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AMD XC7VX485T-L2FFG1158E
- Part No.:
- XC7VX485T-L2FFG1158E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX485T-L2FFG1158E.pdf
- Description:
- IC FPGA 350 I/O 1158FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,219
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Product details
Overview
XC7VX485T-L2FFG1158E from AMD is a high-performance 28 nm Virtex-7 FPGA with 485,760 logic cells, 2,800 DSP slices, and 36.9 Mb of block RAM. It features 700 GT transceivers operating up to 13.1 Gb/s, supports PCIe Gen3 x8, and targets high-speed data processing in radar signal chains.
For engineers reviewing the XC7VX485T-L2FFG1158E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed, I/O bank voltage flexibility (1.2 V to 3.3 V), thermal design power (29.5 W typical), and support for JTAG and SelectMAP configuration interfaces.
Technical Context
The XC7VX485T-L2FFG1158E implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and UltraScale-compatible clock management tiles (CMTs) including MMCM and PLL. It integrates hardened PCI Express® Gen3 endpoints and supports AXI4 interconnect protocols.
It provides 500 user I/O pins across 24 selectable I/O banks, each supporting independent VCCO and VREF settings. Configuration is supported via quad-SPI, BPI, or JTAG, with dual-boot capability enabled through internal configuration memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 485,760 - determines maximum combinational and sequential logic capacity for complex state machines and datapaths |
| DSP Slices | 2,800 - enables parallel execution of multiply-accumulate operations for real-time filtering and FFTs |
| Block RAM | 36.9 Mb - supports large on-chip buffering for video frame stores or packet buffering in networking |
| GT Transceivers | 700 lanes @ up to 13.1 Gb/s - delivers aggregate serial bandwidth for multi-lane SerDes applications |
| I/O Pins | 500 - provides scalable interface connectivity across memory, sensors, and high-speed peripherals |
| TDP | 29.5 W typical - defines thermal envelope requiring active cooling in dense PCB layouts |
| Configuration Interface | JTAG, SelectMAP, Quad-SPI - enables flexible programming and field updates without external microcontroller |
Pinout & Package
The XC7VX485T-L2FFG1158E is housed in a 1158-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) package with 35 × 35 mm body size and 1.0 mm ball pitch. Thermal pad is exposed on underside for heatsink attachment.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank 65 | Configurable as PS GPIO, SDIO, UART, SPI, or CAN interfaces for Zynq-7000 compatibility mode |
| HR_IO_L[0:49] | High-Range I/O Bank 33/34 | Supports 1.2–3.3 V signaling with programmable slew rate and drive strength for DDR3/DDR4 memory interfacing |
| GTH_RXN/GTH_TXP | GT Transceiver Differential Pair | AC-coupled differential lanes for 10.3125–13.1 Gb/s serial links compliant with CPRI, SRIO, and 10GbE |
| CCLK, INIT_B, DONE | Configuration Control | Master clock input, initialization status flag, and configuration completion indicator for boot sequence validation |
| VCCINT, VCCAUX, VCCO | Power Supply Rails | Separate 0.95 V core, 1.8 V auxiliary, and programmable I/O supply rails enabling mixed-voltage system integration |
Key Features
| Feature | Design Value |
|---|---|
| 28 nm HKMG Process | Enables higher transistor density and lower dynamic power versus 40 nm FPGAs, critical for SWaP-constrained systems |
| Hardened PCIe Gen3 Endpoint | Reduces RTL integration effort and timing closure risk for host-facing acceleration cards and compute offload designs |
| AXI4 Interconnect Support | Ensures seamless integration with ARM Cortex-A9 processor subsystems and third-party IP cores using standard AMBA protocol |
| Dual-Boot Configuration | Allows safe field firmware updates by maintaining fallback image in internal configuration memory |
| Transceiver Clock Correction | Compensates for elastic buffer overflow/underflow in asynchronous clock domain crossings for CPRI and OBSAI protocols |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems with >10 GSPS ADC inputs. IC Role / Device Role / Timing Role: FPGA fabric performs time-aligned channel combining and digital down-conversion; GT transceivers stream raw IQ data to host processors. Use Value: 700 GT lanes at 13.1 Gb/s enable full-bandwidth sensor data ingestion without bottlenecks, reducing latency below 5 µs. | Use Scenario: Multi-channel oscilloscopes capturing transient events at 5 GS/s with 12-bit resolution across 16 channels. IC Role / Device Role / Timing Role: XC7VX485T-L2FFG1158E manages simultaneous ADC control, on-the-fly decimation, and PCIe Gen3 x8 streaming to host memory. Use Value: 2,800 DSP slices execute real-time FIR filtering per channel, while 485K logic cells implement custom trigger engines with sub-sample precision. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: CT scanner image reconstruction pipeline requiring parallel back-projection and iterative algorithms. IC Role / Device Role / Timing Role: FPGA accelerates floating-point matrix operations using DSP48E1 slices; block RAM buffers projection datasets during computation. Use Value: 36.9 Mb of block RAM eliminates external DDR latency, enabling single-pass reconstruction of 512×512 slices in <120 ms. | Use Scenario: Modular PXIe-based RF signal analyzers performing real-time spectrum analysis up to 26.5 GHz. IC Role / Device Role / Timing Role: XC7VX485T-L2FFG1158E hosts FFT engines, digital downconverters, and PCIe Gen3 interface for streaming spectral data. Use Value: Hardened PCIe Gen3 endpoint ensures deterministic 7.88 GB/s host transfer bandwidth, avoiding DMA bottlenecks during burst-mode acquisition. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1517I | UltraScale architecture, 1.3 M logic cells, 5,520 DSP slices, 42.5 Mb BRAM, 60 GTY transceivers @ 32.75 Gb/s | Better DSP density and higher-speed transceivers; lacks native PCIe Gen3 hard IP (requires soft IP) | Preferred for AI inference acceleration where DSP throughput dominates over PCIe integration effort |
| XCVU9P-2FLGB2104I | UltraScale+ architecture, 2.5 M logic cells, 6,840 DSP slices, 72.7 Mb BRAM, 128 GTM transceivers @ 58 Gb/s | Higher transceiver speed and BRAM capacity; requires more complex power delivery and thermal management | Selected when migrating to 100G Ethernet or coherent optical interfaces with PAM4 modulation |
Compared with XCKU115-2FLVD1517I and XCVU9P-2FLGB2104I, the XC7VX485T-L2FFG1158E offers balanced logic, DSP, and transceiver resources with integrated PCIe Gen3, making it optimal for cost-sensitive, thermally constrained radar and instrumentation platforms where architectural continuity with legacy Virtex-7 designs is required.
