AMD XC7VX485T-2FFG1927I
- Part No.:
- XC7VX485T-2FFG1927I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX485T-2FFG1927I.pdf
- Description:
- IC FPGA 600 I/O 1927FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7VX485T-2FFG1927I from AMD is a high-performance 28 nm Virtex-7 FPGA with 485,760 logic cells, 2,880 DSP slices, and 36.9 Mb of block RAM. It features 1927-pin flip-chip BGA packaging, supports transceiver line rates up to 13.1 Gb/s, and targets high-speed serial interface and signal processing applications in radar and wired communications.
For engineers reviewing the XC7VX485T-2FFG1927I datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver voltage compliance (1.0V core / 1.8V I/O), thermal design margin for industrial temperature operation (–40°C to +100°C), and configuration interface support (JTAG, SelectMAP, SPI).
Technical Context
The XC7VX485T-2FFG1927I implements a 28 nm HKMG process-based architecture with integrated PCIe Gen3 x8 endpoint capability, 24 transceiver quads supporting 600–13,125 Mb/s rates, and dual-register LUTs enabling 6-input function mapping. It includes hardened memory controllers for DDR3/DDR3L up to 1866 Mbps and AXI-4 compliant interconnect infrastructure.
Configuration occurs via dedicated CCLK and DINS pins using 32-bit parallel (SelectMAP) or quad-SPI modes; startup sequence supports multi-boot with fallback and secure bitstream encryption using AES-256 and HMAC-SHA-256 keys.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 485,760 - determines maximum combinational and sequential logic capacity for complex state machines and data paths |
| DSP Slices | 2,880 - enables concurrent execution of 2880 multiply-accumulate operations per clock cycle |
| Block RAM | 36.9 Mb - supports large on-chip buffering for video frame stores, packet queues, or FFT coefficient tables |
| Transceiver Speed | 13.1 Gb/s - meets line-rate requirements for 10G Ethernet KR, CPRI Option 7, and Interlaken II interfaces |
| I/O Standards | LVDS, LVCMOS, SSTL, HSTL - allows direct interfacing with ADCs, DACs, memory, and FMC mezzanine connectors |
| Operating Temp | –40°C to +100°C - qualified for extended industrial environments without derating |
| Configuration Mode | SelectMAP, SPIx4, JTAG - provides flexibility for field updates, secure boot, and boundary-scan test access |
Pinout & Package
XC7VX485T-2FFG1927I uses a 1927-ball flip-chip BGA package (FFG1927) with 1.0 mm ball pitch, 42.5 mm × 42.5 mm body size, and thermal lid for enhanced heat dissipation in high-power configurations.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 1.0V to FPGA fabric and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 1.8V to configuration logic, transceivers, and clock management tiles |
| VCCO | I/O bank power | Configurable per-bank voltage (1.2V–1.8V) enabling mixed-voltage interface support |
| MGTAVCC | Transceiver analog supply | Delivers clean 1.0V to high-speed serial transceiver analog circuitry |
| CCLK | Configuration clock | Drives synchronous bitstream loading during master SPI or SelectMAP mode startup |
| INIT_B | Configuration status | Active-low open-drain output indicating configuration completion or error condition |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint | Hard IP block eliminates soft-core resource consumption and guarantees deterministic latency for host communication |
| DDR3/DDR3L Memory Controller | Integrated controller supports 1866 Mbps data rate with ECC and address/command bus termination calibration |
| AES-256 Bitstream Encryption | Prevents unauthorized cloning and reverse engineering by encrypting configuration memory contents |
| Multi-Boot with Fallback | Enables safe field upgrades by storing primary and backup bitstreams in external flash with automatic failover |
| AXI-4 Interconnect Fabric | Provides standardized, pipelined, out-of-order transaction support across processor, memory, and peripheral subsystems |
Applications
| Radar Signal Processing | High-Speed Wired Communications |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and beamforming in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes adaptive filtering, FFTs, and digital down-conversion; transceivers interface with high-speed ADC/DACs. Use Value: 2,880 DSP slices enable simultaneous 1024-point FFTs at 100 MHz clock, meeting real-time latency constraints. | Use Scenario: Line-card implementation in 10G/40G Ethernet switches and OTN transport equipment. IC Role / Device Role / Timing Role: Handles SerDes aggregation, MAC-layer bridging, and traffic shaping using hardened PCIe and Ethernet MAC blocks. Use Value: 13.1 Gb/s transceivers support 10GBASE-KR and 40GBASE-KR4 protocols without external retimers. |
| Medical Imaging Backend | Test & Measurement Instrumentation |
Use Scenario: Digital backend for ultrasound beamformers requiring channel count scalability and low-latency image reconstruction. IC Role / Device Role / Timing Role: Configurable logic processes echo data streams; DDR3 controller buffers raw RF samples prior to GPU offload. Use Value: 36.9 Mb block RAM accommodates full-frame 256-channel RF data at 40 MSPS for ≥20 ms depth buffer. | Use Scenario: High-resolution oscilloscope digitizer modules capturing >1 GS/s with deep memory and real-time analysis. IC Role / Device Role / Timing Role: Manages high-speed ADC interface, triggers, pattern generation, and PCIe Gen3 x8 data streaming to host PC. Use Value: PCIe Gen3 x8 endpoint delivers sustained 7.8 GB/s throughput, eliminating USB or SATA bottlenecks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | UltraScale architecture, 568K logic cells, 15.1 Gb/s transceivers, no native PCIe Gen3 hard IP | Better power efficiency at 20 GHz+ DSP throughput; lacks integrated PCIe endpoint | Preferred when migrating to 20nm node and PCIe is implemented via soft IP or external switch |
| XC7K410T-2FFG901I | Virtex-7 family, 407K logic cells, 12.5 Gb/s transceivers, same 28 nm process and toolchain compatibility | Lower I/O count (500 vs. 700), reduced block RAM (27.1 Mb), lower transceiver count (16 vs. 24 quads) | Cost-optimized alternative when full XC7VX485T resources are not required |
Compared with XC7VX485T-2FFG1927I, XCKU060-2FFVA1156I offers higher transceiver speed and lower static power but requires external PCIe switching; XC7K410T-2FFG901I shares identical toolchain and thermal profile but trades logic density and memory for lower BOM cost.
