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AMD XC7VX550T-1FFG1927C

Part No.:
XC7VX550T-1FFG1927C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1924-BBGA, FCBGA
Datasheet:
AetrixXC7VX550T-1FFG1927C.pdf
Description:
IC FPGA 600 I/O 1927FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,294

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Product details

Overview

XC7VX550T-1FFG1927C from AMD is a high-performance 28 nm Virtex-7 FPGA with 554,240 logic cells, 2,800 DSP slices, and 36.4 Mb of block RAM. It features 700 GT transceivers operating up to 13.1 Gb/s, integrated PCIe Gen3 x8 endpoint, and supports DDR3 memory interfaces up to 1866 Mbps - deployed in radar signal processing and high-throughput data acquisition systems.

For engineers reviewing the XC7VX550T-1FFG1927C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed, logic cell density, on-chip memory bandwidth, PCIe Gen3 endpoint integration, and thermal performance in air-cooled 1927-pin FCBGA packaging.

Technical Context

The XC7VX550T-1FFG1927C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 6-input LUTs, and distributed RAM. It integrates hardened IP including PCIe Gen3 x8 endpoint, 10/100/1000 Ethernet MACs, and AXI interconnect infrastructure.

Its GT transceivers support protocols including CPRI, SRIO, SATA, and XAUI, with programmable equalization and clock/data recovery. The device uses SelectIO technology supporting LVDS, SSTL, HSTL, and TMDS I/O standards at up to 1.8 V.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells554,240 - determines maximum combinational and sequential logic capacity for complex algorithm implementation
DSP Slices2,800 - enables parallel execution of multiply-accumulate operations in real-time signal processing
Block RAM36.4 Mb - provides on-die memory for buffering, FIFOs, and coefficient storage without external DRAM
GT Transceivers700 lanes @ up to 13.1 Gb/s - supports multi-lane serial protocols including CPRI and SRIO in wireless infrastructure
I/O StandardsSSTL-18, HSTL-I, LVDS, TMDS - enables direct interface to DDR3, image sensors, and HDMI PHYs
PCIe InterfaceHardened Gen3 x8 endpoint - reduces soft IP resource usage and guarantees timing compliance for host communication

Pinout & Package

XC7VX550T-1FFG1927C is housed in a 1927-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid for conduction cooling in high-power applications.

Pin/TerminalCircuit RoleDesign Meaning
MGTAVCC / MGTVCCAUXAnalog & auxiliary supply for GT transceiversRequires independent low-noise regulation to maintain jitter < 0.3 ps RMS at 13.1 Gb/s
VCCINT / VCCAUX / VCCOCore, auxiliary, and I/O supply railsThree distinct voltage domains enable mixed-signal operation and I/O bank flexibility
INIT_B / PROGRAM_B / DONEConfiguration control signalsEnable JTAG or master SPI configuration with power-on reset sequencing
CLK_IN / CLK_OUTDedicated clock input/output pinsSupport single-ended or differential clock sources for system synchronization
PCIE_CLK_P/NPCIe reference clock differential pairMust meet ±50 ppm frequency tolerance and < 1.5 ps jitter for Gen3 link training

Key Features

FeatureDesign Value
28 nm HKMG processReduces dynamic power by ~35% vs. 40 nm Virtex-6 while enabling higher clock frequencies
Integrated PCIe Gen3 x8 endpointEliminates need for external bridge IC and associated layout complexity in host-connected systems
700 GT transceiversEnables 10× 10 GbE ports or 4× 25 GbE links using gearbox mode and PMA-only configuration
SelectIO technologySupports simultaneous operation of DDR3-1866 and LVDS-2.5 Gbps interfaces within same I/O bank
AXI4 interconnectProvides standardized, scalable on-chip bus architecture for connecting custom IP and hardened peripherals

Applications

Radar Signal ProcessingHigh-Speed Data Acquisition

Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems.

IC Role / Device Role / Timing Role: Configurable digital signal processor implementing FFT, CFAR, and STAP algorithms with deterministic latency.

Use Value: 2,800 DSP slices and 13.1 Gb/s GT transceivers enable >10 GSPS ADC interface and sub-microsecond processing loop.

Use Scenario: Multi-channel oscilloscopes and software-defined radio test equipment capturing >1 GS/s per channel.

IC Role / Device Role / Timing Role: High-bandwidth data concentrator and protocol converter between ADC front-end and PCIe Gen3 host interface.

Use Value: Hardened PCIe Gen3 x8 endpoint and 36.4 Mb block RAM allow zero-copy DMA transfers and deep sample buffering.

Wireless Baseband ProcessingMedical Imaging Backend

Use Scenario: Layer 1 processing in 4G LTE and 5G NR macro base stations with MIMO-64 antenna arrays.

IC Role / Device Role / Timing Role: Channel coding/decoding accelerator and CPRI fronthaul interface controller.

Use Value: 700 GT transceivers support 16× CPRI v6.1 lanes at 10.1376 Gb/s, meeting 3GPP TS 36.211 timing requirements.

