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AMD XC7VX485T-2FFG1158I
- Part No.:
- XC7VX485T-2FFG1158I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX485T-2FFG1158I.pdf
- Description:
- IC FPGA 350 I/O 1158FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,241
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Product details
Overview
XC7VX485T-2FFG1158I from AMD is a high-performance 28 nm Virtex-7 FPGA with 485,760 logic cells, 2,825 DSP slices, and 36.4 Mb of block RAM. It features 1158-pin flip-chip BGA packaging, supports transceiver data rates up to 13.1 Gb/s, and targets high-speed serial interface and signal processing applications in radar and wired communications.
For engineers reviewing the XC7VX485T-2FFG1158I datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver lane count (36 GTs), I/O voltage support (1.2 V to 1.8 V), thermal design power (39.5 W), and -2 speed grade timing performance.
Technical Context
The XC7VX485T-2FFG1158I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 multi-gigabit transceivers (GTs), and integrated PCI Express® Gen3 x8 endpoint capability. It supports DDR3 memory interfaces up to 1,866 Mb/s and includes hardened IP for Ethernet MAC and 10 Gigabit Ethernet.
Configuration occurs via JTAG or SelectMAP interface, with bitstream encryption and SEU mitigation features enabled. The device operates across industrial temperature range (–40°C to +100°C) and requires dedicated configuration memory and power sequencing per UG470.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 485,760 - determines maximum combinational/sequential logic capacity for complex digital systems |
| DSP Slices | 2,825 - enables parallel multiply-accumulate operations for real-time signal processing |
| Block RAM | 36.4 Mb - supports large on-chip data buffering and FIFO implementation without external memory |
| Transceivers | 36 GTs @ 13.1 Gb/s - provides native SerDes lanes for CPRI, JESD204B, and 10GbE protocols |
| I/O Standards | LVCMOS, SSTL, HSTL, LVDS - ensures interoperability with diverse memory and interface ICs |
| Speed Grade | -2 - guarantees timing closure at worst-case voltage/temperature corners for industrial operation |
| TDP | 39.5 W - defines thermal solution requirements for sustained full-load operation |
Pinout & Package
XC7VX485T-2FFG1158I uses a 1158-pin flip-chip fine-pitch BGA (FFG) package with 35 × 35 mm body size and 1.0 mm ball pitch. Thermal and power delivery are optimized via dedicated VCCINT/VCCAUX/VCCO banks and thermal balls under the die.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M23 | VCCINT | Core logic supply (1.0 V); must be filtered and sequenced before configuration |
| P24 | VCCAUX | Auxiliary supply (1.8 V); powers configuration logic, clocking, and transceiver analog circuitry |
| R22 | VCCO_0 | I/O bank 0 supply (1.2–1.8 V); sets output swing and input threshold for associated pins |
| T20 | INIT_B | Open-drain status signal; goes high after successful configuration or low on CRC error |
| Y19 | CLK_IN1_M2C | Dedicated single-ended clock input for MMCM clock management; routed to clock-capable I/O |
| AB17 | GTGREFCLK0 | Reference clock input for transceiver quad GT0; required for 13.1 Gb/s operation |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint | Hardened root port logic eliminates soft IP resource usage and guarantees protocol compliance |
| DDR3 Memory Controller | Integrated PHY supporting 1,866 Mb/s with calibration and training sequences built into silicon |
| SEU Mitigation | Automatic scrubbing and parity protection for configuration memory reduce single-event upset risk in radiation-prone environments |
| Bitstream Encryption | AES-256 decryption prevents unauthorized cloning or reverse engineering of implemented logic |
| Multi-Gigabit Transceivers | 36 GTs with programmable equalization and pre-emphasis enable reliable links over backplanes and cables |
Applications
| Radar Signal Processing | High-Speed Wired Communications |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: XC7VX485T-2FFG1158I serves as the primary signal processing engine, hosting custom FFT, CFAR, and STAP algorithms with deterministic latency. Use Value: 2,825 DSP slices and 36.4 Mb block RAM enable concurrent multi-channel processing without off-chip memory bottlenecks. | Use Scenario: Line card implementation in 10G/40G Ethernet switches and optical transport equipment. IC Role / Device Role / Timing Role: XC7VX485T-2FFG1158I acts as a protocol bridge and packet processor, interfacing with QSFP+ modules and switch fabric ASICs. Use Value: Native 13.1 Gb/s transceivers and PCIe Gen3 x8 support eliminate external retimers and reduce board-level signal integrity complexity. |
| Medical Imaging Data Acquisition | Test & Measurement Instrumentation |
Use Scenario: High-fidelity ultrasound beamformer and digital receiver in portable imaging platforms. IC Role / Device Role / Timing Role: XC7VX485T-2FFG1158I performs channel synchronization, digital down-conversion, and image reconstruction pipeline acceleration. Use Value: Low-jitter clocking infrastructure and deterministic I/O timing ensure sub-nanosecond channel alignment accuracy. | Use Scenario: Modular digitizer and arbitrary waveform generator in automated test equipment (ATE). IC Role / Device Role / Timing Role: XC7VX485T-2FFG1158I implements high-resolution ADC/DAC control logic, real-time triggering, and pattern generation state machines. Use Value: 1158 I/O pins with programmable slew rate and termination support precise impedance-matched analog interface timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1517I | UltraScale architecture; higher logic density (1,143K LC), lower TDP (32 W), but only 24 GTs at 12.5 Gb/s | Better suited for compute-intensive workloads with moderate serial I/O; less optimal for multi-lane 10GbE or CPRI aggregation | Select when algorithmic throughput outweighs transceiver count and power efficiency is critical |
| XC7VX690T-2FFG1927I | Larger package (1927-pin), 690K logic cells, 40 GTs, 42.5 Mb BRAM, higher TDP (48.2 W) | Required for designs exceeding XC7VX485T routing resources or needing >36 transceivers | Choose when XC7VX485T fails place-and-route due to logic or I/O constraints |
Compared with XC7VX485T-2FFG1158I, XCKU115-2FLVD1517I trades transceiver count for computational density and power efficiency, while XC7VX690T-2FFG1927I extends scalability at the cost of board space and thermal management complexity.
