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AMD XC7VX485T-2FFG1761C
- Part No.:
- XC7VX485T-2FFG1761C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7VX485T-2FFG1761C.pdf
- Description:
- IC FPGA 700 I/O 1761FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,956
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Product details
Overview
XC7VX485T-2FFG1761C from AMD is a high-performance 28 nm Virtex-7 FPGA with 485,760 logic cells, 3,600 DSP slices, and 48.8 Mb of block RAM. It features 1761-pin flip-chip BGA packaging, supports transceiver data rates up to 13.1 Gb/s, and targets high-speed serial interface and signal processing applications in radar and wired communications.
For engineers reviewing the XC7VX485T-2FFG1761C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count (36 GTs), I/O voltage support (1.2–1.8 V), configuration interface (SPIx4/BPI), and thermal design power (49.5 W).
Technical Context
The XC7VX485T-2FFG1761C implements a 28 nm HKMG process-based architecture with integrated multi-gigabit transceivers (GTs) supporting PCIe Gen3, SRIO Gen2, and 10G Ethernet protocols. Its CLB structure includes six-input LUTs with dual flip-flops per slice, and it integrates hardened IP blocks including PCIe Gen3 x8 endpoint/root complex and 10/100/1000 Mbps Ethernet MAC.
Configuration is performed via Master SPI or Slave SelectMAP modes using external flash or processor control. The device supports partial reconfiguration and JTAG boundary-scan testing per IEEE 1149.1, with dedicated configuration pins (INIT_B, PROGRAM_B, CCLK, DIN) routed to dedicated package balls.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 485,760 - determines maximum combinational and sequential logic capacity for RTL implementation |
| DSP Slices | 3,600 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| Block RAM | 48.8 Mb - provides on-chip memory for buffering, FIFOs, and coefficient storage |
| Transceivers | 36 GTs @ 13.1 Gb/s - supports 36 independent high-speed serial lanes for multi-protocol interfaces |
| I/O Standards | LVCMOS, SSTL, HSTL, LVDS, TMDS - enables direct interfacing with DDR3/DDR4, video, and high-speed ADC/DAC |
| Configuration Interface | Master SPI x4 / Slave SelectMAP - defines boot source flexibility and programming bandwidth |
| Thermal Design Power | 49.5 W - sets minimum heatsink and airflow requirements for stable operation |
Pinout & Package
XC7VX485T-2FFG1761C uses a 1761-ball flip-chip BGA (FFG) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation via internal thermal slug and solder ball array.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MRCC_0_N / MRCC_0_P | Main Reference Clock Input Pair | Dedicated differential input for primary system clock; supports 10–800 MHz range |
| MGTAVCC / MGTVCCAUX | Transceiver Analog/Auxiliary Supply | Separate 1.0 V analog and 1.8 V auxiliary supplies required for GT stability |
| CONFIG_IO[0:3] | Configuration Mode Selection | Defines boot mode (SPI/BPI/JTAG) at power-up; pulled via external resistors |
| INIT_B / PROGRAM_B | Configuration Status & Reset Control | Open-drain outputs indicating config status; active-low reset initiates reconfiguration |
| CCLK / DONE | Configuration Clock & Completion Signal | CCLK drives internal config shift register; DONE goes high when bitstream loading completes |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 Endpoint | Reduces RTL integration effort and timing closure risk for host-attached acceleration cards |
| Partial Reconfiguration Support | Enables dynamic function swapping without full device reboot-critical for mission-critical systems |
| Integrated 10/100/1000 Ethernet MAC | Eliminates need for external PHY/MAC IC in embedded network control applications |
| AXI4-Stream Interconnect Fabric | Provides low-latency, high-throughput data movement between IP cores without software overhead |
| UltraScale-compatible Bitstream | Allows migration path to newer families while preserving verified logic and timing constraints |
Applications
| Radar Signal Processing | High-Speed Wired Communications |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical DSP kernels; GTs interface with RF ADC/DAC over JESD204B. Use Value: 36 GT lanes enable simultaneous connection to multiple JESD204B converters, reducing interconnect complexity and latency. | Use Scenario: Line-card processing in 10G/40G optical transport equipment. IC Role / Device Role / Timing Role: Implements OTN framer, FEC, and packet classification logic; GTs handle SerDes for SFP+/QSFP+ modules. Use Value: Hardened PCIe Gen3 x8 allows direct CPU coherency via CXL-capable root complex, enabling low-overhead host offload. |
| Medical Imaging Backend | Test & Measurement Instrumentation |
Use Scenario: Raw data aggregation and real-time image reconstruction in MRI and CT scanners. IC Role / Device Role / Timing Role: Aggregates parallel ADC streams via LVDS I/O; runs iterative reconstruction algorithms in programmable logic. Use Value: 48.8 Mb block RAM supports on-chip storage of intermediate image matrices, avoiding external DRAM bottlenecks. | Use Scenario: High-resolution digital oscilloscope front-end with deep memory capture. IC Role / Device Role / Timing Role: Controls sampling ASICs, manages 1+ GS/s waveform buffer, and performs real-time FFT analysis. Use Value: 3,600 DSP slices deliver >100 GOPS peak throughput for live spectral analysis without frame drop. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FL1517I | UltraScale+ architecture; higher logic density (1,024K LC), lower power per GT, no native PCIe Gen3 hard IP | Preferred for new designs requiring AI inference acceleration or higher SerDes count (64 GTs) | Choose XCVU13P-2FL1517I if migrating to 16 nm node and requiring higher DSP efficiency |
| XC7VX690T-2FFG1927I | Larger variant in same Virtex-7 family; 690K LC, 48 GTs, 1927-ball FFG package, higher TDP (62.3 W) | Suitable where additional logic resources or GT lanes are needed beyond XC7VX485T-2FFG1761C capacity | Choose XC7VX690T-2FFG1927I only when design requires >485K LC or >36 GTs |
Compared with XC7VX485T-2FFG1761C, the XCVU13P-2FL1517I offers better power efficiency and scalability but requires RTL and board-level redesign, while the XC7VX690T-2FFG1927I provides direct family compatibility and incremental resource growth at the cost of larger footprint and thermal load.
