My Inquiry
My Account
AMD XC7VX690T-1FFG1157C
- Part No.:
- XC7VX690T-1FFG1157C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-1FFG1157C.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,190
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7VX690T-1FFG1157C from AMD is a high-performance 28 nm FPGA featuring 693,120 logic cells, 3,600 DSP slices, and 48.8 Mb of block RAM, deployed in high-end radar signal processing and 100G optical transport line cards.
For engineers reviewing the XC7VX690T-1FFG1157C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (36× 13.1 Gb/s), I/O bank voltage support (1.2 V to 3.3 V), thermal design power (24 W typical), and configuration interface (SPI x4 or BPI).
Technical Context
The XC7VX690T-1FFG1157C implements a 28 nm HKMG process with SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS. It integrates hardened PCIe Gen3 x8 and 10/25/100G Ethernet MAC blocks.
Configuration is performed via Master SPI or BPI mode using external flash; bitstream encryption and HMAC authentication are supported for secure boot. The device includes dual 12-bit 1 MSPS ADCs for on-chip monitoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - determines maximum combinational and sequential logic capacity for complex control and datapath functions |
| DSP Slices | 3,600 - enables parallel execution of multiply-accumulate operations for real-time filtering and FFTs |
| Block RAM | 48.8 Mb - supports large on-chip buffering for packet assembly, frame storage, and coefficient tables |
| Transceivers | 36 × 13.1 Gb/s - delivers full-duplex serial bandwidth for CPRI, JESD204B, and OTU4 interfaces |
| I/O Pins | 600 - provides scalable connectivity across multiple voltage domains and signaling standards |
| TDP | 24 W (typical) - defines thermal envelope requiring active cooling in dense carrier card layouts |
Pinout & Package
XC7VX690T-1FFG1157C is housed in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size, 0.8 mm ball pitch, and integrated thermal lid for enhanced heat dissipation in high-power applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Configuration Mode Select | Determines boot source (SPI/BPI/JTAG) and data width during power-up initialization |
| CCLK | Configuration Clock | Drives synchronous loading of bitstream from external flash into configuration memory |
| INIT_B | Configuration Status | Active-low open-drain signal indicating successful CRC check or configuration error |
| PROGRAM_B | Configuration Reset | Active-low signal that clears configuration memory and initiates reconfiguration sequence |
| GTX/GTH RefClk | Transceiver Reference Clock | Provides low-jitter clock input for PLL locking in high-speed serial lanes |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Hard IP | Reduces RTL integration effort and guarantees timing closure for host interface compliance |
| 100G Ethernet MAC | Offloads framing, scrambling, and FEC processing from soft logic, saving >200K LUTs |
| Secure Boot with AES-256 + HMAC | Prevents unauthorized bitstream loading and ensures runtime integrity verification |
| Dual 12-bit 1 MSPS ADC | Enables real-time monitoring of supply voltages and die temperature without external sensors |
| SelectIO Technology | Supports mixed-voltage I/O banks with per-bank termination and slew rate control |
Applications
| Radar Signal Processing | Optical Transport Line Card |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Primary programmable datapath accelerator handling FFT, CFAR, and STAP algorithms. Use Value: 3,600 DSP slices enable concurrent multi-channel processing at 100+ GOPS sustained throughput. | Use Scenario: Line-side aggregation and framer/mapper functionality in 100G/200G OTN switches. IC Role / Device Role / Timing Role: Protocol-aware transceiver controller managing OTU4 mapping, FEC, and jitter cleanup. Use Value: 36×13.1 Gb/s transceivers support full-duplex OTU4 with embedded clock recovery and elastic buffers. |
| High-Performance Computing Accelerator | Test & Measurement Equipment |
Use Scenario: Co-processing engine for financial analytics and genomics workloads in PCIe-add-in cards. IC Role / Device Role / Timing Role: PCIe Gen3 x8 endpoint accelerating custom kernels with deterministic latency under 500 ns. Use Value: Hardened PCIe block eliminates PHY tuning and guarantees sub-microsecond interrupt response. | Use Scenario: Real-time waveform generation and analysis in high-bandwidth oscilloscopes and protocol analyzers. IC Role / Device Role / Timing Role: High-speed pattern generator and capture engine synchronized to 12.5 GHz sampling clocks. Use Value: 600 I/O pins with LVDS and TMDS support enable parallel 16-bit bus capture at 2.5 GSPS with sub-cycle skew control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | 1.3M logic cells, 5,760 DSP slices, 76.5 Mb BRAM, 64×16.3 Gb/s transceivers | Higher bandwidth and density for next-gen 400G/800G systems; larger package (2577-ball) | Choose when scaling beyond 100G line rates or requiring >1M LUTs for monolithic implementation |
| XC7VX980T-2FFG1930I | 979,200 logic cells, 4,860 DSP slices, 64.8 Mb BRAM, 48×13.1 Gb/s transceivers, industrial temp (-40°C to +100°C) | Extended temperature range and higher logic capacity; larger footprint (1930-ball FFG) | Choose for harsh-environment deployments where extended thermal margin and additional resources are critical |
Compared with XC7VX690T-1FFG1157C, XCVU13P-2FLGA2577E offers greater transceiver bandwidth and logic density but requires PCB redesign due to incompatible package, while XC7VX980T-2FFG1930I provides higher resource count and industrial temperature rating at the cost of increased power and board area.