Availability
XC7VX485T-2FFG1158I is available at Aetrix Electronics and suitable for radar signal processing, high-speed wired communications, and medical imaging data acquisition requiring stable component supply and long-term industrial lifecycle support.
Supply support for XC7VX485T-2FFG1158I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.
The Virtex-7 family, including XC7VX485T-2FFG1158I, was engineered for high-bandwidth, low-latency system integration in aerospace, defense, and wired infrastructure where deterministic performance and reliability are mandatory.
FAQ
What is the operating temperature range for XC7VX485T-2FFG1158I?
The XC7VX485T-2FFG1158I is rated for industrial temperature operation from –40°C to +100°C ambient. This range applies to junction temperature under specified power dissipation and airflow conditions defined in DS182. Thermal design must account for 39.5 W typical TDP and package thermal resistance values in the FFG1158 mechanical drawing.
Does XC7VX485T-2FFG1158I support PCIe Gen3 x8 endpoint functionality?
Yes, XC7VX485T-2FFG1158I includes a hardened PCIe Gen3 x8 endpoint block compliant with PCI Express Base Specification Revision 3.0. It supports link training, power management states (L0s/L1), and AXI4 streaming interface, eliminating need for soft IP and reducing latency in host-attached accelerator designs.
How many transceivers does XC7VX485T-2FFG1158I have, and what protocols do they support?
XC7VX485T-2FFG1158I integrates 36 multi-gigabit transceivers (GTs), each capable of 13.1 Gb/s operation. These support JESD204B, CPRI, 10GBASE-R, and SATA 3.0 protocols natively, with programmable TX pre-emphasis and RX equalization for channel loss compensation.
What configuration modes are supported by XC7VX485T-2FFG1158I?
XC7VX485T-2FFG1158I supports master SPI, slave SPI, SelectMAP, and JTAG configuration modes. Configuration bitstream can be loaded from external flash via dedicated configuration interface pins, with optional AES-256 decryption enabled through eFUSE programming prior to first power-up.
Is XC7VX485T-2FFG1158I pin-compatible with other Virtex-7 devices in the same package?
No, XC7VX485T-2FFG1158I is not pin-compatible with other Virtex-7 FPGAs in the FFG1158 package. Pin functions are device-specific due to differing I/O bank counts, transceiver placement, and power pin allocations. Migration between variants requires PCB redesign and signal reassignment per UG475 pinout tables.
XC7VX485T-2FFG1158I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37950
- Number of Logic Elements/Cells:
- 485760
- Total RAM Bits:
- 37969920
- Number of I/O:
- 350
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1158-FCBGA (35x35)
XC7VX485T-2FFG1158I FAQ
1.How can I place an order for XC7VX485T-2FFG1158I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX485T-2FFG1158I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX485T-2FFG1158I reliable?
The price and inventory of XC7VX485T-2FFG1158I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX485T-2FFG1158I is usually 5 days.
3.What payment methods are accepted for XC7VX485T-2FFG1158I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX485T-2FFG1158I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX485T-2FFG1158I?
XC7VX485T-2FFG1158I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX485T-2FFG1158I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX485T-2FFG1158I?
For technical support, including XC7VX485T-2FFG1158I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX485T-2FFG1158I requirements.
6.How does Aetrix verify that XC7VX485T-2FFG1158I is sourced from the original manufacturer or authorized distributors?
All XC7VX485T-2FFG1158I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX485T-2FFG1158I meets industry standards.
7.What is the process for return or replacement of XC7VX485T-2FFG1158I?
All XC7VX485T-2FFG1158I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX485T-2FFG1158I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX485T-2FFG1158I part is unused and in its original packaging.
Return procedure for XC7VX485T-2FFG1158I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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