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AMD XC7VX485T-2FFG1761I
- Part No.:
- XC7VX485T-2FFG1761I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7VX485T-2FFG1761I.pdf
- Description:
- IC FPGA 700 I/O 1761FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,899
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Product details
Overview
XC7VX485T-2FFG1761I from AMD is a high-performance 28 nm Virtex-7 FPGA with 485,760 logic cells, 2,825 DSP slices, and 34.8 Mb of block RAM. It supports transceiver line rates up to 13.1 Gb/s and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is used in high-bandwidth radar signal processing systems requiring deterministic latency and multi-gigabit serial I/O.
For engineers reviewing the XC7VX485T-2FFG1761I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver count (36 GTs), I/O bank voltage support (1.2–1.8 V), configuration interface (SPIx4/JTAG), and thermal design power (39.5 W typical).
Technical Context
The XC7VX485T-2FFG1761I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 multi-protocol GT transceivers supporting PCIe Gen3, SRIO v2, and CPRI, and integrated memory controllers for DDR3/DDR3L up to 1866 Mbps. It includes hardened IP for PCIe Gen3 x8 endpoint/root complex and 10/25/100G Ethernet MAC.
Configuration is performed via master SPI or JTAG, with dual-boot capability using fallback BPI flash. The device supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation in software-defined radio and LIDAR preprocessing pipelines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 485,760 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 2,825 - enables parallel multiply-accumulate operations for FIR filtering and beamforming |
| Block RAM | 34.8 Mb - supports large on-chip buffering for video frame storage or radar pulse compression |
| GT Transceivers | 36 × 13.1 Gb/s - provides multi-lane high-speed serial links for sensor fusion backplanes |
| I/O Pins | 700 - delivers high pin count for parallel ADC/DAC interfacing and board-level interconnect |
| TDP | 39.5 W typical - defines thermal management requirements for conduction-cooled enclosures |
| Speed Grade | -2 - guarantees timing closure at 13.1 Gb/s transceiver rates and 640 MHz system clock |
Pinout & Package
XC7VX485T-2FFG1761I is housed in a 1761-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation in sealed chassis applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot source (SPI/BPI/JTAG) and configuration mode during power-up |
| CCLK | Configuration Clock | Drives internal configuration logic; must be stable before INIT_B deassertion |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and release of I/O pins |
| INIT_B | Configuration Initialization | Active-low input that resets configuration controller and clears internal state |
| GTX/GTH RefClk | Transceiver Reference Clock | Provides low-jitter clock source for GT transceivers; requires external differential oscillator |
| VCCINT/VCCAUX/VCCO | Power Rails | Separate supplies for core (1.0V), auxiliary (1.8V), and I/O banks (1.2–1.8V) |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 Endpoint | Reduces RTL integration effort and ensures compliance with PCIe 3.0 electrical and protocol layers |
| AXI4-Stream Interface Support | Enables zero-copy data movement between fabric and IP blocks for real-time signal chain processing |
| Partial Reconfiguration Capability | Allows dynamic swapping of functional modules without full device reset, critical for adaptive waveform systems |
| Integrated DDR3/DDR3L Memory Controller | Supports 1866 Mbps operation with ECC and calibration, eliminating need for external PHY |
| 36 GT Transceivers (13.1 Gb/s) | Provides native support for CPRI, OBSAI, and JESD204B protocols in wireless infrastructure equipment |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based phased-array radar systems with 16+ RF channels. IC Role / Device Role / Timing Role: FPGA fabric executes beamforming, CFAR detection, and STAP algorithms; GT transceivers interface with ADCs at 5 GSPS aggregate rate. Use Value: Deterministic latency under 200 ns enables closed-loop tracking control; 34.8 Mb BRAM buffers 4 ms of raw IQ data per channel. | Use Scenario: Multi-channel oscilloscope front-end capturing transient events across 32 analog inputs at 1 GS/s. IC Role / Device Role / Timing Role: XC7VX485T-2FFG1761I synchronizes sampling clocks, performs on-the-fly FFT, and streams results via PCIe Gen3 x8 to host CPU. Use Value: 2,825 DSP slices enable 16k-point real-time FFT per channel; 700 I/O pins support parallel LVDS ADC bus routing. |
| Software-Defined Radio (SDR) | Industrial Machine Vision |
Use Scenario: Reconfigurable baseband processor for 5G NR FR1 small cell with dynamic TDD and massive MIMO precoding. IC Role / Device Role / Timing Role: Hosts LTE/5G PHY layer stack; GT transceivers connect to RFICs via JESD204B v1.1 at 12.5 Gbps. Use Value: Partial reconfiguration allows runtime switching between FDD/TDD modes; hardened PCIe Gen3 enables fronthaul transport over C-RAN. | Use Scenario: High-resolution inspection system analyzing PCB solder joints at 200 MP/s using 8K-line scan cameras. IC Role / Device Role / Timing Role: XC7VX485T-2FFG1761I ingests pixel streams via SLVS-EC, performs sub-pixel defect classification, and triggers pneumatic reject actuators. Use Value: 485,760 logic cells implement custom convolution kernels; 36 GTs carry camera link data at 10 Gbps per lane. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924I | UltraScale architecture, 1.4M logic cells, higher DSP density (5,520 slices), 25.8 Gb/s GT transceivers | Better suited for 400G Ethernet switch fabric and AI inference acceleration | Choose XCKU115 when >20 Gb/s serial bandwidth or >1M logic cells are required; XC7VX485T-2FFG1761I remains optimal for cost-sensitive radar subsystems |
| XCVU9P-2FLGA2104I | UltraScale+ architecture, 2.5M logic cells, 54 GTs, integrated HBM2 controller | Targeted at compute-intensive workloads like real-time video analytics and financial modeling | Select XC7VX485T-2FFG1761I for proven reliability in harsh-environment deployments where UltraScale+ qualification is not yet mandated |
Compared with XCKU115-2FLVD1924I and XCVU9P-2FLGA2104I, the XC7VX485T-2FFG1761I offers lower power consumption (39.5 W vs. 55+ W), mature radiation-tolerant design documentation, and established qualification for extended temperature operation - making it preferred for deployed defense and aerospace platforms requiring long-term supply stability.
