AMD XC7VX550T-1FFG1927C
- Part No.:
- XC7VX550T-1FFG1927C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX550T-1FFG1927C.pdf
- Description:
- IC FPGA 600 I/O 1927FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,294
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Product details
Overview
XC7VX550T-1FFG1927C from AMD is a high-performance 28 nm Virtex-7 FPGA with 554,240 logic cells, 2,800 DSP slices, and 36.4 Mb of block RAM. It features 700 GT transceivers operating up to 13.1 Gb/s, integrated PCIe Gen3 x8 endpoint, and supports DDR3 memory interfaces up to 1866 Mbps - deployed in radar signal processing and high-throughput data acquisition systems.
For engineers reviewing the XC7VX550T-1FFG1927C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed, logic cell density, on-chip memory bandwidth, PCIe Gen3 endpoint integration, and thermal performance in air-cooled 1927-pin FCBGA packaging.
Technical Context
The XC7VX550T-1FFG1927C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 6-input LUTs, and distributed RAM. It integrates hardened IP including PCIe Gen3 x8 endpoint, 10/100/1000 Ethernet MACs, and AXI interconnect infrastructure.
Its GT transceivers support protocols including CPRI, SRIO, SATA, and XAUI, with programmable equalization and clock/data recovery. The device uses SelectIO technology supporting LVDS, SSTL, HSTL, and TMDS I/O standards at up to 1.8 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 554,240 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 2,800 - enables parallel execution of multiply-accumulate operations in real-time signal processing |
| Block RAM | 36.4 Mb - provides on-die memory for buffering, FIFOs, and coefficient storage without external DRAM |
| GT Transceivers | 700 lanes @ up to 13.1 Gb/s - supports multi-lane serial protocols including CPRI and SRIO in wireless infrastructure |
| I/O Standards | SSTL-18, HSTL-I, LVDS, TMDS - enables direct interface to DDR3, image sensors, and HDMI PHYs |
| PCIe Interface | Hardened Gen3 x8 endpoint - reduces soft IP resource usage and guarantees timing compliance for host communication |
Pinout & Package
XC7VX550T-1FFG1927C is housed in a 1927-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid for conduction cooling in high-power applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC / MGTVCCAUX | Analog & auxiliary supply for GT transceivers | Requires independent low-noise regulation to maintain jitter < 0.3 ps RMS at 13.1 Gb/s |
| VCCINT / VCCAUX / VCCO | Core, auxiliary, and I/O supply rails | Three distinct voltage domains enable mixed-signal operation and I/O bank flexibility |
| INIT_B / PROGRAM_B / DONE | Configuration control signals | Enable JTAG or master SPI configuration with power-on reset sequencing |
| CLK_IN / CLK_OUT | Dedicated clock input/output pins | Support single-ended or differential clock sources for system synchronization |
| PCIE_CLK_P/N | PCIe reference clock differential pair | Must meet ±50 ppm frequency tolerance and < 1.5 ps jitter for Gen3 link training |
Key Features
| Feature | Design Value |
|---|---|
| 28 nm HKMG process | Reduces dynamic power by ~35% vs. 40 nm Virtex-6 while enabling higher clock frequencies |
| Integrated PCIe Gen3 x8 endpoint | Eliminates need for external bridge IC and associated layout complexity in host-connected systems |
| 700 GT transceivers | Enables 10× 10 GbE ports or 4× 25 GbE links using gearbox mode and PMA-only configuration |
| SelectIO technology | Supports simultaneous operation of DDR3-1866 and LVDS-2.5 Gbps interfaces within same I/O bank |
| AXI4 interconnect | Provides standardized, scalable on-chip bus architecture for connecting custom IP and hardened peripherals |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems. IC Role / Device Role / Timing Role: Configurable digital signal processor implementing FFT, CFAR, and STAP algorithms with deterministic latency. Use Value: 2,800 DSP slices and 13.1 Gb/s GT transceivers enable >10 GSPS ADC interface and sub-microsecond processing loop. | Use Scenario: Multi-channel oscilloscopes and software-defined radio test equipment capturing >1 GS/s per channel. IC Role / Device Role / Timing Role: High-bandwidth data concentrator and protocol converter between ADC front-end and PCIe Gen3 host interface. Use Value: Hardened PCIe Gen3 x8 endpoint and 36.4 Mb block RAM allow zero-copy DMA transfers and deep sample buffering. |
| Wireless Baseband Processing | Medical Imaging Backend |
Use Scenario: Layer 1 processing in 4G LTE and 5G NR macro base stations with MIMO-64 antenna arrays. IC Role / Device Role / Timing Role: Channel coding/decoding accelerator and CPRI fronthaul interface controller. Use Value: 700 GT transceivers support 16× CPRI v6.1 lanes at 10.1376 Gb/s, meeting 3GPP TS 36.211 timing requirements. | Use Scenario: Real-time image reconstruction pipeline in MRI and CT scanners requiring >200 MP/s pixel throughput. IC Role / Device Role / Timing Role: Parallel compute engine executing iterative reconstruction algorithms and DICOM compression offload. Use Value: 554,240 logic cells and AXI4 interconnect enable concurrent execution of back-projection, filtering, and JPEG2000 encoding. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | UltraScale+ architecture, 1,124K logic cells, 28.8 Mb BRAM, 96 GTY transceivers @ 32.75 Gb/s | Better suited for 100G Ethernet and coherent optical transport where higher transceiver speed is critical | Choose when migrating to 16 nm node for lower power per DSP slice and higher serial bandwidth |
| XC7VX690T-2FFG1927I | Same Virtex-7 family, 693,120 logic cells, -2 speed grade, industrial temperature range (-40°C to +100°C) | Required for extended-temperature avionics or downhole oil/gas instrumentation | Choose when higher logic density and extended thermal operation outweigh cost premium |
Compared with XC7VX550T-1FFG1927C, the XCVU13P-2FLGA2577E delivers higher transceiver speed but requires new PCB layout and toolchain migration, while the XC7VX690T-2FFG1927I offers pin-compatible density and temperature upgrade without design change.