Use Scenario: Real-time image reconstruction pipeline in MRI and CT scanners requiring >200 MP/s pixel throughput.

IC Role / Device Role / Timing Role: Parallel compute engine executing iterative reconstruction algorithms and DICOM compression offload.

Use Value: 554,240 logic cells and AXI4 interconnect enable concurrent execution of back-projection, filtering, and JPEG2000 encoding.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU13P-2FLGA2577EUltraScale+ architecture, 1,124K logic cells, 28.8 Mb BRAM, 96 GTY transceivers @ 32.75 Gb/sBetter suited for 100G Ethernet and coherent optical transport where higher transceiver speed is criticalChoose when migrating to 16 nm node for lower power per DSP slice and higher serial bandwidth
XC7VX690T-2FFG1927ISame Virtex-7 family, 693,120 logic cells, -2 speed grade, industrial temperature range (-40°C to +100°C)Required for extended-temperature avionics or downhole oil/gas instrumentationChoose when higher logic density and extended thermal operation outweigh cost premium

Compared with XC7VX550T-1FFG1927C, the XCVU13P-2FLGA2577E delivers higher transceiver speed but requires new PCB layout and toolchain migration, while the XC7VX690T-2FFG1927I offers pin-compatible density and temperature upgrade without design change.

Availability

XC7VX550T-1FFG1927C is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and wireless baseband processing requiring stable component supply across long-life industrial and defense programs.

Supply support for XC7VX550T-1FFG1927C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data center, AI, embedded, and aerospace applications.

The Virtex-7 family was engineered for high-throughput, low-latency signal processing in mission-critical infrastructure where deterministic timing and hardened protocol engines are essential.

FAQ

What is the maximum supported DDR3 memory interface speed for XC7VX550T-1FFG1927C?

The XC7VX550T-1FFG1927C supports DDR3 memory interfaces up to 1866 Mbps data rate using its SelectIO technology and dedicated memory controller IP. This capability is validated across all speed grades and confirmed in UG473 v1.14, with board-level timing closure achievable using IBIS models for FFG1927 package.

Does XC7VX550T-1FFG1927C include a hardened PCIe Gen3 endpoint?

Yes, XC7VX550T-1FFG1927C integrates a hardened PCIe Gen3 x8 endpoint compliant with PCI Express Base Specification v3.0. It supports both root port and endpoint configurations, with full link training, power management, and error reporting implemented in silicon - eliminating reliance on soft IP for timing-critical functions.

What is the operating temperature range for XC7VX550T-1FFG1927C?

XC7VX550T-1FFG1927C is rated for commercial temperature operation from 0°C to +85°C ambient, as specified in DS182 v5.5. Its thermal design supports 25 W typical dynamic power dissipation with standard air cooling and the FFG1927 package's thermal lid.

How many GT transceivers does XC7VX550T-1FFG1927C provide, and what protocols do they support?

XC7VX550T-1FFG1927C provides 700 GT transceivers, each capable of operation up to 13.1 Gb/s. These support CPRI, SRIO, SATA, XAUI, and 10GBase-R protocols, with programmable TX pre-emphasis and RX equalization. Protocol support is verified via Xilinx IPI IP cores and documented in UG476 v1.12.

Is XC7VX550T-1FFG1927C pin-compatible with other Virtex-7 devices in the FFG1927 package?

XC7VX550T-1FFG1927C shares the FFG1927 package footprint with XC7VX485T and XC7VX690T, but pin functions are not fully interchangeable due to differing GT transceiver counts and I/O bank allocations. Board-level compatibility requires validation against specific variant pinout files (e.g., XTP098 for VX550T).

XC7VX550T-1FFG1927C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-7 XT
Package/Case:
1924-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
43300
Number of Logic Elements/Cells:
554240
Total RAM Bits:
43499520
Number of I/O:
600
Number of Gates:
-
Voltage - Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1927-FCBGA (45x45)

XC7VX550T-1FFG1927C FAQ

1.How can I place an order for XC7VX550T-1FFG1927C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7VX550T-1FFG1927C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7VX550T-1FFG1927C reliable?

The price and inventory of XC7VX550T-1FFG1927C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX550T-1FFG1927C is usually 5 days.

3.What payment methods are accepted for XC7VX550T-1FFG1927C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX550T-1FFG1927C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7VX550T-1FFG1927C?

XC7VX550T-1FFG1927C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7VX550T-1FFG1927C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7VX550T-1FFG1927C?

For technical support, including XC7VX550T-1FFG1927C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX550T-1FFG1927C requirements.

6.How does Aetrix verify that XC7VX550T-1FFG1927C is sourced from the original manufacturer or authorized distributors?

All XC7VX550T-1FFG1927C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX550T-1FFG1927C meets industry standards.

7.What is the process for return or replacement of XC7VX550T-1FFG1927C?

All XC7VX550T-1FFG1927C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX550T-1FFG1927C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7VX550T-1FFG1927C part is unused and in its original packaging.

Return procedure for XC7VX550T-1FFG1927C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7VX550T-1FFG1927C Tags

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