Availability
XC7VX485T-2FFG1761I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and software-defined radio applications requiring stable component supply across extended product lifecycles.
Supply support for XC7VX485T-2FFG1761I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing solutions for data centers, AI, networking, and embedded systems.
The Virtex-7 family targets high-throughput, low-latency applications in defense electronics, scientific instrumentation, and wired/wireless communications infrastructure.
FAQ
What is the maximum supported DDR3 memory speed for XC7VX485T-2FFG1761I?
The XC7VX485T-2FFG1761I integrates a hardened DDR3/DDR3L memory controller supporting data rates up to 1866 Mbps. This is validated across all I/O banks configured for 1.5V operation and includes built-in write leveling, read leveling, and gate training for reliable high-speed memory interfacing in radar and test equipment designs.
Does XC7VX485T-2FFG1761I support partial reconfiguration?
Yes, the XC7VX485T-2FFG1761I fully supports partial reconfiguration through Vivado Design Suite. This capability enables dynamic module swapping in operational systems - for example, loading different beamforming coefficients or modulation schemes into designated reconfigurable partitions without resetting the entire device or disrupting active transceiver links.
What transceiver protocols are natively supported by XC7VX485T-2FFG1761I?
The XC7VX485T-2FFG1761I GT transceivers natively support PCIe Gen3, SRIO v2.1, CPRI, OBSAI, and JESD204B v1.1. Protocol compliance is achieved via hardened physical coding sublayer (PCS) and physical medium attachment (PMA) blocks, eliminating the need for soft logic implementation and reducing latency in wireless infrastructure and data converter interfacing.
What is the thermal design power (TDP) of XC7VX485T-2FFG1761I under typical operating conditions?
The XC7VX485T-2FFG1761I has a typical thermal design power of 39.5 W, measured under worst-case utilization of logic, DSP, and transceiver resources at industrial temperature. This value guides heatsink sizing and airflow requirements for conduction- or forced-air-cooled enclosures in avionics and ground radar installations.
Is XC7VX485T-2FFG1761I qualified for extended temperature operation?
Yes, the XC7VX485T-2FFG1761I is rated for industrial temperature range (-40°C to +100°C) and is widely deployed in extended-temperature environments including airborne radar pods and downhole oilfield tools. Its qualification includes temperature cycling, burn-in, and long-term reliability testing per MIL-STD-883 methods.
XC7VX485T-2FFG1761I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37950
- Number of Logic Elements/Cells:
- 485760
- Total RAM Bits:
- 37969920
- Number of I/O:
- 700
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7VX485T-2FFG1761I FAQ
1.How can I place an order for XC7VX485T-2FFG1761I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX485T-2FFG1761I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX485T-2FFG1761I reliable?
The price and inventory of XC7VX485T-2FFG1761I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX485T-2FFG1761I is usually 5 days.
3.What payment methods are accepted for XC7VX485T-2FFG1761I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX485T-2FFG1761I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX485T-2FFG1761I?
XC7VX485T-2FFG1761I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX485T-2FFG1761I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX485T-2FFG1761I?
For technical support, including XC7VX485T-2FFG1761I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX485T-2FFG1761I requirements.
6.How does Aetrix verify that XC7VX485T-2FFG1761I is sourced from the original manufacturer or authorized distributors?
All XC7VX485T-2FFG1761I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX485T-2FFG1761I meets industry standards.
7.What is the process for return or replacement of XC7VX485T-2FFG1761I?
All XC7VX485T-2FFG1761I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX485T-2FFG1761I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX485T-2FFG1761I part is unused and in its original packaging.
Return procedure for XC7VX485T-2FFG1761I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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