDS in bank-specific pairs
GTX/GTH RefClkTransceiver Reference ClockLow-jitter input (10–625 MHz) required for GTZ PLL lock and deterministic transceiver startup

Key Features

FeatureDesign Value
36 GTZ transceiversEnables full-rate 10G Ethernet MAC+PHY integration without external SerDes
PCIe Gen3 x8 hard IPReduces RTL integration effort and guarantees compliance with ECN and LTSSM timing requirements
AES-256 bitstream encryptionPrevents reverse engineering and unauthorized cloning of FPGA configuration data
Partial reconfiguration supportAllows dynamic function swapping (e.g., modulator/demodulator) without system reset
UltraScale-compatible SelectIOSupports mixed-voltage I/O (1.2–1.8 V) across 32 banks with independent VCCO and VREF per bank

Applications

Radar Signal ProcessingHigh-Speed Wired Communications

Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems.

IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; GTZ transceivers interface with ADC/DAC over JESD204B.

Use Value: 2,825 DSP slices enable concurrent 4K-point FFTs at 100 MS/s; -2 speed grade ensures sub-ns timing margin for deterministic latency.

Use Scenario: Line-card processing in 10G/40G optical transport equipment with OTU2/OTU3 framing.

IC Role / Device Role / Timing Role: Implements OTN framer, FEC encoder/decoder, and 10GBASE-R MAC using hardened IP and programmable logic.

Use Value: 36 GTZ transceivers support 4×10G or 1×40G line rates; 36.9 Mb block RAM buffers full OTU3 frames (4.3 ms).

Medical Imaging BackendTest & Measurement Instrumentation

Use Scenario: Digital backend for ultrasound beamformers requiring real-time channel summation and harmonic imaging.

IC Role / Device Role / Timing Role: Configurable logic processes RF echo data; GTZ links to high-speed ADCs and DDR4 memory controllers.

Use Value: 600 I/O pins accommodate 128-channel parallel ADC interface; LVDS I/O supports 1.25 Gbps sampling links.

Use Scenario: High-resolution digital oscilloscope with 10 GS/s sampling and deep memory capture.

IC Role / Device Role / Timing Role: Manages front-end digitizer control, real-time trigger logic, and PCIe Gen3 host data streaming.

Use Value: PCIe Gen3 x8 hard IP achieves 7.88 GB/s sustained host transfer; -2 speed grade meets 100 ps setup/hold windows.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCKU115-2FLVD1517I1.2 GHz UltraScale+ Kintex with higher DSP density (5,520 slices) but lower transceiver count (24× 25.8 Gb/s)Better suited for compute-intensive AI inference kernels; less optimal for multi-lane 10G serial aggregationSelect when algorithmic throughput outweighs serial I/O bandwidth requirements
XCVU13P-2FLGA2577CVirtex UltraScale+ with 1,128 GTY transceivers (up to 32.75 Gb/s), larger logic (1,128K LUTs), and higher power envelopeTargets next-gen 400G Ethernet and coherent optical modules where XC7VX485T lacks sufficient lane count or rateChoose for designs scaling beyond 40G aggregate bandwidth or requiring PAM4 signaling

Compared with XCKU115-2FLVD1517I and XCVU13P-2FLGA2577C, the XC7VX485T-2FFG1158C offers balanced transceiver count and logic density for cost-sensitive 10G–40G systems, while avoiding the higher power and PCB layer count of UltraScale+ devices.

Availability

XC7VX485T-2FFG1158C is available at Aetrix Electronics and suitable for radar signal processing, high-speed wired communications, and medical imaging backend systems requiring stable component supply and long-term industrial availability.

Supply support for XC7VX485T-2FFG1158C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency.

The Virtex-7 family was engineered for high-bandwidth, low-latency signal processing in defense, aerospace, and telecom infrastructure where deterministic timing and transceiver integration are critical.

FAQ

What is the maximum supported transceiver data rate for XC7VX485T-2FFG1158C?

The XC7VX485T-2FFG1158C supports GTZ transceivers rated up to 13.1 Gb/s per lane. This enables compliance with 10GBASE-R, CPRI Option 3, and JESD204B subclass 1 protocols. Operation at this rate requires proper PCB stackup, controlled impedance routing, and reference clock jitter below 500 fs RMS. The XC7VX485T-2FFG1158C datasheet specifies AC characteristics under -2 speed grade conditions at 100°C junction temperature.

Does XC7VX485T-2FFG1158C include hardened PCIe Gen3 IP?

Yes, the XC7VX485T-2FFG1158C integrates a hardened PCIe Gen3 x8 endpoint/root complex controller. This IP block handles link training, transaction layer packet handling, and power management states without consuming fabric resources. The XC7VX485T-2FFG1158C supports both ECN-compliant and legacy PCIe configurations, and its PHY layer complies with PCI-SIG specifications for Gen3 electrical signaling.

What configuration modes does XC7VX485T-2FFG1158C support?

The XC7VX485T-2FFG1158C supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is most common for single-bitstream field updates, while JTAG enables boundary-scan testing and partial reconfiguration debugging. The XC7VX485T-2FFG1158C also supports dual-boot with fallback bitstream storage in external flash.

Is XC7VX485T-2FFG1158C qualified for extended temperature operation?

No, the XC7VX485T-2FFG1158C is specified for commercial temperature range (0°C to 85°C ambient) and industrial temperature range (-40°C to 100°C junction). The "C" suffix denotes commercial grade, meaning it is not screened or tested for extended temperature operation beyond these limits. For harsh-environment deployment, the XC7VX485T-2FFG1158I variant (industrial grade) is recommended instead of the XC7VX485T-2FFG1158C.

Can XC7VX485T-2FFG1158C perform partial reconfiguration?

Yes, the XC7VX485T-2FFG1158C supports dynamic partial reconfiguration (PR) through its ICAP interface and frame-based bitstream loading. This allows runtime swapping of logic modules-such as modulation schemes or filter coefficients-without resetting the entire device. PR implementation requires Vivado Design Suite 2018.3 or later and adherence to placement constraints defined in UG909. The XC7VX485T-2FFG1158C maintains all non-reconfigured logic and I/O states during the process.

XC7VX485T-2FFG1158C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-7 XT
Package/Case:
1156-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
37950
Number of Logic Elements/Cells:
485760
Total RAM Bits:
37969920
Number of I/O:
350
Number of Gates:
-
Voltage - Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1158-FCBGA (35x35)

XC7VX485T-2FFG1158C FAQ

1.How can I place an order for XC7VX485T-2FFG1158C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7VX485T-2FFG1158C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7VX485T-2FFG1158C reliable?

The price and inventory of XC7VX485T-2FFG1158C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX485T-2FFG1158C is usually 5 days.

3.What payment methods are accepted for XC7VX485T-2FFG1158C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX485T-2FFG1158C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7VX485T-2FFG1158C?

XC7VX485T-2FFG1158C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7VX485T-2FFG1158C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7VX485T-2FFG1158C?

For technical support, including XC7VX485T-2FFG1158C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX485T-2FFG1158C requirements.

6.How does Aetrix verify that XC7VX485T-2FFG1158C is sourced from the original manufacturer or authorized distributors?

All XC7VX485T-2FFG1158C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX485T-2FFG1158C meets industry standards.

7.What is the process for return or replacement of XC7VX485T-2FFG1158C?

All XC7VX485T-2FFG1158C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX485T-2FFG1158C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7VX485T-2FFG1158C part is unused and in its original packaging.

Return procedure for XC7VX485T-2FFG1158C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7VX485T-2FFG1158C Tags

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