AMD XC7VX485T-3FFG1158E

Overview

XC7VX485T-3FFG1158E from AMD is a high-performance 28 nm FPGA with 485,760 logic cells, 2,850 DSP slices, and 36.9 Mb of block RAM, configured in a 1158-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) package for high-speed serial interface and compute-acceleration applications in radar signal processing.

For engineers reviewing the XC7VX485T-3FFG1158E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gb/s, and -3 speed grade timing performance under industrial temperature range.

Technical Context

This Virtex-7 device integrates SelectIO™ technology supporting single-ended and differential standards including LVDS, SSTL, HSTL, and TMDS, with programmable I/O drive strength and slew rate control. It features 72 multi-gigabit GTs organized as 36 GTY transceivers, each capable of 10.3125–13.1 Gb/s operation with built-in PRBS generation and error detection.

The XC7VX485T-3FFG1158E implements a hardened PCIe® Gen3 x8 endpoint block, supports DDR3/DDR3L memory interfaces up to 1866 Mbps, and includes dual 300 MHz ARM Cortex-A9 MPCore processors in the Zynq-7000 family - but this part is Virtex-7 only and excludes integrated processors.

Key Specifications

Pinout & Package

The XC7VX485T-3FFG1158E is housed in a 1158-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1158) package with 32 I/O banks, power/ground ball distribution optimized for low-noise operation, and thermal vias aligned to the die center.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC7VX485T-3FFG1158E, the XCVU13P-2FLGA2577E offers architectural advancement and bandwidth headroom at higher cost and redesign effort, whereas the XC7VX690T-3FFG1927E delivers direct capacity scaling within the same process and design ecosystem.

Availability

XC7VX485T-3FFG1158E is available at Aetrix Electronics and suitable for radar signal processing, 5G wireless infrastructure, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC7VX485T-3FFG1158E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded, and aerospace/defense markets.

The Virtex-7 family targets high-performance signal processing, high-speed connectivity, and compute-intensive applications where deterministic latency, transceiver bandwidth, and logic density are critical.

FAQ

What is the operating temperature range for the XC7VX485T-3FFG1158E?

The XC7VX485T-3FFG1158E is rated for industrial temperature operation from –40°C to +100°C case temperature. This rating applies specifically to the FFG1158 package variant and is validated per AMD's Virtex-7 thermal characterization report. The -3 speed grade ensures timing compliance across this full range without derating. Thermal management must follow AMD's recommended PCB copper pour and via placement guidelines for the 1158-ball footprint.

Does the XC7VX485T-3FFG1158E include integrated processors?

No, the XC7VX485T-3FFG1158E is a Virtex-7 FPGA and does not contain embedded ARM processors. It belongs to the Virtex-7 family, which provides programmable logic, DSP slices, and high-speed transceivers only. Unlike Zynq-7000 SoCs, the XC7VX485T-3FFG1158E requires an external processor or host controller for system management and software-defined functions.

Which transceiver protocol standards does the XC7VX485T-3FFG1158E support?

The XC7VX485T-3FFG1158E supports JESD204B subclass 1, CPRI, and 10GBASE-R via its 36 GTY transceivers. Each GTY channel operates from 10.3125 Gb/s to 13.1 Gb/s with built-in 8B/10B encoding, elastic buffers, and PRBS pattern generation. It does not support PCIe Gen4 or USB3.1, as those require GTM or later transceiver architectures found in UltraScale+ devices.

Can the XC7VX485T-3FFG1158E be configured via JTAG only?

The XC7VX485T-3FFG1158E supports JTAG configuration but requires additional configuration modes for production use. Primary methods include master SPI (using CCLK and D0 pins) and slave SelectMAP. JTAG is used for debugging, boundary scan, and fallback programming - not for high-volume configuration. Configuration bitstreams must be loaded into external flash memory (e.g., Micron MT25QL) and auto-loaded at power-up via SPI mode.

What is the maximum DDR3 memory interface speed supported by the XC7VX485T-3FFG1158E?

The XC7VX485T-3FFG1158E supports DDR3 and DDR3L memory interfaces up to 1866 Mbps data rate (933 MHz clock) using its MIG v4.2 IP core in Vivado. This speed is achievable with proper PCB layout, matched trace lengths, and termination resistors placed per AMD's Memory Interface Guidelines. The -3 speed grade ensures timing closure for write-leveling and read-deskew calibration at this rate across all industrial temperatures.