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AMD XC7VX550T-2FFG1158C
- Part No.:
- XC7VX550T-2FFG1158C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX550T-2FFG1158C.pdf
- Description:
- IC FPGA 350 I/O 1158FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,641
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Product details
Overview
XC7VX550T-2FFG1158C from AMD is a high-performance 28 nm Virtex-7 FPGA with 554,400 logic cells, 2,825 DSP slices, and 4,884 kbit of block RAM. It features 700 GT transceivers operating up to 13.1 Gb/s and supports PCIe Gen3 x8, DDR3-1866, and 10G Ethernet in programmable logic fabric.
For engineers reviewing the XC7VX550T-2FFG1158C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count and speed, I/O bank voltage flexibility (1.2 V to 3.3 V), thermal performance in FFG1158 package, and support for high-speed serial protocols in aerospace and test equipment designs.
Technical Context
The XC7VX550T-2FFG1158C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36-kbit block RAMs, and dedicated FIFO logic. It integrates hardened IP including PCIe Gen3 endpoints, 10/100/1000 Ethernet MACs, and multi-gigabit transceivers with built-in PRBS generators and eye diagram monitors.
Configuration is performed via Master SelectMAP or JTAG, supporting dual-boot and fallback modes. The device supports partial reconfiguration and includes on-chip temperature and voltage sensors for real-time monitoring and dynamic power management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 554,400 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 2,825 - enables parallel execution of multiply-accumulate operations for radar signal processing or video encoding |
| Block RAM | 4,884 kbit - provides on-die memory for frame buffers, FIFOs, or coefficient storage without external memory latency |
| GT Transceivers | 700 units, up to 13.1 Gb/s - supports multi-lane 10G Ethernet, CPRI, and JESD204B interfaces with embedded clock recovery |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL, TMDS - allows direct interfacing with DDR3-1866 memory, image sensors, and display controllers |
| Configuration Mode | Master SelectMAP, JTAG, SPIx4 - enables fast parallel configuration from flash or secure in-system programming |
Pinout & Package
The XC7VX550T-2FFG1158C is housed in a 1158-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 0.8 mm pitch, designed for high-density PCB layouts and thermal dissipation in conduction-cooled systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration Pins | Determine boot source and configuration mode (e.g., Master SelectMAP vs. JTAG) |
| CCLK | Configuration Clock | Drives synchronous loading of bitstream during master mode configuration |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization completion |
| INIT_B | Configuration Initialization | Active-low signal indicating device readiness to accept configuration data |
| GTxP/GTxN | Differential Transceiver Pairs | High-speed serial lanes supporting protocols including PCIe Gen3 and 10G Ethernet |
| HCLK_IN | High-Speed Clock Input | Accepts differential clock inputs for transceiver reference clocks or system timing domains |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic updates in operational systems without full FPGA reset or downtime |
| Hardened PCIe Gen3 Endpoint | Reduces RTL integration effort and verification time for host interface subsystems |
| On-Chip Temperature Sensor | Provides ±2°C accuracy for thermal throttling and fan control in sealed enclosures |
| Dual-Boot Capability | Allows field-upgradable firmware with fallback to known-good configuration on boot failure |
| AXI Interconnect Infrastructure | Standardized high-bandwidth bus fabric for connecting custom IP, processors, and memory controllers |
Applications
| Radar Signal Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Primary programmable logic fabric hosting FFT engines, digital downconverters, and adaptive filtering pipelines. Use Value: 2,825 DSP slices and 13.1 Gb/s transceivers enable simultaneous multi-channel RF data ingestion and low-latency processing. | Use Scenario: Bit-error-rate testing and protocol validation for 10G Ethernet and CPRI links in manufacturing test fixtures. IC Role / Device Role / Timing Role: Protocol-aware pattern generator and analyzer with deterministic timing alignment across multiple high-speed lanes. Use Value: Built-in PRBS generators, eye diagram monitors, and sub-100 ps clock phase adjustment ensure precise physical-layer compliance testing. |
| Avionics Data Concentrators | Medical Imaging Back-End |
Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and AFDX traffic into unified avionics networks on airborne platforms. IC Role / Device Role / Timing Role: Deterministic interconnect hub with time-triggered scheduling and fault-isolated I/O banks. Use Value: 700 GT transceivers and flexible I/O voltage support allow mixed-voltage legacy bus interfacing without level-shifter components. | Use Scenario: Real-time reconstruction pipeline for CT and MRI scanners requiring pixel-level latency control and high-throughput DMA. IC Role / Device Role / Timing Role: High-bandwidth image processor interfacing directly with ADCs, DDR3 memory, and PCIe Gen3 host interfaces. Use Value: 4,884 kbit block RAM and AXI interconnect reduce off-chip memory accesses, improving reconstruction throughput by >35% versus external memory architectures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | UltraScale+ architecture, higher DSP density (5,520 slices), 25.6 Gb/s transceivers, but larger 2577-ball package | Better suited for next-gen 5G massive MIMO and AI inference acceleration where bandwidth exceeds Virtex-7 limits | Select when migrating to 16 nm node for improved power efficiency and transceiver speed; requires PCB redesign due to different footprint |
| XC7VX690T-2FFG1927I | Same Virtex-7 family, larger logic capacity (693,000 cells), more I/O (1,000), but industrial-grade (-40°C to +100°C) and larger 1927-ball package | Targeted at extended-temperature environments such as downhole oil/gas instrumentation or space-qualified payloads | Choose for higher logic density and extended temperature operation; not drop-in compatible due to pin count and thermal profile differences |
Compared with XC7VX550T-2FFG1158C, the XCVU13P offers superior transceiver speed and DSP density at the cost of board layout changes, while the XC7VX690T delivers greater logic resources and extended temperature tolerance within the same 28 nm generation-both require careful evaluation of thermal, I/O, and routing constraints.
