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AMD XC7VX690T-1FF1761I
- Part No.:
- XC7VX690T-1FF1761I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-1FF1761I.pdf
- Description:
- IC FPGA 850 I/O 1761FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,052
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Product details
Overview
XC7VX690T-1FF1761I from AMD is a high-performance 28 nm FPGA featuring 693,120 logic cells, 3,600 DSP slices, and 48.5 Mb of block RAM, configured in a 1761-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1761) package for high-speed serial I/O and compute-intensive applications such as radar signal processing.
For engineers reviewing the XC7VX690T-1FF1761I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (up to 13.1 Gbps), I/O bank voltage support (1.2 V to 3.3 V), thermal design power (144 W typical), and JTAG boundary-scan compliance per IEEE 1149.1.
Technical Context
The XC7VX690T-1FF1761I implements a 28 nm HKMG process-based architecture with integrated multi-gigabit transceivers (MGTs), configurable logic blocks (CLBs), and hardened IP including PCIe Gen3 x8, 10/25/100G Ethernet MAC, and AXI interconnect. It supports partial reconfiguration and built-in self-test (BIST) for SRAM and transceivers.
Configuration is performed via Master SelectMAP or JTAG using external SPI flash or BPI PROM. The device includes dedicated clock management tiles (CMTs) with MMCM and PLL blocks supporting jitter attenuation down to 150 fs RMS and output frequency synthesis from 10 MHz to 800 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| DSP Slices | 3,600 - fixed-point arithmetic units supporting 25×18-bit multiply-accumulate with pipeline control |
| Block RAM | 48.5 Mb - distributed memory capacity usable as true dual-port RAM, FIFO, or ROM with byte-write enable |
| Transceiver Line Rate | 13.1 Gbps - maximum serial data rate per GTY transceiver channel, supporting 100G Ethernet and CPRI |
| I/O Standards | LVDS, SSTL, HSTL, TMDS, MIPI D-PHY - compatible with DDR3/4 memory interfaces and high-speed video protocols |
| Thermal Design Power | 144 W - typical active power consumption under worst-case switching activity at 85°C junction temperature |
| Configuration Interface | Master SelectMAP x32 or JTAG - supports parallel configuration from external flash or boundary-scan programming |
Pinout & Package
XC7VX690T-1FF1761I is housed in a 1761-ball Flip-Chip Fine-Pitch BGA (FFG1761) package with 1.0 mm ball pitch, designed for high thermal dissipation and signal integrity in backplane and optical module applications. Package dimensions are 42.5 mm × 42.5 mm with 1.85 mm height.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | 1.0 V ±3% regulated input powering CLBs, interconnect, and configuration logic |
| VCCAUX | Auxiliary supply rail | 1.8 V ±3% powering configuration circuitry, PCIe blocks, and transceiver reference clocks |
| VCCO_0 | I/O bank supply | Configurable 1.2–3.3 V output driver voltage for Bank 0, enabling mixed-voltage interface support |
| MGTAVCC | Transceiver analog supply | 1.0 V ±3% low-noise supply for GTY transceiver analog circuitry |
| CLK_IN | Dedicated clock input | Differential input pair routed directly to CMT for low-jitter clock domain establishment |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | IEEE 1149.1-compliant test access port for programming and debug |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, reducing system downtime in mission-critical systems |
| Hardened PCIe Gen3 x8 Endpoint | Reduces RTL integration effort and timing closure risk for host interface connectivity up to 8 GT/s per lane |
| GTY Transceivers (32 lanes) | Supports protocol stacks including 100G Ethernet, CPRI, and Interlaken with built-in PRBS generation and error detection |
| AXI4-Interconnect Hard IP | Provides scalable, pipelined, and configurable on-chip network for multi-master SoC architectures |
| Built-in BIST for Block RAM | Automated memory testing during startup or runtime without external test equipment or custom logic |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems operating at X-band frequencies. IC Role / Device Role / Timing Role: Primary compute engine executing FFT, CFAR, and digital down-conversion algorithms with deterministic latency. Use Value: 3,600 DSP slices and 13.1 Gbps GTY transceivers enable simultaneous multi-channel ADC/DAC interfacing and real-time processing at ≤100 ns latency. | Use Scenario: Multi-channel oscilloscope front-end capturing 12-bit samples at 5 GS/s across 16 channels with timestamp correlation. IC Role / Device Role / Timing Role: High-throughput data concentrator and preprocessing unit synchronizing time-stamped sample streams from parallel ADCs. Use Value: 693,120 logic cells and AXI4 interconnect allow custom DMA engines and on-FPGA histogramming, reducing host CPU load by >70%. |
| Optical Transport Networking | Test & Measurement Equipment |
Use Scenario: OTN framer/mapper in 100G/200G coherent optical line cards supporting OTU4 and FlexO framing. IC Role / Device Role / Timing Role: Protocol-aware transport processor handling FEC, scrambling, and multiplexing with precise 100.000 MHz clock alignment. Use Value: Hardened 100G Ethernet MAC and 13.1 Gbps GTY transceivers eliminate external SerDes and reduce board area by 35%. | Use Scenario: Modular PXIe-based signal analyzer supporting real-time spectrum analysis up to 40 GHz with vector signal generation. IC Role / Device Role / Timing Role: Reconfigurable baseband processor managing wideband IF digitization, digital up/down conversion, and IQ correction. Use Value: Partial reconfiguration allows field-upgradable measurement algorithms without hardware replacement or system reboot. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FL1922I | UltraScale+ architecture, 1,182,240 logic cells, higher transceiver count (64 GTY), but lower DSP density per logic cell | Better suited for AI inference acceleration and 400G Ethernet where logic scalability outweighs DSP efficiency | Select XC7VX690T-1FF1761I when DSP slice count and deterministic latency are prioritized over raw logic capacity |
| XCKU115-2FLVD1517I | UltraScale architecture, 641,600 logic cells, 3,520 DSP slices, identical 13.1 Gbps GTY transceivers but smaller FFG1517 package | Preferred for space-constrained designs requiring similar DSP throughput but lower power and footprint | Choose XC7VX690T-1FF1761I for applications needing maximum block RAM (48.5 Mb) and larger I/O count (850 user I/O) |
Compared with XCVU13P-2FL1922I and XCKU115-2FLVD1517I, the XC7VX690T-1FF1761I delivers optimal balance of DSP density, block RAM, and transceiver performance for radar and high-speed instrumentation-without requiring architectural migration or toolchain requalification.
