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AMD XC7VX485T-3FFG1927E
- Part No.:
- XC7VX485T-3FFG1927E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX485T-3FFG1927E.pdf
- Description:
- IC FPGA 600 I/O 1927FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,980
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Product details
Overview
XC7VX485T-3FFG1927E from AMD is a high-performance 28 nm Virtex-7 FPGA with 485,760 logic cells, 36.4 Mb of block RAM, and 2,800 DSP slices, configured in a 1927-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package for high-speed serial interface and compute-acceleration applications in radar signal processing.
For engineers reviewing the XC7VX485T-3FFG1927E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gb/s, and -3 speed grade timing performance under industrial temperature range.
Technical Context
The XC7VX485T-3FFG1927E implements a segmented architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices, and UltraScale-compatible SelectIO resources. It supports PCI Express Gen3 x8, 10/25/100G Ethernet MACs, and AXI4-Stream interfaces for high-throughput data movement.
Its transceiver bank includes 32 GTH transceivers operating at 2.488–13.1 Gb/s with built-in PRBS generators/checkers and gearbox logic. Configuration occurs via dual BPI or JTAG, with bitstream encryption and HMAC authentication enabled.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 485,760 - total available LUT-based programmable resources for custom digital logic implementation |
| Block RAM | 36.4 Mb - distributed memory capacity usable for FIFOs, buffers, or lookup tables |
| DSP Slices | 2,800 - fixed-point arithmetic units supporting multiply-accumulate at up to 450 MHz |
| GTH Transceivers | 32 × 13.1 Gb/s - high-speed serial lanes compliant with CPRI, JESD204B, and 100G KR4 |
| I/O Standards | LVCMOS, SSTL, HSTL, LVDS, TMDS - supports mixed-voltage board interfacing up to 3.3 V |
| Speed Grade | -3 - fastest timing bin for this device family, enabling highest clock frequencies in critical paths |
| Operating Temp | -40°C to +100°C - qualified for industrial temperature range operation without derating |
Pinout & Package
XC7VX485T-3FFG1927E is housed in a 1927-ball Flip-Chip Fine-Pitch BGA (FFG) package with 1.0 mm ball pitch, thermal lid, and standard JEDEC MO-271AC mechanical outline. Pin assignment follows AMD's Virtex-7 FFG1927 package drawing DS875.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M18 | VCCINT | Core supply input (1.0 V ±3%) powering CLBs, interconnect, and configuration logic |
| R15 | VCCAUX | 1.8 V auxiliary supply for configuration, clocking, and transceiver reference circuitry |
| T12 | VCCO_0 | I/O bank 0 output supply (1.2–3.3 V selectable) setting output voltage level |
| Y10 | MR | Master reset input - asynchronous active-low signal clearing configuration state |
| A14 | INIT_B | Open-drain status output indicating configuration completion or error condition |
| E16 | CLK_IN1_M2C | Dedicated single-ended clock input for MMCM clock management, routed to clock region M2C |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping in-system without full reconfiguration, reducing downtime in mission-critical systems |
| AXI4-Compliant Interconnect | Integrated interconnect fabric compatible with Xilinx/AMD IP cores for seamless integration with processor subsystems |
| Bitstream Encryption | HMAC-SHA-256 authentication and AES-256 decryption prevent unauthorized configuration and IP theft |
| Transceiver Gearboxing | Native 64:32, 64:66, and 64:128 data width conversion within GTH blocks, eliminating external logic for protocol alignment |
| UltraScale-Compatible IO | SelectIO supports source-synchronous DDR interfaces up to 1.6 Gb/s per pin with programmable input delay and output phase control |
Applications
| Radar Beamforming Subsystem | High-Speed Data Acquisition System |
|---|---|
Use Scenario: Real-time adaptive beam steering using phased array antenna with >1,000 channels. IC Role / Device Role / Timing Role: XC7VX485T-3FFG1927E serves as real-time digital beamformer, performing complex matrix multiplication and phase rotation on incoming RF samples. Use Value: 2,800 DSP slices enable simultaneous 128-channel beam calculation at 200 MSPS, meeting sub-microsecond latency requirements. | Use Scenario: Multi-channel oscilloscope capturing 16 analog inputs at 1 GS/s with deep memory buffering. IC Role / Device Role / Timing Role: XC7VX485T-3FFG1927E acts as acquisition controller and real-time trigger engine, managing ADC synchronization and pattern matching. Use Value: 36.4 Mb block RAM stores up to 128 MSamples across channels; GTH transceivers stream data to host at 10 Gb/s over PCIe Gen3 x8. |
| 5G Baseband Processing Unit | Avionics Sensor Fusion Module |
Use Scenario: Massive MIMO base station implementing 64×64 channel precoding and OFDM modulation. IC Role / Device Role / Timing Role: XC7VX485T-3FFG1927E executes Layer 1 PHY processing including FFT/iFFT, channel estimation, and LDPC decoding. Use Value: 485,760 logic cells accommodate parallelized 5G NR physical layer pipelines with deterministic <100 ns loopback latency. | Use Scenario: Integrated modular avionics unit fusing GPS, IMU, and air data sensor streams for flight control. IC Role / Device Role / Timing Role: XC7VX485T-3FFG1927E functions as deterministic time-triggered scheduler and ARINC 429/664 gateway. Use Value: Industrial temperature rating (-40°C to +100°C) and ECC-protected configuration memory ensure reliability in extended environmental cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924E | UltraScale architecture, higher DSP density (5,520 slices), but lower logic cell count (672K vs 485K) | Better suited for math-intensive workloads; less optimal for wide-data-path control logic | Prefer when algorithmic throughput dominates over state-machine complexity |
| XCVU13P-2FLGA2577E | UltraScale+ architecture, 100G Ethernet MAC hard IP, larger package (2577-ball), higher power envelope | Targeted at network infrastructure; over-provisioned for embedded radar or avionics | Choose only if native 100G MAC or PCIe Gen4 support is mandatory |
Compared with XCKU115-2FLVD1924E and XCVU13P-2FLGA2577E, the XC7VX485T-3FFG1927E offers superior logic-to-DSP ratio and proven qualification for harsh-environment embedded deployment, while maintaining lower static power and smaller PCB footprint than either alternative.
