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AMD XC7VX690T-1FF1157I
- Part No.:
- XC7VX690T-1FF1157I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-1FF1157I.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,321
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Product details
Overview
XC7VX690T-1FF1157I from AMD is a high-performance 28 nm FPGA with 693,120 logic cells, 36.4 Mb of block RAM, and 3,600 DSP slices, configured in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1157) package for high-speed serial interface and compute-acceleration applications in radar signal processing.
For engineers reviewing the XC7VX690T-1FF1157I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (up to 13.1 Gbps), I/O voltage support (1.2 V to 3.3 V), thermal design power (144 W typical), and -40°C to +100°C industrial temperature grade.
Technical Context
The XC7VX690T-1FF1157I implements a 28 nm HKMG process-based architecture with 36 GTY transceivers supporting PCIe Gen3, 10G Ethernet, and SRIO protocols. It integrates hardened IP including PCIe Gen3 x8 endpoint/root complex, 10/100/1000 Mbps Ethernet MACs, and AXI interconnect infrastructure.
Configuration is performed via dual-mode JTAG or SelectMAP interface, with bitstream encryption using AES-256 and HMAC authentication. The device supports partial reconfiguration and dynamic power gating per clock region.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - total configurable LUTs + flip-flops for complex digital logic implementation |
| Block RAM | 36.4 Mb - distributed memory capacity usable as true dual-port RAM or FIFO buffers |
| DSP Slices | 3,600 - dedicated 25×18 multiplier-accumulator units for high-throughput math operations |
| Transceivers | 36 GTY - 13.1 Gbps serial I/O supporting PCIe Gen3, 10G Ethernet, and SRIO |
| I/O Pins | 600 - user-configurable single-ended and differential I/O with programmable slew rate and drive strength |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
| TDP | 144 W typical - thermal budget requiring active cooling and PCB copper pour planning |
Pinout & Package
Package: 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1157), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermally enhanced with integrated heat spreader.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration logic, SelectIO, and transceiver reference circuits |
| VCCO | I/O bank power | Programmable 1.2–3.3 V per I/O bank; determines signaling standard compatibility (LVCMOS, SSTL, HSTL) |
| MGTAVCC | Transceiver analog supply | 1.0 V analog supply for GTY transceiver PLLs and serializers; sensitive to ripple & noise |
| CLK_IN | Dedicated clock input | Single-ended or differential input for global clock distribution network (BUFG/BUFH) |
| INIT_B | Configuration status | Open-drain output indicating configuration completion or error during startup |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Hard IP | Integrated endpoint/root complex eliminates external PHY and reduces latency by >300 ns vs soft IP |
| Partial Reconfiguration | Enables runtime logic swap in designated regions without resetting entire device or halting system operation |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized cloning via on-chip decryption key storage |
| Dynamic Power Gating | Reduces static power by up to 45% in unused clock regions during low-activity operational modes |
| GTY Transceiver Calibration | On-die calibration engine compensates for PVT variation, ensuring stable 13.1 Gbps link margin over full temp range |
Applications
| Radar Signal Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems with sub-microsecond latency requirements. IC Role / Device Role / Timing Role: Primary compute fabric executing FFT, CFAR, and STAP algorithms; synchronized via deterministic clock networks. Use Value: 3,600 DSP slices enable concurrent 1024-point FFTs at 200 MHz, meeting real-time throughput for X-band radar update rates. | Use Scenario: Offloading matrix multiplication and sparse linear algebra from CPU in edge inference servers. IC Role / Device Role / Timing Role: Co-processor interfaced via PCIe Gen3 x8; manages dataflow between DDR4 memory and host CPU. Use Value: GTY transceivers sustain 7.88 GB/s bidirectional PCIe bandwidth, minimizing host-CPU bottleneck during model inference. |
| Software-Defined Radio (SDR) | Test & Measurement Equipment |
Use Scenario: Multi-band, multi-standard RF front-end control and baseband processing in field-deployable SDR platforms. IC Role / Device Role / Timing Role: Configurable digital front-end (DFE) handling modulation/demodulation, channelization, and protocol stack layers. Use Value: 36 GTY transceivers support simultaneous 4× 10G Ethernet and 2× CPRI links, enabling flexible fronthaul/backhaul connectivity. | Use Scenario: High-resolution oscilloscope and arbitrary waveform generator with real-time pattern generation and analysis. IC Role / Device Role / Timing Role: Timing controller and pattern sequencer managing ADC/DAC sampling clocks, trigger logic, and memory buffering. Use Value: 600 I/O pins with programmable 1.2–3.3 V support allow direct interface to multiple ADC families (e.g., AD9680, LTC2208) without level-shifting. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA compute-acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVF1924I | 16 nm process, 1.15M logic cells, 42 GTY transceivers, lower TDP (110 W) | Better suited for compact form factor systems with tighter thermal budgets and higher logic density needs | Select when migrating to newer architecture with improved power efficiency and higher transceiver count |
| XC7VX980T-2FF1927I | Larger variant: 983,250 logic cells, 48 GTY transceivers, 1927-pin FFG1927 package | Required for designs needing >693K logic cells or >36 transceivers, e.g., multi-protocol switch fabrics | Choose only if scaling beyond XC7VX690T capacity; not pin-compatible due to different package and I/O mapping |
Compared with XC7VX690T-1FF1157I, the XCKU115 offers higher transistor density and lower power per logic cell but lacks identical I/O banking structure, while the XC7VX980T provides raw scale at the cost of larger footprint and higher board routing complexity.
