AMD XC7VX485T-L2FFG1157E

Overview

XC7VX485T-L2FFG1157E from AMD is a high-performance 28 nm Kintex-7 FPGA with 485,760 logic cells, 2,825 DSP slices, and 34.9 Mb of block RAM, configured in a 1157-pin Flip-Chip Fine-Pitch BGA (FFG) package for high-speed serial interface and compute-accelerated embedded vision systems.

For engineers reviewing the XC7VX485T-L2FFG1157E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (500 user I/Os), transceiver line rate (13.1 Gb/s), thermal design power (29.5 W), and support for PCIe Gen3 x8 endpoint functionality.

Technical Context

The XC7VX485T-L2FFG1157E implements a 28 nm HKMG process-based architecture with SelectIO technology supporting LVDS, SSTL, HSTL, and MIPI D-PHY standards across its 500 user-configurable I/O pins. It integrates 24 multi-gigabit GTs capable of 13.1 Gb/s operation and supports deterministic latency via AXI-Stream and AXI4-TR interfaces.

This device includes hardened IP blocks for PCIe Gen3 x8 endpoint, 10/25/100G Ethernet MAC, and DDR3/DDR4 memory controllers up to 1866 Mbps, with configuration via dual BPI flash or JTAG with fallback support.

Key Specifications

Pinout & Package

XC7VX485T-L2FFG1157E is housed in a 1157-pin Flip-Chip Fine-Pitch BGA (FFG) package with 35 × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation in high-density PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC7VX485T-L2FFG1157E, XCKU115 offers higher bandwidth and scalability for next-gen protocols, while XC7VX690T provides density headroom within identical architecture and Vivado toolflow-neither is pin-compatible, but both share compatible configuration and I/O standards.

Availability

XC7VX485T-L2FFG1157E is available at Aetrix Electronics and suitable for high-speed video processing, 5G radio unit development, and defense radar signal processing requiring stable component supply across extended product lifecycles.

Supply support for XC7VX485T-L2FFG1157E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Kintex-7 family targets cost-optimized high-performance applications such as wired communications, video processing, and test equipment, balancing logic density, transceiver bandwidth, and power efficiency.

FAQ

What is the maximum supported DDR4 data rate for XC7VX485T-L2FFG1157E?

The XC7VX485T-L2FFG1157E supports DDR4 memory interfaces up to 1866 Mbps using its hardened memory controller. This rate is validated with JEDEC-compliant DDR4 SDRAM components and includes built-in write leveling, read leveling, and gate training. The controller supports single-rank and dual-rank DIMMs with ECC capability, and timing parameters align with DDR4-1866 specifications under industrial temperature conditions. XC7VX485T-L2FFG1157E does not support DDR4-2133 or higher rates.

Does XC7VX485T-L2FFG1157E include a hard PCIe Gen3 endpoint?

Yes, XC7VX485T-L2FFG1157E integrates a hard PCIe Gen3 x8 endpoint IP block with full TLP processing, credit-based flow control, and MSI-X interrupt support. It operates without soft-core implementation overhead and complies with PCI Express Base Specification Revision 3.0. Configuration space is accessible via AXI4-Lite, and link training completes within 100 ms. XC7VX485T-L2FFG1157E does not support PCIe Gen4 or root complex functionality.

How many GT transceivers does XC7VX485T-L2FFG1157E have, and what is their maximum line rate?

XC7VX485T-L2FFG1157E contains 24 multi-gigabit transceivers (GTs), each supporting a maximum line rate of 13.1 Gb/s. These GTs comply with protocols including CPRI, JESD204B v2.0, and 10GBASE-KR. They are grouped into six quads, each with shared PLLs and clocking resources. XC7VX485T-L2FFG1157E does not support 16 Gb/s or higher line rates, and GT power consumption scales linearly with active lane count and data rate.

What is the thermal design power (TDP) of XC7VX485T-L2FFG1157E under full utilization?

The thermal design power (TDP) of XC7VX485T-L2FFG1157E is specified as 29.5 W at maximum junction temperature (100°C) and worst-case voltage/frequency corner. This value assumes all logic, DSP, BRAM, and GT resources are simultaneously active with typical switching activity. Power estimates must be validated using Xilinx Power Estimator (XPE) with actual design netlist and activity files. XC7VX485T-L2FFG1157E requires a heatsink and forced airflow for sustained operation above 75% resource utilization.

Is partial reconfiguration supported on XC7VX485T-L2FFG1157E?

Yes, XC7VX485T-L2FFG1157E supports partial reconfiguration through its ICAP interface and frame-based bitstream loading mechanism. This allows dynamic replacement of logical modules-such as filter banks or protocol engines-without resetting the entire device or halting I/O operations. Implementation requires Vivado Design Suite 2018.3 or later and adherence to placement constraints for reconfigurable partitions. XC7VX485T-L2FFG1157E does not support run-time reconfiguration of GT or memory controller blocks.