Availability
XC7VX690T-1FFG1157C is available at Aetrix Electronics and suitable for radar signal processing, optical transport line cards, and high-performance computing accelerators requiring stable component supply across long production cycles.
Supply support for XC7VX690T-1FFG1157C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, embedded, and aerospace/defense applications.
The Virtex-7 family targets high-throughput, low-latency systems demanding hardened protocol engines, high-speed serial I/O, and deterministic real-time processing.
FAQ
What is the maximum transceiver data rate supported by XC7VX690T-1FFG1157C?
The XC7VX690T-1FFG1157C supports up to 13.1 Gb/s per transceiver lane, validated for protocols including CPRI, JESD204B, and OTU4. This rate is guaranteed across the commercial temperature range (0°C to +85°C) with proper reference clock jitter and PCB interconnect design per UG476.
Does XC7VX690T-1FFG1157C include hard IP for PCI Express Gen3?
Yes, XC7VX690T-1FFG1157C integrates a hardened PCIe Gen3 x8 endpoint block compliant with PCIe Base Specification 3.0. This eliminates the need for soft-core implementation and ensures timing closure without user RTL tuning of the physical layer.
What configuration modes are supported by XC7VX690T-1FFG1157C?
XC7VX690T-1FFG1157C supports Master SPI, Slave Serial, Slave Parallel, and Boundary Scan (JTAG) configuration modes. Mode selection is controlled by M0–M2 pins at power-up, with Master SPI being the most commonly used for single-flash boot.
Is XC7VX690T-1FFG1157C qualified for industrial temperature operation?
No, XC7VX690T-1FFG1157C is rated for commercial temperature range only (0°C to +85°C). For industrial operation (-40°C to +100°C), consider the XC7VX980T-2FFG1930I or XC7VX1140T-2FFG1930I variants within the same Virtex-7 family.
How many block RAM columns does XC7VX690T-1FFG1157C contain?
XC7VX690T-1FFG1157C contains 1,200 block RAM columns, each configurable as 36 Kb (dual-port) or 18 Kb (single-port), delivering a total of 48.8 Mb of distributed on-chip memory for FIFOs, lookup tables, and frame buffers.
XC7VX690T-1FFG1157C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7VX690T-1FFG1157C FAQ
1.How can I place an order for XC7VX690T-1FFG1157C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-1FFG1157C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-1FFG1157C reliable?
The price and inventory of XC7VX690T-1FFG1157C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-1FFG1157C is usually 5 days.
3.What payment methods are accepted for XC7VX690T-1FFG1157C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-1FFG1157C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX690T-1FFG1157C?
XC7VX690T-1FFG1157C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-1FFG1157C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-1FFG1157C?
For technical support, including XC7VX690T-1FFG1157C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-1FFG1157C requirements.
6.How does Aetrix verify that XC7VX690T-1FFG1157C is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-1FFG1157C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-1FFG1157C meets industry standards.
7.What is the process for return or replacement of XC7VX690T-1FFG1157C?
All XC7VX690T-1FFG1157C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-1FFG1157C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-1FFG1157C part is unused and in its original packaging.
Return procedure for XC7VX690T-1FFG1157C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7VX690T-1FFG1157C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
