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AMD XC7VX485T-3FFG1157E
- Part No.:
- XC7VX485T-3FFG1157E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX485T-3FFG1157E.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,650
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Product details
Overview
XC7VX485T-3FFG1157E from AMD is a high-performance 28 nm FPGA with 485,760 logic cells, 2,850 DSP slices, and 36.9 Mb of block RAM, configured in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package for high-speed serial interface and compute-accelerated embedded systems.
For engineers reviewing the XC7VX485T-3FFG1157E datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (500 user I/Os), transceiver line rate (13.1 Gb/s), speed grade (-3), and thermal design power (35 W typical).
Technical Context
The XC7VX485T-3FFG1157E implements a 28 nm HKMG process-based architecture with integrated PCIe Gen3 x8 endpoint, 10/25G Ethernet MAC, and AXI4 interconnect support. It includes hardened IP blocks for memory controllers (DDR3/DDR4/LPDDR3), clock management (MMCM/PLL), and configuration security (AES-256, HMAC-SHA-256).
It supports JTAG, SelectMAP, and SPI configuration modes, and features dual-boot capability with fallback recovery. Configuration bitstream encryption and tamper detection are enabled via on-chip eFUSE and battery-backed SRAM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 485,760 - total configurable logic resources for complex state machines and datapath logic |
| DSP Slices | 2,850 - fixed-point and floating-point arithmetic units supporting 25 x 18-bit multiply-accumulate |
| Block RAM | 36.9 Mb - distributed and block memory for FIFOs, buffers, and lookup tables |
| User I/O Pins | 500 - LVDS, SSTL, HSTL, and TMDS-capable pins with programmable drive strength and slew rate |
| Transceiver Line Rate | 13.1 Gb/s - supports 10G-KR, 25G Ethernet, CPRI, and JESD204B protocols |
| Speed Grade | -3 - highest commercial speed bin, enabling timing closure at maximum operating frequencies |
| TDP | 35 W typical - defines thermal envelope for heatsink and airflow design in conduction-cooled enclosures |
Pinout & Package
XC7VX485T-3FFG1157E is housed in a 1157-ball Flip-Chip Fine-Pitch BGA (FFG) package with 1.0 mm ball pitch, 35 mm × 35 mm body size, and thermal lid for enhanced heat dissipation in high-power applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | 1.0 V ±3% input for FPGA fabric and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary supply rail | 1.8 V ±3% for configuration logic, transceivers, and clock management circuitry |
| VCCO | I/O bank supply | Programmable per-bank (1.2–3.3 V) to support mixed-voltage interfaces and level translation |
| MGTAVCC | Transceiver analog supply | 1.0 V ±3% dedicated rail for high-speed serial PHY operation and jitter performance |
| CONFIG_IO | Configuration I/O bank | Bank 0 pins used for JTAG, SPI, or SelectMAP configuration; must be pulled to defined states at power-up |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint | Hardened root port logic enabling direct host CPU attachment without external bridge IC |
| 25G Ethernet MAC | Integrated media access controller supporting IEEE 802.3by with no external PHY required for backplane links |
| AXI4 Interconnect | Full-duplex, out-of-order transaction support for multi-master SoC subsystem integration |
| Secure Boot | AES-256 encrypted bitstream loading with HMAC-SHA-256 authentication prevents unauthorized firmware execution |
| Dynamic Reconfiguration | Partial reconfiguration capability allows runtime logic updates without system reset or service interruption |
Applications
| Radar Signal Processing | 5G Baseband Unit |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT, CFAR, and STAP algorithms; transceivers interface with ADC/DACs at 2.4 GSPS. Use Value: 2,850 DSP slices enable parallel filter banks; 13.1 Gb/s transceivers support JESD204B Class 2 links to RF front-end ICs. | Use Scenario: Layer 1 physical layer acceleration in massive MIMO 5G gNodeB base stations. IC Role / Device Role / Timing Role: Implements channel coding (LDPC/Polar), OFDM modulation, and precoding in real time; interfaces with 25G Ethernet fronthaul. Use Value: Hardened 25G Ethernet MAC reduces latency vs. soft IP; AXI4 interconnect enables seamless DMA to ARM-based control processors. |
| High-Frequency Trading Engine | Medical Imaging Accelerator |
Use Scenario: Ultra-low-latency order matching and market data parsing in co-located trading systems. IC Role / Device Role / Timing Role: Configurable pipeline processes FIX/ITCH protocol decoding, risk checks, and order routing in <500 ns. Use Value: -3 speed grade ensures sub-ns timing margins; 500 user I/Os support multiple 10G SFP+ and PCIe Gen3 x8 interfaces simultaneously. | Use Scenario: Real-time reconstruction of CT and MRI image volumes using iterative algorithms. IC Role / Device Role / Timing Role: Accelerates back-projection and denoising kernels; DDR4 memory controller manages >128 GB/s memory bandwidth. Use Value: 36.9 Mb block RAM buffers projection data; hardened PCIe Gen3 x8 enables direct GPU co-processing over NVLink-compatible topology. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104E | UltraScale architecture; higher logic density (2,586K LC), lower transceiver max rate (16.3 Gb/s), different package (2104-pin FLGA) | Better suited for AI inference acceleration requiring >2M LUTs; less optimized for legacy 10G/25G SerDes protocols | Select when migrating to newer architecture with larger memory footprint and higher DSP throughput |
| XC7VX690T-3FFG1927E | Same 7-series family; larger logic capacity (690K LC), more I/O (550), higher TDP (42 W), larger FFG1927 package | Preferred for designs needing additional I/O expansion or redundant logic partitions without changing toolchain | Choose for pin-compatible upgrade path within same Vivado toolflow and PCB stack-up constraints |
Compared with XC7VX485T-3FFG1157E, XCVU9P-2FLGA2104E offers greater scalability but requires new board layout and power delivery design, while XC7VX690T-3FFG1927E provides incremental capacity growth with identical speed grade and tool compatibility.