Availability
XC7VX485T-2FFG1927I is available at Aetrix Electronics and suitable for radar signal processing, high-speed wired communications, and medical imaging backend applications requiring stable component supply and long-term industrial temperature support.
Supply support for XC7VX485T-2FFG1927I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA solutions for data center, aerospace, and industrial markets.
The Virtex-7 family was designed for bandwidth-intensive, low-latency applications including wired infrastructure, defense radar, and scientific instrumentation where deterministic timing and hardened I/O are critical.
FAQ
What is the maximum supported DDR3 data rate for XC7VX485T-2FFG1927I?
The XC7VX485T-2FFG1927I integrates a hardened DDR3/DDR3L memory controller supporting up to 1866 Mbps data rate with on-die termination calibration and ECC support. This capability is verified in UG473 and applies directly to the XC7VX485T-2FFG1927I device under industrial temperature conditions with appropriate board layout and termination.
Does XC7VX485T-2FFG1927I include a hard PCIe Gen3 endpoint?
Yes, XC7VX485T-2FFG1927I contains a dedicated hard PCIe Gen3 x8 endpoint block compliant with PCI Express Base Specification 3.0. This eliminates the need for soft-core implementations and ensures guaranteed timing closure and low-latency host communication without consuming programmable logic resources.
What configuration modes are supported by XC7VX485T-2FFG1927I?
XC7VX485T-2FFG1927I supports three primary configuration modes: Master SPI (quad-capable), SelectMAP (32-bit parallel), and JTAG. All modes are fully functional across the –40°C to +100°C operating range and are documented in UG470 with pin assignments specific to the FFG1927 package.
What is the transceiver line rate range for XC7VX485T-2FFG1927I?
The XC7VX485T-2FFG1927I transceivers operate from 600 Mb/s to 13.1 Gb/s per lane, covering standards including 10GBASE-KR, CPRI Option 7, and Interlaken II. The 13.1 Gb/s maximum is achievable in all 24 transceiver quads under industrial temperature conditions with proper reference clock jitter compliance.
Is XC7VX485T-2FFG1927I qualified for extended temperature operation?
Yes, XC7VX485T-2FFG1927I is rated for industrial temperature operation from –40°C to +100°C (case temperature). This qualification is confirmed in the device's ordering information and thermal characterization reports, and applies to all I/O banks, transceivers, and fabric logic under specified voltage and airflow conditions.
XC7VX485T-2FFG1927I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37950
- Number of Logic Elements/Cells:
- 485760
- Total RAM Bits:
- 37969920
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1927-FCBGA (45x45)
XC7VX485T-2FFG1927I FAQ
1.How can I place an order for XC7VX485T-2FFG1927I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX485T-2FFG1927I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX485T-2FFG1927I reliable?
The price and inventory of XC7VX485T-2FFG1927I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX485T-2FFG1927I is usually 5 days.
3.What payment methods are accepted for XC7VX485T-2FFG1927I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX485T-2FFG1927I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX485T-2FFG1927I?
XC7VX485T-2FFG1927I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX485T-2FFG1927I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX485T-2FFG1927I?
For technical support, including XC7VX485T-2FFG1927I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX485T-2FFG1927I requirements.
6.How does Aetrix verify that XC7VX485T-2FFG1927I is sourced from the original manufacturer or authorized distributors?
All XC7VX485T-2FFG1927I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX485T-2FFG1927I meets industry standards.
7.What is the process for return or replacement of XC7VX485T-2FFG1927I?
All XC7VX485T-2FFG1927I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX485T-2FFG1927I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX485T-2FFG1927I part is unused and in its original packaging.
Return procedure for XC7VX485T-2FFG1927I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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