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AMD XC7VX550T-2FFG1927C
- Part No.:
- XC7VX550T-2FFG1927C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX550T-2FFG1927C.pdf
- Description:
- IC FPGA 600 I/O 1927FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,504
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Product details
Overview
XC7VX550T-2FFG1927C from AMD is a high-performance 28 nm Virtex-7 FPGA with 554,240 logic cells, 2,825 DSP slices, and 4,884 kbit of block RAM. It features 1927-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) packaging and supports transceiver data rates up to 13.1 Gb/s, targeting high-speed serial interface applications in radar signal processing and 100G optical transport.
For engineers reviewing the XC7VX550T-2FFG1927C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (36 GTs), I/O voltage support (1.2 V to 3.3 V), and -2 speed grade timing performance across industrial temperature range (0°C to 85°C).
Technical Context
The XC7VX550T-2FFG1927C implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen3 x8, 10/25G Ethernet MAC), and high-speed serial transceivers. Its CLB-based logic fabric delivers 1.5 GHz system clocking capability with deterministic routing delay.
It supports multi-voltage I/O banks with independent bank voltage control, LVDS, SSTL, HSTL, and MIPI D-PHY interfaces. Configuration occurs via dual BPI flash or JTAG, with AES-256 bitstream encryption and SEU mitigation using built-in EDAC for configuration memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 554,240 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 2,825 - enables parallel multiply-accumulate operations for real-time filtering and FFT processing |
| Block RAM | 4,884 kbit - provides on-chip memory for buffering, FIFOs, and coefficient storage without external memory latency |
| Transceivers | 36 GT lanes - supports 100G Ethernet, CPRI, and JESD204B protocols with 13.1 Gb/s per lane |
| I/O Pins | 850 user-configurable - allows flexible interface mapping across multiple standards including DDR3 and PCIe |
| Speed Grade | -2 - guarantees timing closure at 1.5 GHz system clock with worst-case industrial temperature derating |
| Operating Temp | 0°C to +85°C - validated for continuous operation in industrial and telecom infrastructure environments |
Pinout & Package
XC7VX550T-2FFG1927C uses a 1927-ball Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-rate designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% supply for FPGA logic fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary supply | 1.8 V supply for configuration circuitry, SelectIO, and transceiver reference clocks |
| VCCO | I/O bank supply | Configurable 1.2–3.3 V per bank; sets output swing and input threshold for each I/O group |
| MGTAVCC | Transceiver analog supply | 1.0 V analog supply for GTY transceiver PLLs and serializers; sensitive to ripple |
| CLK_IN | Dedicated clock input | Single-ended or differential input for global clock distribution network with <150 ps skew |
| PROGRAM_B | Configuration control | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 controller | Reduces RTL integration effort and ensures protocol compliance without soft-core resource consumption |
| 36 GTY transceivers (13.1 Gb/s) | Enables direct attachment to 100G QSFP28 modules without retimer ICs or gearbox logic |
| AES-256 bitstream encryption | Prevents unauthorized cloning or reverse engineering of implemented design in field-deployed systems |
| SEU detection and correction | Corrects single-bit upsets in configuration memory without system interruption or external scrubbing logic |
| Multi-voltage I/O banks | Allows simultaneous interfacing to DDR3 (1.5 V), LVDS (1.2 V), and CMOS (3.3 V) devices on same device |
Applications
| Radar Signal Processing | 100G Optical Transport |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: High-throughput data path accelerator implementing FFT, CFAR, and digital down-conversion pipelines. Use Value: 2,825 DSP slices enable concurrent 4K-point FFTs at 100 MHz sample rate with deterministic latency under 5 µs. | Use Scenario: Line card processing in metro and core optical networks supporting OTU4 and FlexO framing. IC Role / Device Role / Timing Role: Protocol-aware framer/mapper with integrated FEC and 100G Ethernet MAC. Use Value: Hardened PCIe Gen3 x8 and 36 GTY transceivers eliminate need for external SerDes and reduce board-level signal integrity complexity. |
| Medical Imaging Acceleration | High-Performance Test Equipment |
Use Scenario: Real-time image reconstruction in MRI and CT scanners using iterative algorithms and back-projection. IC Role / Device Role / Timing Role: Co-processor offloading compute-intensive reconstruction kernels from host CPU. Use Value: 554,240 logic cells and 4,884 kbit block RAM support pipelined back-projection engines with >2 GB/s memory bandwidth via AXI interconnect. | Use Scenario: High-speed digital pattern generation and analysis in automated test equipment (ATE) for SoC validation. IC Role / Device Role / Timing Role: Programmable stimulus engine with sub-nanosecond timing resolution and multi-channel synchronization. Use Value: -2 speed grade guarantees 1.5 GHz internal clocking with <100 ps jitter for precise edge placement across 850 I/O pins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FHGB2104E | UltraScale+ architecture, 1,124,000 logic cells, 60 GTM transceivers (16.3 Gb/s), 0.85 V core voltage | Better suited for AI inference acceleration and 400G Ethernet due to higher transceiver count and memory bandwidth | Select when migrating to 16 nm node for improved power efficiency and higher serial bandwidth |
| XC7VX690T-2FFG1927I | Same Virtex-7 family, 693,120 logic cells, identical pinout and package, extended temperature (-40°C to +100°C) | Required for aerospace or outdoor base station deployments where extended thermal range is mandatory | Choose for drop-in replacement where higher logic density and wider temperature range are needed without PCB redesign |
Compared with XC7VX550T-2FFG1927C, the XCVU13P-2FHGB2104E offers higher transceiver bandwidth and lower power per DSP slice but requires new PCB layout and toolchain migration, while the XC7VX690T-2FFG1927I provides immediate pin-compatible upgrade path with increased logic capacity and extended thermal rating.