Availability
XC7VX550T-2FFG1158C is available at Aetrix Electronics and suitable for radar signal processing, high-speed test equipment, and avionics data concentrators requiring stable component supply and long-term lifecycle support.
Supply support for XC7VX550T-2FFG1158C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and intelligent edge devices.
The Virtex-7 FPGA family was engineered for demanding high-throughput, low-latency applications in defense electronics, scientific instrumentation, and wired communications infrastructure.
FAQ
What is the maximum supported transceiver data rate for XC7VX550T-2FFG1158C?
The XC7VX550T-2FFG1158C supports GT transceivers operating up to 13.1 Gb/s. This rate is validated per the Virtex-7 DC and Switching Characteristics datasheet (DS183), enabling compliance with PCIe Gen3, 10GBASE-R, and CPRI Option 3. The XC7VX550T-2FFG1158C achieves this using adaptive equalization and embedded clock data recovery circuits.
Does XC7VX550T-2FFG1158C support partial reconfiguration?
Yes, the XC7VX550T-2FFG1158C supports partial reconfiguration through its ICAP and PCIe-based configuration interfaces. This capability allows runtime updates of specific logic regions without resetting the entire device. The XC7VX550T-2FFG1158C implements this using frame-based bitstream loading and CRC-protected configuration memory partitions.
What I/O standards are supported by XC7VX550T-2FFG1158C?
The XC7VX550T-2FFG1158C supports LVCMOS (1.2 V to 3.3 V), LVDS, SSTL, HSTL, and TMDS I/O standards across its 500+ user I/O pins. These standards are verified per DS182 and enable direct connection to DDR3-1866 memory, CMOS image sensors, and HDMI sources. Each I/O bank on the XC7VX550T-2FFG1158C is independently voltage-configurable.
What is the operating temperature range for XC7VX550T-2FFG1158C?
The XC7VX550T-2FFG1158C is specified for commercial temperature operation from 0°C to +85°C ambient. This rating applies to the -2 speed grade in the FFG1158 package and is documented in the Virtex-7 Packaging and Pinout Product Specification (UG475). Thermal derating curves for the XC7VX550T-2FFG1158C are provided in DS183 Appendix A.
How many block RAM columns does XC7VX550T-2FFG1158C contain?
The XC7VX550T-2FFG1158C contains 1,221 block RAM columns, each providing 36 kbits of configurable memory. This totals 4,884 kbit of distributed block RAM, usable as true dual-port RAM, ROM, or shift registers. The XC7VX550T-2FFG1158C allocates these resources across 24 BRAM tiles per CLB column, as defined in UG474.
XC7VX550T-2FFG1158C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 43300
- Number of Logic Elements/Cells:
- 554240
- Total RAM Bits:
- 43499520
- Number of I/O:
- 350
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1158-FCBGA (35x35)
XC7VX550T-2FFG1158C FAQ
1.How can I place an order for XC7VX550T-2FFG1158C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX550T-2FFG1158C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX550T-2FFG1158C reliable?
The price and inventory of XC7VX550T-2FFG1158C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX550T-2FFG1158C is usually 5 days.
3.What payment methods are accepted for XC7VX550T-2FFG1158C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX550T-2FFG1158C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX550T-2FFG1158C?
XC7VX550T-2FFG1158C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX550T-2FFG1158C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX550T-2FFG1158C?
For technical support, including XC7VX550T-2FFG1158C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX550T-2FFG1158C requirements.
6.How does Aetrix verify that XC7VX550T-2FFG1158C is sourced from the original manufacturer or authorized distributors?
All XC7VX550T-2FFG1158C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX550T-2FFG1158C meets industry standards.
7.What is the process for return or replacement of XC7VX550T-2FFG1158C?
All XC7VX550T-2FFG1158C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX550T-2FFG1158C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX550T-2FFG1158C part is unused and in its original packaging.
Return procedure for XC7VX550T-2FFG1158C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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