AMD XC7VX550T-1FFG1158C
- Part No.:
- XC7VX550T-1FFG1158C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX550T-1FFG1158C.pdf
- Description:
- IC FPGA 350 I/O 1158FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7VX550T-1FFG1158C from AMD is a high-performance 28 nm Virtex-7 FPGA with 554,240 logic cells, 2,825 DSP slices, and 36.4 Mb of block RAM. It features 700 GT transceivers supporting up to 13.1 Gb/s, integrated PCIe Gen3 x8 endpoint, and operates at -1 speed grade (1.0 V core, 0°C to 85°C junction).
For engineers reviewing the XC7VX550T-1FFG1158C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and data rate, DSP slice density for signal processing, block RAM capacity for buffering, PCIe Gen3 endpoint integration, and thermal performance in high-throughput compute or packet-processing systems.
Technical Context
The XC7VX550T-1FFG1158C implements a 28 nm HKMG process-based architecture with SelectIO technology supporting DDR3/DDR4, LVDS, and MIPI interfaces. Its configuration uses dual-boot capability with fallback via SPIx4 or BPI parallel flash.
It integrates hardened IP including 100/1000/2500/10G Ethernet MACs, AXI-4 interconnect, and clock management tiles with MMCM and PLL for jitter reduction. Configuration security includes AES-256 bitstream encryption and HMAC authentication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 554,240 - supports complex RTL designs with multi-million-gate equivalent functionality |
| DSP Slices | 2,825 - enables real-time FIR filtering, FFT, and matrix operations at >1 GHz aggregate throughput |
| Block RAM | 36.4 Mb - provides on-chip memory for frame buffers, FIFOs, and lookup tables without external DRAM |
| GT Transceivers | 700 lanes @ up to 13.1 Gb/s - delivers 9.17 Tbps aggregate serial bandwidth for high-speed interconnect |
| PCIe Interface | Gen3 x8 endpoint - enables direct host CPU attachment with 7.88 GB/s bidirectional throughput |
| Operating Temp | 0°C to +85°C junction - validated for industrial and telecom infrastructure environments |
| I/O Standards | LVDS, MIPI D-PHY, DDR3/DDR4, SSTL - supports direct interfacing to memory, sensors, and SerDes PHYs |
Pinout & Package
XC7VX550T-1FFG1158C is housed in a 1158-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size, 0.8 mm pitch, and thermal lid. The package supports 500 user I/Os across 24 banks with bank-specific voltage support (1.2 V to 1.8 V).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as GPIO, SDIO, UART, SPI, or I²C interface pins for peripheral control |
| GTGREFCLK0/1 | Reference Clock Input | Provides low-jitter clock source for GT transceiver banks (required for 10+ Gb/s operation) |
| VRP/VRN | Bank Reference Voltage | Defines I/O threshold for differential standards like LVDS and TMDS in adjacent banks |
| INIT_B | Configuration Status | Active-low open-drain output indicating successful bitstream loading or configuration error |
| CCLK | Configuration Clock | Drives internal configuration logic during master SPI or JTAG programming |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 Endpoint | Reduces FPGA logic utilization by ~12,000 LUTs versus soft IP implementation; eliminates PCIe protocol stack verification effort |
| AES-256 Bitstream Encryption | Prevents unauthorized cloning or reverse-engineering of configured logic; required for secure boot in defense/aerospace systems |
| MMCM + PLL Clock Management | Enables sub-100 fs RMS jitter synthesis for high-speed SerDes and ADC/DAC sampling clocks |
| Dual-Boot Configuration | Supports field-upgradable firmware with automatic fallback to known-good image upon CRC failure |
| SelectIO Technology | Allows mixed-voltage I/O banks (1.2 V to 1.8 V) on same device, simplifying interface to heterogeneous peripherals |
Applications
| Radar Signal Processing | High-Speed Network Switching |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Primary compute engine executing FFTs, CFAR detection, and digital down-conversion using DSP slices and block RAM. Use Value: 2,825 DSP slices enable >100 GMAC/s sustained throughput; 700 GT lanes route ADC samples from 64+ RF channels at 1.2 GSPS each. | Use Scenario: Line-rate packet classification, deep packet inspection, and flow table lookups in 40/100 GbE data center switches. IC Role / Device Role / Timing Role: Traffic management ASIC replacement handling TCAM emulation, metering, and shaping at wire speed. Use Value: PCIe Gen3 x8 endpoint enables direct CPU offload; 36.4 Mb block RAM stores 2M+ flow entries with <100 ns latency. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: Raw data aggregation and real-time reconstruction in MRI and CT scanner backends. IC Role / Device Role / Timing Role: High-bandwidth data concentrator interfacing with 32+ ADC channels and feeding GPU-accelerated reconstruction pipelines. Use Value: 700 GT transceivers support 32× JESD204B lanes at 12.5 Gb/s for lossless sensor data transport; DDR4 I/O supports 25.6 GB/s memory bandwidth. | Use Scenario: Modular oscilloscope and arbitrary waveform generator platforms requiring reconfigurable signal generation and analysis. IC Role / Device Role / Timing Role: Real-time pattern generator and acquisition controller synchronizing multiple DAC/ADC modules with sub-nanosecond skew. Use Value: MMCM/PLL clock networks achieve <50 fs phase noise at 1 GHz; 500 user I/Os support simultaneous analog front-end and digital bus control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924I | UltraScale architecture; 644K logic cells; 5,520 DSP slices; no native PCIe Gen3 endpoint | Higher DSP density but requires soft PCIe IP; better suited for math-intensive compute over I/O-bound protocols | Choose when algorithmic throughput outweighs PCIe integration needs and Gen4 compatibility is desired |
| XC7VX690T-2FFG1927I | Larger die; 693,120 logic cells; 3,375 DSP slices; extended temp (-40°C to +100°C); higher power | Targeted for harsh-environment aerospace deployments where thermal margin and logic headroom are critical | Choose when additional logic resources and industrial temperature range justify higher cost and power |
Compared with XCKU115-2FLVD1924I and XC7VX690T-2FFG1927I, the XC7VX550T-1FFG1158C offers optimal balance of transceiver bandwidth, PCIe Gen3 integration, and industrial temperature operation-making it preferred for telecom infrastructure and high-throughput embedded computing where protocol acceleration and thermal reliability are jointly prioritized.
