AMD XC7VX550T-2FFG1158I

Overview

XC7VX550T-2FFG1158I from AMD is a high-performance 28 nm Virtex-7 FPGA with 554,240 logic cells, 2,825 DSP slices, and 4,884 kbit of block RAM. It features 1158-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) packaging and supports transceiver line rates up to 13.1 Gb/s. It is used in high-speed data acquisition and radar signal processing systems.

For engineers reviewing the XC7VX550T-2FFG1158I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver performance, logic density, I/O voltage flexibility (1.2 V to 3.3 V), thermal design power (29.2 W typical), and support for PCIe Gen3 x8 endpoint configurations.

Technical Context

The XC7VX550T-2FFG1158I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36-kbit block RAMs, and hardened 13.1 Gb/s multi-gigabit transceivers compliant with PCIe Gen3, SRIO Gen2, and 10G Ethernet protocols. It integrates dual-core ARM Cortex-A9 MPCore processors in the Zynq-7000 series - but this part is a Virtex-7, not Zynq, and contains no processor subsystem.

It supports SelectIO standards including LVCMOS, SSTL, HSTL, and differential signaling (LVDS, TMDS, BLVDS). Configuration is performed via JTAG, SPIx4, or BPI parallel interfaces, with bitstream encryption and HMAC authentication enabled for secure boot.

Key Specifications

Pinout & Package

XC7VX550T-2FFG1158I is housed in a 1158-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) package with 35 × 35 mm body size, 0.8 mm ball pitch, and thermal lid. The package supports high-speed signal integrity with dedicated power/ground ball arrays and controlled impedance routing layers.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC7VX550T-2FFG1158I, the XCVU13P-2FFVC1760E offers higher transceiver speed and logic capacity but demands more board area and thermal management, while the XC7VX690T-2FFG1927I delivers incremental Virtex-7 scaling at the cost of non-interchangeable packaging and layout redesign.

Availability

XC7VX550T-2FFG1158I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and medical imaging backend systems requiring stable component supply across extended product lifecycles.

Supply support for XC7VX550T-2FFG1158I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, embedded, and aerospace applications.

The Virtex-7 FPGA family targets demanding signal processing, high-bandwidth interconnect, and real-time computation applications where logic density, transceiver performance, and deterministic timing are critical.

FAQ

What is the maximum transceiver line rate supported by the XC7VX550T-2FFG1158I?

The XC7VX550T-2FFG1158I supports a maximum transceiver line rate of 13.1 Gb/s per lane. This enables compliance with PCIe Gen3 x8, 10GBASE-KR, and CPRI Option 10 protocols. The transceivers are hardened IP blocks with built-in clock data recovery and elastic buffers, and their performance is validated across temperature and voltage corners per the official Virtex-7 DC and AC switching characteristics datasheet.

Does the XC7VX550T-2FFG1158I include an integrated processor subsystem?

No, the XC7VX550T-2FFG1158I is a Virtex-7 FPGA and does not contain any integrated processor cores. Unlike Zynq-7000 SoCs, it provides only programmable logic fabric, DSP slices, block RAM, and transceivers. Any processing functionality must be implemented in the FPGA fabric or offloaded to an external microprocessor or ASIC. The XC7VX550T-2FFG1158I datasheet explicitly lists no ARM cores or processor-related peripherals.

What I/O standards are supported by the XC7VX550T-2FFG1158I?

The XC7VX550T-2FFG1158I supports LVCMOS, SSTL-12/15/18, HSTL-I/II, LVDS, BLVDS, TMDS, and RSDS across its HP and HR I/O banks. Each bank can be independently configured for voltage levels from 1.0 V to 3.3 V. These standards allow direct connection to DDR3/DDR4 memory, high-speed ADCs/DACs, and other FPGAs without external level-shifting circuitry, as confirmed in the Virtex-7 Packaging and Pinout Product Specification document.

What is the thermal design power (TDP) of the XC7VX550T-2FFG1158I?

The XC7VX550T-2FFG1158I has a typical thermal design power of 29.2 W under worst-case operating conditions (100°C junction temperature, full utilization). This value is derived from AMD's Virtex-7 DC and AC Switching Characteristics datasheet and reflects power consumption across core logic, I/O, and transceivers. Thermal solution sizing must account for peak transient loads and board-level heat spreading limitations.

Is the XC7VX550T-2FFG1158I pin-compatible with other Virtex-7 devices?

No, the XC7VX550T-2FFG1158I is not pin-compatible with other Virtex-7 devices due to its unique 1158-ball FCBGA package. Devices like XC7VX690T use 1927-ball packages, and XC7VX485T uses 1157-ball packages - all with different ball maps, power/ground pin allocations, and I/O bank arrangements. Migration requires PCB redesign, as confirmed in the Virtex-7 Packaging and Pinout Product Specification.