Availability
XC7VX485T-2FFG1761C is available at Aetrix Electronics and suitable for radar signal processing, high-speed optical transport, and medical imaging backend systems requiring stable component supply and long-term industrial lifecycle support.
Supply support for XC7VX485T-2FFG1761C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt and heterogeneous integration.
The Virtex-7 family was engineered for high-bandwidth, low-latency signal processing and protocol acceleration in defense, aerospace, and wired infrastructure applications.
FAQ
What is the maximum supported transceiver data rate for XC7VX485T-2FFG1761C?
The XC7VX485T-2FFG1761C supports transceiver data rates up to 13.1 Gb/s per GT lane. This rating applies across all 36 GTs under standard operating conditions (junction temperature ≤ 100°C, VCCINT = 0.95 V). The device complies with IEEE 802.3ba for 10G/40G Ethernet and supports JESD204B subclass 1 at 12.5 Gbps.
Does XC7VX485T-2FFG1761C include hardened PCIe Gen3 IP?
Yes, XC7VX485T-2FFG1761C integrates a hardened PCIe Gen3 x8 endpoint/root complex block. This IP operates at 8 GT/s per lane, supports AXI4 streaming interfaces, and includes integrated DMA engines and MSI-X interrupt handling-no external PCIe switch or bridge IC is required for basic host attachment.
What configuration modes does XC7VX485T-2FFG1761C support?
XC7VX485T-2FFG1761C supports Master SPI x4, Slave SelectMAP, and JTAG configuration modes. Mode selection is determined by CONFIG_IO[3:0] pin states at power-on reset. Master SPI is most common for single-flash boot; SelectMAP enables processor-controlled partial reconfiguration.
Is XC7VX485T-2FFG1761C compatible with Vivado Design Suite 2022.1?
Yes, XC7VX485T-2FFG1761C is fully supported in Vivado Design Suite 2022.1 and later versions. Device files, IP integrator templates, and timing constraint wizards for this part are included in the installation. Legacy ISE tools do not support this device.
What is the I/O voltage range supported by XC7VX485T-2FFG1761C banks?
XC7VX485T-2FFG1761C supports I/O voltages from 1.2 V to 1.8 V across its HR and HP I/O banks. HR banks support 1.2–1.8 V LVCMOS/SSTL/HSTL standards; HP banks support 1.2–1.5 V for high-speed differential signaling including LVDS and TMDS. Bank-specific VCCO must be externally regulated.
XC7VX485T-2FFG1761C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37950
- Number of Logic Elements/Cells:
- 485760
- Total RAM Bits:
- 37969920
- Number of I/O:
- 700
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7VX485T-2FFG1761C FAQ
1.How can I place an order for XC7VX485T-2FFG1761C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX485T-2FFG1761C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX485T-2FFG1761C reliable?
The price and inventory of XC7VX485T-2FFG1761C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX485T-2FFG1761C is usually 5 days.
3.What payment methods are accepted for XC7VX485T-2FFG1761C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX485T-2FFG1761C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX485T-2FFG1761C?
XC7VX485T-2FFG1761C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX485T-2FFG1761C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX485T-2FFG1761C?
For technical support, including XC7VX485T-2FFG1761C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX485T-2FFG1761C requirements.
6.How does Aetrix verify that XC7VX485T-2FFG1761C is sourced from the original manufacturer or authorized distributors?
All XC7VX485T-2FFG1761C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX485T-2FFG1761C meets industry standards.
7.What is the process for return or replacement of XC7VX485T-2FFG1761C?
All XC7VX485T-2FFG1761C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX485T-2FFG1761C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX485T-2FFG1761C part is unused and in its original packaging.
Return procedure for XC7VX485T-2FFG1761C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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