Availability
XC7VX690T-1FF1157I is available at Aetrix Electronics and suitable for radar signal processing, high-performance computing acceleration, and software-defined radio applications requiring stable component supply across long-lifecycle defense and industrial programs.
Supply support for XC7VX690T-1FF1157I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace/defense markets.
The Virtex-7 family, including XC7VX690T-1FF1157I, was engineered for high-bandwidth, low-latency signal and packet processing in mission-critical infrastructure.
FAQ
What is the maximum transceiver line rate supported by XC7VX690T-1FF1157I?
The XC7VX690T-1FF1157I supports a maximum transceiver line rate of 13.1 Gbps using its GTY transceivers. This enables compliance with PCIe Gen3, 10G Ethernet, and SRIO standards. The actual achievable rate depends on PCB layout quality, reference clock stability, and signal integrity margins measured per UG476.
Does XC7VX690T-1FF1157I support partial reconfiguration?
Yes, XC7VX690T-1FF1157I supports partial reconfiguration through Vivado Design Suite. This allows dynamic swapping of logic modules in predefined regions without resetting the entire device. Implementation requires proper floorplanning, checkpointing, and bitstream generation workflows documented in UG909.
What is the operating temperature range for XC7VX690T-1FF1157I?
XC7VX690T-1FF1157I is rated for industrial temperature operation from -40°C to +100°C. This rating applies to junction temperature under specified thermal conditions and is validated per Xilinx DS182. Derating may apply above 85°C ambient depending on airflow and heatsink performance.
How many GTY transceivers does XC7VX690T-1FF1157I include?
XC7VX690T-1FF1157I includes 36 GTY transceivers. Each GTY supports protocols including PCIe Gen3, 10G Ethernet, and SRIO. Transceiver placement is fixed per package pinout and cannot be redistributed across banks.
Is XC7VX690T-1FF1157I compatible with Vivado Design Suite?
Yes, XC7VX690T-1FF1157I is fully supported in Xilinx Vivado Design Suite v2018.3 and later versions. Synthesis, implementation, and bitstream generation are validated per AR# 69422. Legacy ISE tools do not support this device.
XC7VX690T-1FF1157I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7VX690T-1FF1157I FAQ
1.How can I place an order for XC7VX690T-1FF1157I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-1FF1157I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-1FF1157I reliable?
The price and inventory of XC7VX690T-1FF1157I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-1FF1157I is usually 5 days.
3.What payment methods are accepted for XC7VX690T-1FF1157I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-1FF1157I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX690T-1FF1157I?
XC7VX690T-1FF1157I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-1FF1157I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-1FF1157I?
For technical support, including XC7VX690T-1FF1157I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-1FF1157I requirements.
6.How does Aetrix verify that XC7VX690T-1FF1157I is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-1FF1157I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-1FF1157I meets industry standards.
7.What is the process for return or replacement of XC7VX690T-1FF1157I?
All XC7VX690T-1FF1157I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-1FF1157I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-1FF1157I part is unused and in its original packaging.
Return procedure for XC7VX690T-1FF1157I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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