Availability
XC7VX485T-3FFG1927E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and avionics sensor fusion requiring stable component supply across long production lifecycles.
Supply support for XC7VX485T-3FFG1927E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Virtex-7 family was designed for high-bandwidth, low-latency compute acceleration in defense electronics, wired communications, and scientific instrumentation where deterministic timing and radiation-tolerant configuration are critical.
FAQ
What is the maximum transceiver line rate supported by XC7VX485T-3FFG1927E?
The XC7VX485T-3FFG1927E supports GTH transceivers operating at up to 13.1 Gb/s, validated per IEEE 802.3ba and CPRI v6.1 specifications. This line rate enables direct interface with 100G Ethernet KR4, JESD204B subclass 1, and optical fronthaul protocols without gearbox ICs. The XC7VX485T-3FFG1927E achieves this performance with on-die equalization and CDR lock range spanning ±100 ppm.
Does XC7VX485T-3FFG1927E support partial reconfiguration?
Yes, the XC7VX485T-3FFG1927E fully supports partial reconfiguration through Vivado Design Suite, allowing dynamic replacement of logical modules without resetting the entire device. This capability is implemented via frame-based bitstream loading into designated reconfigurable partitions. The XC7VX485T-3FFG1927E maintains active I/O and clock domains during reconfiguration, enabling uninterrupted system operation in radar and telecom applications.
What configuration modes are available for XC7VX485T-3FFG1927E?
The XC7VX485T-3FFG1927E supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Dual BPI mode allows boot from two independent flash devices for redundancy. Configuration bitstream can be authenticated via HMAC-SHA-256 and decrypted using AES-256 keys stored in eFUSE. The XC7VX485T-3FFG1927E also supports fallback configuration on CRC error detection.
Is XC7VX485T-3FFG1927E qualified for industrial temperature range?
Yes, the XC7VX485T-3FFG1927E is rated for operation from -40°C to +100°C ambient temperature and is qualified per AEC-Q100 Class 3 standards for industrial applications. Its configuration memory includes SEU mitigation features such as scrubbing controllers and parity protection. The XC7VX485T-3FFG1927E maintains full timing compliance across this range without derating when powered per recommended voltage tolerances.
What I/O standards does XC7VX485T-3FFG1927E support?
The XC7VX485T-3FFG1927E supports LVCMOS (1.2 V to 3.3 V), SSTL-15/18, HSTL-I/II, LVDS, BLVDS, RSDS, and TMDS I/O standards. Each of its 600+ user I/O pins is assignable to one of 19 banks, with independent VCCO and VREF per bank. The XC7VX485T-3FFG1927E provides programmable slew rate, drive strength, and input termination for signal integrity optimization in mixed-signal PCB layouts.
XC7VX485T-3FFG1927E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37950
- Number of Logic Elements/Cells:
- 485760
- Total RAM Bits:
- 37969920
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1927-FCBGA (45x45)
XC7VX485T-3FFG1927E FAQ
1.How can I place an order for XC7VX485T-3FFG1927E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX485T-3FFG1927E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX485T-3FFG1927E reliable?
The price and inventory of XC7VX485T-3FFG1927E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX485T-3FFG1927E is usually 5 days.
3.What payment methods are accepted for XC7VX485T-3FFG1927E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX485T-3FFG1927E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX485T-3FFG1927E?
XC7VX485T-3FFG1927E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX485T-3FFG1927E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX485T-3FFG1927E?
For technical support, including XC7VX485T-3FFG1927E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX485T-3FFG1927E requirements.
6.How does Aetrix verify that XC7VX485T-3FFG1927E is sourced from the original manufacturer or authorized distributors?
All XC7VX485T-3FFG1927E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX485T-3FFG1927E meets industry standards.
7.What is the process for return or replacement of XC7VX485T-3FFG1927E?
All XC7VX485T-3FFG1927E units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX485T-3FFG1927E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX485T-3FFG1927E part is unused and in its original packaging.
Return procedure for XC7VX485T-3FFG1927E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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