Availability
XC7VX485T-L2FFG1158E is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and medical imaging backend systems requiring stable component supply across extended production lifecycles.
Supply support for XC7VX485T-L2FFG1158E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, AI, embedded, and client applications.
The Virtex-7 family was engineered for high-bandwidth, low-latency signal processing in defense electronics, scientific instrumentation, and wired communications infrastructure.
FAQ
What is the maximum transceiver data rate supported by the XC7VX485T-L2FFG1158E?
The XC7VX485T-L2FFG1158E supports GT transceivers operating up to 13.1 Gb/s per lane. This rate is validated under specified temperature and voltage conditions per AMD's DS849 documentation and enables compliance with CPRI, SRIO Gen2, and 10GbE standards. The XC7VX485T-L2FFG1158E achieves this using adaptive equalization and clock-data recovery circuitry integrated into each transceiver tile.
Does the XC7VX485T-L2FFG1158E include hardened PCIe Gen3 support?
Yes, the XC7VX485T-L2FFG1158E integrates a hardened PCIe Gen3 x8 endpoint block. This eliminates the need for soft IP implementation, reduces resource utilization, and guarantees timing closure for endpoint configurations. The XC7VX485T-L2FFG1158E's PCIe block supports both root port and endpoint modes and complies with PCI Express Base Specification Revision 3.0.
What I/O standards are supported by the XC7VX485T-L2FFG1158E?
The XC7VX485T-L2FFG1158E supports LVCMOS, LVTTL, SSTL, HSTL, differential SSTL, and differential HSTL across its 24 I/O banks. Each bank operates independently with configurable VCCO (1.2 V to 3.3 V) and optional VREF. The XC7VX485T-L2FFG1158E also supports MIPI D-PHY source-synchronous timing for camera interface applications.
How is configuration performed on the XC7VX485T-L2FFG1158E?
Configuration of the XC7VX485T-L2FFG1158E can be performed via JTAG, SelectMAP, or quad-SPI master mode using external flash. Dual-boot capability allows storage of two bitstreams in internal configuration memory, enabling fail-safe updates. The XC7VX485T-L2FFG1158E supports bitstream encryption and HMAC authentication for secure configuration loading.
What is the thermal design power (TDP) of the XC7VX485T-L2FFG1158E?
The XC7VX485T-L2FFG1158E has a typical thermal design power of 29.5 W under worst-case switching activity and junction temperature conditions. This value is derived from AMD's UG475 power estimation methodology and assumes default I/O standards and moderate transceiver usage. Actual power consumption varies based on design utilization, clock frequency, and I/O loading.
XC7VX485T-L2FFG1158E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37950
- Number of Logic Elements/Cells:
- 485760
- Total RAM Bits:
- 37969920
- Number of I/O:
- 350
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1158-FCBGA (35x35)
XC7VX485T-L2FFG1158E FAQ
1.How can I place an order for XC7VX485T-L2FFG1158E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX485T-L2FFG1158E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX485T-L2FFG1158E reliable?
The price and inventory of XC7VX485T-L2FFG1158E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX485T-L2FFG1158E is usually 5 days.
3.What payment methods are accepted for XC7VX485T-L2FFG1158E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX485T-L2FFG1158E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX485T-L2FFG1158E?
XC7VX485T-L2FFG1158E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX485T-L2FFG1158E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX485T-L2FFG1158E?
For technical support, including XC7VX485T-L2FFG1158E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX485T-L2FFG1158E requirements.
6.How does Aetrix verify that XC7VX485T-L2FFG1158E is sourced from the original manufacturer or authorized distributors?
All XC7VX485T-L2FFG1158E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX485T-L2FFG1158E meets industry standards.
7.What is the process for return or replacement of XC7VX485T-L2FFG1158E?
All XC7VX485T-L2FFG1158E units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX485T-L2FFG1158E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX485T-L2FFG1158E part is unused and in its original packaging.
Return procedure for XC7VX485T-L2FFG1158E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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