AMD XC7VX485T-2FFG1930C

Overview

XC7VX485T-2FFG1930C from AMD is a high-performance 28 nm Virtex-7 FPGA with 485,760 logic cells, 2,825 DSP slices, and 44.8 GB/s transceiver bandwidth (up to 13.1 Gb/s per GT). It integrates PCIe Gen3 x8 endpoint/root complex capability and is used in high-speed data acquisition systems requiring deterministic latency and multi-gigabit serial I/O.

For engineers reviewing the XC7VX485T-2FFG1930C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory depth, I/O bank voltage support (1.2 V to 3.3 V), and thermal design power (29.5 W typical at 85°C junction).

Technical Context

The XC7VX485T-2FFG1930C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), block RAM (36 Mb total), UltraScale-compatible SelectIO™ technology, and integrated 13.1 Gb/s GTY transceivers. It supports JTAG, ICAP, and PCI Express configuration interfaces.

This device belongs to the Virtex-7 family's "T" grade (transceiver-optimized) and features hardened IP including PCIe Gen3, 10/25/100G Ethernet MAC, and AXI interconnects. Its -2 speed grade guarantees timing closure at 640 MHz for CLB logic and 1.6 GHz for I/O.

Key Specifications

Pinout & Package

XC7VX485T-2FFG1930C is housed in a 1930-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm pitch, 35 × 35 mm body size, and thermal lid. The package supports 500 user I/Os across 24 selectable I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC7VX485T-2FFG1930C, the XCVU9P offers higher bandwidth and efficiency for next-gen protocols, while the XC7VX690T provides immediate resource scaling within the same footprint and thermal envelope.

Availability

XC7VX485T-2FFG1930C is available at Aetrix Electronics and suitable for radar signal processing, 5G wireless infrastructure, and medical imaging backend systems requiring stable component supply and long-term industrial lifecycle support.

Supply support for XC7VX485T-2FFG1930C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA technologies for data center, aerospace, and industrial applications.

The Virtex-7 family was designed for demanding high-bandwidth, low-latency applications such as wired/wireless infrastructure, defense radar, and scientific instrumentation where deterministic timing and hardened IP are essential.

FAQ

What is the maximum supported transceiver data rate for XC7VX485T-2FFG1930C?

The XC7VX485T-2FFG1930C supports a maximum transceiver line rate of 13.1 Gb/s using its GTY transceivers. This enables compliance with JESD204B v2.0, 10G-KR, and CPRI standards. Operation at this rate requires AC-coupled differential routing with 100 Ω impedance and strict power supply noise limits on MGTAVCC/MGTAVTT rails.

Does XC7VX485T-2FFG1930C include hardened PCIe Gen3 IP?

Yes, XC7VX485T-2FFG1930C integrates a hardened PCIe Gen3 x8 endpoint/root complex block. This eliminates the need for soft-core implementations and guarantees sub-500 ns transaction latency. The IP supports both AXI4-Stream and AXI4-Lite interfaces for seamless integration with processor subsystems or DMA engines.

What I/O standards are supported by XC7VX485T-2FFG1930C?

XC7VX485T-2FFG1930C supports LVDS, SSTL-18/25, HSTL-I/II, TMDS, and MIPI D-PHY across its 24 I/O banks. Each bank operates independently with dedicated VCCO and reference voltage pins. HR banks support 1.2–3.3 V signaling; HP banks support 1.2–1.8 V only.

Is XC7VX485T-2FFG1930C pin-compatible with other Virtex-7 FPGAs in FFG1930 packaging?

XC7VX485T-2FFG1930C shares the same FFG1930 package footprint and ball map with XC7VX690T-2FFG1930C, enabling mechanical and thermal compatibility. However, I/O bank assignments and GTY transceiver locations differ between variants, so PCB layout reuse requires verification of signal integrity and power delivery per design.

What is the typical thermal design power (TDP) of XC7VX485T-2FFG1930C?

The typical thermal design power (TDP) of XC7VX485T-2FFG1930C is 29.5 W at 85°C junction temperature under worst-case operating conditions. This value assumes full utilization of logic, DSP, and transceivers. Thermal solution sizing must account for ambient temperature, airflow, and board copper layers per Xilinx UG475 guidelines.