Availability
XC7VX550T-1FFG1927C is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and wireless baseband processing requiring stable component supply across long-life industrial and defense programs.
Supply support for XC7VX550T-1FFG1927C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, AI, embedded, and aerospace applications.
The Virtex-7 family was engineered for high-throughput, low-latency signal processing in mission-critical infrastructure where deterministic timing and hardened protocol engines are essential.
FAQ
What is the maximum supported DDR3 memory interface speed for XC7VX550T-1FFG1927C?
The XC7VX550T-1FFG1927C supports DDR3 memory interfaces up to 1866 Mbps data rate using its SelectIO technology and dedicated memory controller IP. This capability is validated across all speed grades and confirmed in UG473 v1.14, with board-level timing closure achievable using IBIS models for FFG1927 package.
Does XC7VX550T-1FFG1927C include a hardened PCIe Gen3 endpoint?
Yes, XC7VX550T-1FFG1927C integrates a hardened PCIe Gen3 x8 endpoint compliant with PCI Express Base Specification v3.0. It supports both root port and endpoint configurations, with full link training, power management, and error reporting implemented in silicon - eliminating reliance on soft IP for timing-critical functions.
What is the operating temperature range for XC7VX550T-1FFG1927C?
XC7VX550T-1FFG1927C is rated for commercial temperature operation from 0°C to +85°C ambient, as specified in DS182 v5.5. Its thermal design supports 25 W typical dynamic power dissipation with standard air cooling and the FFG1927 package's thermal lid.
How many GT transceivers does XC7VX550T-1FFG1927C provide, and what protocols do they support?
XC7VX550T-1FFG1927C provides 700 GT transceivers, each capable of operation up to 13.1 Gb/s. These support CPRI, SRIO, SATA, XAUI, and 10GBase-R protocols, with programmable TX pre-emphasis and RX equalization. Protocol support is verified via Xilinx IPI IP cores and documented in UG476 v1.12.
Is XC7VX550T-1FFG1927C pin-compatible with other Virtex-7 devices in the FFG1927 package?
XC7VX550T-1FFG1927C shares the FFG1927 package footprint with XC7VX485T and XC7VX690T, but pin functions are not fully interchangeable due to differing GT transceiver counts and I/O bank allocations. Board-level compatibility requires validation against specific variant pinout files (e.g., XTP098 for VX550T).
XC7VX550T-1FFG1927C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 43300
- Number of Logic Elements/Cells:
- 554240
- Total RAM Bits:
- 43499520
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1927-FCBGA (45x45)
XC7VX550T-1FFG1927C FAQ
1.How can I place an order for XC7VX550T-1FFG1927C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX550T-1FFG1927C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC7VX550T-1FFG1927C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX550T-1FFG1927C is usually 5 days.
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5.How can I obtain technical support or documentation for XC7VX550T-1FFG1927C?
For technical support, including XC7VX550T-1FFG1927C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX550T-1FFG1927C requirements.
6.How does Aetrix verify that XC7VX550T-1FFG1927C is sourced from the original manufacturer or authorized distributors?
All XC7VX550T-1FFG1927C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX550T-1FFG1927C meets industry standards.
7.What is the process for return or replacement of XC7VX550T-1FFG1927C?
All XC7VX550T-1FFG1927C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX550T-1FFG1927C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX550T-1FFG1927C part is unused and in its original packaging.
Return procedure for XC7VX550T-1FFG1927C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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