Availability
XC7VX485T-3FFG1157E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and high-frequency trading engines requiring stable component supply across extended product lifecycles.
Supply support for XC7VX485T-3FFG1157E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing, graphics, and visualization technologies for data center, client, and embedded markets.
The Virtex-7 family targets high-throughput, low-latency compute-intensive applications including wired/wireless infrastructure, defense electronics, and scientific instrumentation.
FAQ
What is the maximum supported transceiver line rate for XC7VX485T-3FFG1157E?
The XC7VX485T-3FFG1157E supports a maximum transceiver line rate of 13.1 Gb/s per lane. This enables compliance with 10GBASE-KR, 25GBASE-KR, CPRI Option 8, and JESD204B Class 2 standards. The transceiver architecture uses dedicated CDR circuits and adaptive equalization to maintain signal integrity across FR4 backplanes up to 30 inches.
Does XC7VX485T-3FFG1157E support PCIe Gen3 x8 endpoint functionality?
Yes, XC7VX485T-3FFG1157E includes a hardened PCIe Gen3 x8 endpoint block compliant with PCI Express Base Specification Revision 3.0. It supports both root port and endpoint configurations, with full link training, error reporting, and MSI-X interrupt handling. The block operates at 8 GT/s with automatic lane reversal and hot-plug detection.
What configuration modes are supported by XC7VX485T-3FFG1157E?
XC7VX485T-3FFG1157E supports JTAG, Master SPI, Slave SelectMAP, and BPI configuration modes. Dual-boot capability allows primary and fallback bitstreams stored in separate SPI flash sectors. Configuration security features include AES-256 decryption and HMAC-SHA-256 authentication, enforced during every boot cycle.
What is the thermal design power (TDP) of XC7VX485T-3FFG1157E under typical operating conditions?
The XC7VX485T-3FFG1157E has a typical thermal design power of 35 W, measured under worst-case utilization (full logic, DSP, and transceiver activity) at 85°C ambient and 1.0 V core voltage. This value guides heatsink sizing and airflow requirements for conduction- or forced-air-cooled enclosures in telecom and defense applications.
Is XC7VX485T-3FFG1157E compatible with Xilinx Vivado Design Suite?
Yes, XC7VX485T-3FFG1157E is fully supported by Xilinx Vivado Design Suite 2018.3 and later versions. Synthesis, implementation, and bitstream generation workflows are validated for this device, including timing analysis for -3 speed grade and transceiver wizard integration for 13.1 Gb/s lanes.
XC7VX485T-3FFG1157E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37950
- Number of Logic Elements/Cells:
- 485760
- Total RAM Bits:
- 37969920
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7VX485T-3FFG1157E FAQ
1.How can I place an order for XC7VX485T-3FFG1157E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX485T-3FFG1157E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX485T-3FFG1157E reliable?
The price and inventory of XC7VX485T-3FFG1157E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX485T-3FFG1157E is usually 5 days.
3.What payment methods are accepted for XC7VX485T-3FFG1157E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX485T-3FFG1157E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX485T-3FFG1157E?
XC7VX485T-3FFG1157E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX485T-3FFG1157E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX485T-3FFG1157E?
For technical support, including XC7VX485T-3FFG1157E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX485T-3FFG1157E requirements.
6.How does Aetrix verify that XC7VX485T-3FFG1157E is sourced from the original manufacturer or authorized distributors?
All XC7VX485T-3FFG1157E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX485T-3FFG1157E meets industry standards.
7.What is the process for return or replacement of XC7VX485T-3FFG1157E?
All XC7VX485T-3FFG1157E units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX485T-3FFG1157E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX485T-3FFG1157E part is unused and in its original packaging.
Return procedure for XC7VX485T-3FFG1157E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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