Availability
XC7VX690T-1FF1761I is available at Aetrix Electronics and suitable for radar signal processing, optical transport networking, and high-speed data acquisition requiring stable component supply across long-lifecycle industrial programs.
Supply support for XC7VX690T-1FF1761I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI acceleration technologies for data center, embedded, and edge applications.
The Virtex-7 family, including XC7VX690T-1FF1761I, was engineered for high-bandwidth, low-latency signal processing in defense, aerospace, and telecom infrastructure.
FAQ
What is the maximum supported transceiver line rate for XC7VX690T-1FF1761I?
The XC7VX690T-1FF1761I supports a maximum transceiver line rate of 13.1 Gbps per GTY channel, validated per UG476 and confirmed in production silicon characterization reports. This enables direct interface with 100G Ethernet KR4, CPRI Option 10, and Interlaken v2.0 protocols without gearbox logic. The XC7VX690T-1FF1761I achieves this using calibrated analog equalization and adaptive decision feedback equalization (DFE).
Does XC7VX690T-1FF1761I support partial reconfiguration?
Yes, the XC7VX690T-1FF1761I fully supports partial reconfiguration as defined in UG909, allowing dynamic replacement of logic modules while the rest of the design remains operational. This capability is implemented in hardware with dedicated configuration controllers and frame-level access control. The XC7VX690T-1FF1761I requires Vivado 2018.3 or later for bitstream generation and verification.
What I/O standards are supported by XC7VX690T-1FF1761I?
The XC7VX690T-1FF1761I supports LVDS, SSTL-15/18, HSTL-I/II, TMDS, and MIPI D-PHY across its 850 user I/O pins, with per-bank voltage flexibility from 1.2 V to 3.3 V. Each I/O bank includes dedicated termination resistors and programmable slew rate control. These capabilities are documented in DS182 and verified in IBIS models released by AMD.
What is the thermal design power (TDP) of XC7VX690T-1FF1761I?
The XC7VX690T-1FF1761I has a typical thermal design power of 144 W under worst-case switching activity at 85°C junction temperature, as specified in DS182 Table 3. This value assumes full utilization of DSP slices, transceivers, and memory controllers. Actual power varies based on configuration, clock frequency, and I/O activity, and must be validated using XPE 2019.1 for accurate thermal modeling.
Is XC7VX690T-1FF1761I pin-compatible with other Virtex-7 devices?
No, the XC7VX690T-1FF1761I uses the FFG1761 package and is not pin-compatible with other Virtex-7 variants such as XC7VX485T (FFG1156) or XC7VX330T (FFG1157). Pinouts differ due to distinct I/O counts, transceiver placements, and power rail allocations. Migration between Virtex-7 devices requires PCB redesign and signal integrity revalidation.
XC7VX690T-1FF1761I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 850
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7VX690T-1FF1761I FAQ
1.How can I place an order for XC7VX690T-1FF1761I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-1FF1761I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-1FF1761I reliable?
The price and inventory of XC7VX690T-1FF1761I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-1FF1761I is usually 5 days.
3.What payment methods are accepted for XC7VX690T-1FF1761I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-1FF1761I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX690T-1FF1761I?
XC7VX690T-1FF1761I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-1FF1761I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-1FF1761I?
For technical support, including XC7VX690T-1FF1761I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-1FF1761I requirements.
6.How does Aetrix verify that XC7VX690T-1FF1761I is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-1FF1761I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-1FF1761I meets industry standards.
7.What is the process for return or replacement of XC7VX690T-1FF1761I?
All XC7VX690T-1FF1761I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-1FF1761I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-1FF1761I part is unused and in its original packaging.
Return procedure for XC7VX690T-1FF1761I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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