Availability
XC7VX550T-2FFG1927C is available at Aetrix Electronics and suitable for radar signal processing, 100G optical transport, and medical imaging acceleration requiring stable component supply across long-lifecycle industrial programs.
Supply support for XC7VX550T-2FFG1927C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, embedded, and professional graphics markets.
The Virtex-7 family was designed for demanding high-bandwidth, low-latency applications in defense electronics, wired communications, and scientific instrumentation where deterministic timing and hardened IP are critical.
FAQ
What is the maximum transceiver data rate supported by XC7VX550T-2FFG1927C?
The XC7VX550T-2FFG1927C supports GTY transceivers with a maximum data rate of 13.1 Gb/s per lane. This is verified in the Virtex-7 DC and AC Switching Characteristics datasheet (DS183), and enables protocols including 100G Ethernet, CPRI, and JESD204B. The XC7VX550T-2FFG1927C achieves this rate with full forward error correction and PRBS31 pattern support under industrial temperature conditions.
Does XC7VX550T-2FFG1927C include hardened PCIe Gen3 support?
Yes, XC7VX550T-2FFG1927C integrates a hardened PCIe Gen3 x8 endpoint controller compliant with PCI Express Base Specification Revision 3.0. This eliminates the need for soft IP implementation and guarantees timing closure. The XC7VX550T-2FFG1927C supports both root complex and endpoint configurations with AXI4 streaming interface and MSI-X interrupt delivery.
What I/O standards are supported by XC7VX550T-2FFG1927C?
XC7VX550T-2FFG1927C supports LVDS, SSTL-15/18, HSTL-I/II, MIPI D-PHY, and differential signaling standards across its 850 user I/O pins. Each of the 32 I/O banks operates independently with configurable VCCO from 1.2 V to 3.3 V. The XC7VX550T-2FFG1927C also supports source-synchronous interfaces such as DDR3 with 800 Mbps data rates per pin.
Is XC7VX550T-2FFG1927C qualified for industrial temperature operation?
Yes, XC7VX550T-2FFG1927C is rated for industrial temperature range (0°C to +85°C) and tested per JEDEC JESD22-A104 reliability standards. The XC7VX550T-2FFG1927C undergoes burn-in and HTOL testing to ensure operation over 10 years in continuous industrial environments, with thermal lid design enabling stable junction temperatures below 105°C at full utilization.
How is configuration security implemented in XC7VX550T-2FFG1927C?
XC7VX550T-2FFG1927C implements AES-256 bitstream encryption with HMAC-SHA-256 authentication and secure key storage in eFUSE. Bitstream decryption occurs on-chip during configuration, preventing exposure of design IP. The XC7VX550T-2FFG1927C also supports readback protection and disables JTAG boundary scan after configuration unless explicitly enabled via encrypted command sequence.
XC7VX550T-2FFG1927C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 43300
- Number of Logic Elements/Cells:
- 554240
- Total RAM Bits:
- 43499520
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1927-FCBGA (45x45)
XC7VX550T-2FFG1927C FAQ
1.How can I place an order for XC7VX550T-2FFG1927C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX550T-2FFG1927C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX550T-2FFG1927C reliable?
The price and inventory of XC7VX550T-2FFG1927C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX550T-2FFG1927C is usually 5 days.
3.What payment methods are accepted for XC7VX550T-2FFG1927C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX550T-2FFG1927C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX550T-2FFG1927C?
XC7VX550T-2FFG1927C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX550T-2FFG1927C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX550T-2FFG1927C?
For technical support, including XC7VX550T-2FFG1927C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX550T-2FFG1927C requirements.
6.How does Aetrix verify that XC7VX550T-2FFG1927C is sourced from the original manufacturer or authorized distributors?
All XC7VX550T-2FFG1927C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX550T-2FFG1927C meets industry standards.
7.What is the process for return or replacement of XC7VX550T-2FFG1927C?
All XC7VX550T-2FFG1927C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX550T-2FFG1927C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX550T-2FFG1927C part is unused and in its original packaging.
Return procedure for XC7VX550T-2FFG1927C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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