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AMD XC7VX550T-1FFG1927I
- Part No.:
- XC7VX550T-1FFG1927I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX550T-1FFG1927I.pdf
- Description:
- IC FPGA 600 I/O 1927FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,796
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Product details
Overview
XC7VX550T-1FFG1927I from AMD is a high-performance 28 nm FPGA with 554,200 logic cells, 2,825 DSP slices, and 36.4 Mb of block RAM, configured in a 1927-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package for high-speed serial interface and compute-acceleration applications in radar signal processing.
For engineers reviewing the XC7VX550T-1FFG1927I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (13.1 Gb/s), I/O voltage support (1.2 V to 3.3 V), thermal design power (125 W typical), and industrial temperature grade (-40°C to +100°C).
Technical Context
The XC7VX550T-1FFG1927I implements a 28 nm HKMG process-based architecture with integrated multi-gigabit transceivers supporting PCIe Gen3, SRIO Gen2, and 10G Ethernet protocols. It includes hardened IP blocks for PCI Express® Endpoint and Root Port, AXI interconnect, and clock management tiles with MMCM and PLL.
Configuration is performed via Master SelectMAP or JTAG, with dual-boot capability using external SPI flash. The device supports partial reconfiguration and bitstream encryption using AES-256 with HMAC authentication for secure deployment in mission-critical systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 554,200 - total configurable logic resources for complex digital logic implementation |
| DSP Slices | 2,825 - fixed-point arithmetic units enabling high-throughput filtering and FFT acceleration |
| Block RAM | 36.4 Mb - distributed on-chip memory for data buffering and lookup tables |
| Transceiver Line Rate | 13.1 Gb/s - supports 10GBASE-R, CPRI, and JESD204B at full lane count |
| I/O Standards | LVDS, SSTL, HSTL, TMDS, MIPI D-PHY - enables direct interfacing with ADCs, DACs, and display controllers |
| Operating Temperature | -40°C to +100°C - qualified for industrial and extended-temperature embedded systems |
| Thermal Design Power | 125 W typical - requires active cooling and thermal interface material in dense PCB layouts |
Pinout & Package
XC7VX550T-1FFG1927I is housed in a 1927-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC / MGTAVTT | Analog power for transceivers | Separate 1.0 V and 1.2 V supplies required for stable 13.1 Gb/s serial link operation |
| HR_IO / HP_IO | High-Range / High-Performance I/O banks | Supports 1.2–3.3 V signaling; HP banks optimized for low-skew DDR3/DDR4 interfaces |
| CCLK / INIT_B / DONE | Configuration control signals | Enable synchronous configuration loading and status monitoring during FPGA startup |
| VRP / VRN | Reference voltage inputs | Provide internal termination reference for differential I/O standards including LVDS and SSTL |
| VCCAUX / VCCINT | Auxiliary and core power rails | 1.8 V auxiliary supply powers configuration logic; 0.95 V core rail powers CLBs and routing fabric |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint | Hardened root complex and endpoint logic reduces integration effort and latency in host-connected accelerators |
| AXI4 Interconnect | Configurable crossbar supporting up to 64 AXI masters/slaves for scalable SoC subsystem integration |
| Partial Reconfiguration | Enables dynamic function swapping without system reset-critical for adaptive radar waveform updates |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized configuration loading in deployed hardware |
| MMCM + PLL Clock Management | Provides jitter < 150 fs RMS and programmable phase alignment across multiple clock domains |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and beamforming in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes custom filter chains and FFT engines; transceivers interface with RF front-end ADCs/DACs at 1.25 GSPS. Use Value: 2,825 DSP slices enable >100 GMAC/s throughput for CFAR detection and STAP algorithms within deterministic latency. | Use Scenario: Multi-channel oscilloscope and spectrum analyzer platforms capturing synchronized analog waveforms at ≥1 GS/s per channel. IC Role / Device Role / Timing Role: Configurable I/O banks interface with high-speed ADCs; block RAM buffers raw samples before PCIe Gen3 streaming to host PC. Use Value: 36.4 Mb on-chip RAM eliminates external DDR bottleneck for burst-mode acquisition up to 16 Msamples/channel. |
| Avionics Data Concentrator | 5G Baseband Prototyping |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control computers. IC Role / Device Role / Timing Role: Implements deterministic time-triggered Ethernet switches and legacy bus controllers using hardened AXI interconnect. Use Value: Dual-clock domain support ensures strict timing isolation between safety-critical and non-critical partitions per DO-254 Level A requirements. | Use Scenario: Massive MIMO baseband unit development supporting 64T64R configurations with real-time precoding and channel estimation. IC Role / Device Role / Timing Role: Hosts custom OFDM modulators/demodulators and LDPC decoders; transceivers connect to RFICs via JESD204B v2.0. Use Value: 13.1 Gb/s transceivers sustain full-rate JESD204B lane aggregation for 12×12-bit 2.4576 GSPS data streams. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924I | 20 nm UltraScale architecture; 644,000 logic cells; higher DSP density (3,600 slices); lower TDP (95 W) | Better suited for bandwidth-constrained, thermally sensitive 5G RU deployments | Select when migrating to newer process node with tighter power envelope and higher serial bandwidth (16.3 Gb/s) |
| XC7VX690T-2FFG1927I | Same 28 nm architecture; 693,100 logic cells; 3,328 DSP slices; higher speed grade (-2 vs -1) | Required for designs needing >10% additional logic capacity or >12.5 Gb/s transceiver margin | Select when existing XC7VX550T-1FFG1927I design approaches resource utilization limits |
Compared with XC7VX550T-1FFG1927I, the XCKU115 offers superior power efficiency and transceiver performance but requires board redesign due to different package and pinout; the XC7VX690T provides drop-in-compatible scaling within the same footprint and thermal profile.