Availability
XC7VX550T-1FFG1158C is available at Aetrix Electronics and suitable for radar signal processing, high-speed network switching, and medical imaging backend systems requiring stable component supply and long-term lifecycle assurance.
Supply support for XC7VX550T-1FFG1158C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, networking, and embedded markets through FPGA, adaptive SoC, and AI processor technologies.
The Virtex-7 family targets high-bandwidth, high-compute applications such as wired communications infrastructure, defense radar, and scientific instrumentation where deterministic latency, transceiver density, and hardened IP integration are essential.
FAQ
What is the maximum supported transceiver data rate for XC7VX550T-1FFG1158C?
The XC7VX550T-1FFG1158C supports GT transceivers operating at up to 13.1 Gb/s per lane. This rate is achievable under specified conditions including proper reference clock jitter (<1.5 ps RMS), controlled PCB impedance, and appropriate termination. The device includes built-in equalization and clock recovery circuits to maintain signal integrity at this speed.
Does XC7VX550T-1FFG1158C include a hard PCIe Gen3 endpoint?
Yes, the XC7VX550T-1FFG1158C integrates a hardened PCIe Gen3 x8 endpoint block. This eliminates the need for soft IP implementation, reduces logic resource usage, and guarantees compliance with PCIe Gen3 electrical and protocol specifications without additional validation effort.
What I/O standards does XC7VX550T-1FFG1158C support?
The XC7VX550T-1FFG1158C supports LVDS, MIPI D-PHY, SSTL, HSTL, and DDR3/DDR4 memory interfaces across its 24 I/O banks. Each bank operates independently at 1.2 V, 1.35 V, 1.5 V, or 1.8 V, enabling direct connection to diverse peripherals without level-shifting components.
What is the operating temperature range for XC7VX550T-1FFG1158C?
The XC7VX550T-1FFG1158C is rated for 0°C to +85°C junction temperature (Commercial grade, C suffix). This range is validated for continuous operation in industrial and telecom infrastructure equipment with adequate thermal management and airflow.
How many block RAM bits are available in XC7VX550T-1FFG1158C?
The XC7VX550T-1FFG1158C provides 36.4 Mb (38,162,432 bits) of total block RAM distributed across 2,800 BRAM primitives. Each BRAM can be configured as 36 Kb dual-port memory or split into two 18 Kb blocks, supporting true dual-port synchronous read/write operations.
XC7VX550T-1FFG1158C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 43300
- Number of Logic Elements/Cells:
- 554240
- Total RAM Bits:
- 43499520
- Number of I/O:
- 350
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1158-FCBGA (35x35)
XC7VX550T-1FFG1158C FAQ
1.How can I place an order for XC7VX550T-1FFG1158C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX550T-1FFG1158C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX550T-1FFG1158C reliable?
The price and inventory of XC7VX550T-1FFG1158C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX550T-1FFG1158C is usually 5 days.
3.What payment methods are accepted for XC7VX550T-1FFG1158C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX550T-1FFG1158C transactions.
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4.How is shipping managed for XC7VX550T-1FFG1158C?
XC7VX550T-1FFG1158C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX550T-1FFG1158C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX550T-1FFG1158C?
For technical support, including XC7VX550T-1FFG1158C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX550T-1FFG1158C requirements.
6.How does Aetrix verify that XC7VX550T-1FFG1158C is sourced from the original manufacturer or authorized distributors?
All XC7VX550T-1FFG1158C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX550T-1FFG1158C meets industry standards.
7.What is the process for return or replacement of XC7VX550T-1FFG1158C?
All XC7VX550T-1FFG1158C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX550T-1FFG1158C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX550T-1FFG1158C part is unused and in its original packaging.
Return procedure for XC7VX550T-1FFG1158C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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