Availability
XC7VX550T-1FFG1927I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and avionics data concentrator applications requiring stable component supply across long production lifecycles.
Supply support for XC7VX550T-1FFG1927I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, AI, embedded, and client markets with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.
The Virtex-7 family, including XC7VX550T-1FFG1927I, was engineered for high-bandwidth, high-compute-density applications such as wireless infrastructure, defense radar, and scientific instrumentation.
FAQ
What is the maximum transceiver line rate supported by XC7VX550T-1FFG1927I?
The XC7VX550T-1FFG1927I supports a maximum transceiver line rate of 13.1 Gb/s per lane, validated for protocols including 10GBASE-R, CPRI, and JESD204B v2.0. This performance is achieved using its GTH transceivers operating under industrial temperature conditions and requires proper PCB stack-up and AC-coupled differential routing per AMD UG476 guidelines. The XC7VX550T-1FFG1927I maintains this rate across all 32 transceiver quads when powered within specified VCCINT and MGTAVCC tolerances.
Does XC7VX550T-1FFG1927I support partial reconfiguration?
Yes, XC7VX550T-1FFG1927I fully supports partial reconfiguration through its ICAP and PCIe-based configuration interfaces. This capability allows runtime swapping of logic modules without resetting the entire device, enabling adaptive functions such as waveform updates in radar systems or protocol switching in test equipment. Implementation requires Vivado Design Suite 2020.2 or later and adherence to frame-based partitioning rules defined in UG908. The XC7VX550T-1FFG1927I retains configuration state in non-reconfigured regions during the process.
What I/O standards are supported by XC7VX550T-1FFG1927I?
XC7VX550T-1FFG1927I supports LVDS, SSTL-15/18, HSTL-I/II, MIPI D-PHY, and TMDS across its HR and HP I/O banks. Each bank operates independently with selectable VCCO voltages from 1.2 V to 3.3 V, enabling direct connection to DDR3/DDR4 memory, image sensors, and HDMI source devices. The XC7VX550T-1FFG1927I does not support RSDS or BLVDS. I/O standard compliance is verified per UG471 and requires correct bank-specific termination and reference voltage (VRP/VRN) configuration.
Is XC7VX550T-1FFG1927I qualified for industrial temperature operation?
Yes, XC7VX550T-1FFG1927I is rated for industrial temperature operation from -40°C to +100°C case temperature, as specified in AMD DS875. This qualification includes thermal cycling, high-temperature operating life, and burn-in testing per JEDEC JESD22-A108. The XC7VX550T-1FFG1927I's thermal design power of 125 W typical requires active cooling and appropriate heatsink mounting pressure to maintain junction temperature within safe limits under continuous load.
What configuration modes are available for XC7VX550T-1FFG1927I?
XC7VX550T-1FFG1927I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) flash configuration modes. Dual-boot capability is enabled via dedicated mode pins and external SPI flash with two bitstreams stored in separate address ranges. Configuration verification includes CRC checking and optional AES-256 decryption. The XC7VX550T-1FFG1927I asserts DONE and INIT_B pins to indicate status, and supports fallback to secondary image on CRC failure when configured for dual-boot operation.
XC7VX550T-1FFG1927I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 43300
- Number of Logic Elements/Cells:
- 554240
- Total RAM Bits:
- 43499520
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1927-FCBGA (45x45)
XC7VX550T-1FFG1927I FAQ
1.How can I place an order for XC7VX550T-1FFG1927I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX550T-1FFG1927I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX550T-1FFG1927I reliable?
The price and inventory of XC7VX550T-1FFG1927I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX550T-1FFG1927I is usually 5 days.
3.What payment methods are accepted for XC7VX550T-1FFG1927I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX550T-1FFG1927I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX550T-1FFG1927I?
XC7VX550T-1FFG1927I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX550T-1FFG1927I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX550T-1FFG1927I?
For technical support, including XC7VX550T-1FFG1927I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX550T-1FFG1927I requirements.
6.How does Aetrix verify that XC7VX550T-1FFG1927I is sourced from the original manufacturer or authorized distributors?
All XC7VX550T-1FFG1927I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX550T-1FFG1927I meets industry standards.
7.What is the process for return or replacement of XC7VX550T-1FFG1927I?
All XC7VX550T-1FFG1927I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX550T-1FFG1927I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX550T-1FFG1927I part is unused and in its original packaging.
Return procedure for XC7VX550T-1FFG1927I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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