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AMD XC7VX690T-1FFG1157I

Part No.:
XC7VX690T-1FFG1157I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1156-BBGA, FCBGA
Datasheet:
AetrixXC7VX690T-1FFG1157I.pdf
Description:
IC FPGA 600 I/O 1157FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,874

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Product details

Overview

XC7VX690T-1FFG1157I from AMD is a high-performance 28 nm Virtex-7 FPGA with 693,120 logic cells, 3,648 DSP slices, and 48.5 Mb of block RAM. It features 1157-pin flip-chip BGA (FFG) packaging, supports transceivers up to 13.1 Gb/s, and targets high-speed serial interface and signal processing applications in radar and wired communications.

For engineers reviewing the XC7VX690T-1FFG1157I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O bank voltage support (1.2 V to 3.3 V), thermal design power (31 W typical), and configuration interface compatibility (SPIx4, SelectMAP).

Technical Context

The XC7VX690T-1FFG1157I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and hardened PCIe Gen3 x8 endpoint/switch endpoints. It integrates 72 GTX transceivers with built-in PRBS generators/checkers and 8 clock management tiles (CMTs) each containing a PLL and MMCM.

Configuration occurs via Master SPI or Slave SelectMAP mode using external flash or processor control. The device supports partial reconfiguration, AXI4-Stream interfaces, and JTAG boundary-scan IEEE 1149.1 compliance for debug and test.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells693,120 - total available LUT-based programmable resources for combinatorial and sequential logic implementation
DSP Slices3,648 - dedicated arithmetic units supporting 25×18-bit multiply-accumulate with pipeline registers
Block RAM48.5 Mb - distributed as 36 Kb BRAM primitives usable as dual-port memory or FIFO buffers
Transceivers72 GTX - serial I/O lanes supporting 600 Mb/s to 13.1 Gb/s with protocol-specific encoding (8B/10B, 64B/66B)
I/O Pins600 - user-configurable single-ended and differential I/Os across 24 banks with voltage support from 1.2 V to 3.3 V
TDP31 W typical - thermal design power at maximum operating frequency and junction temperature of 100 °C
Configuration InterfaceMaster SPI x4 / Slave SelectMAP - determines boot source and bitstream loading method during power-up

Pinout & Package

XC7VX690T-1FFG1157I uses a 1157-pin flip-chip fine-pitch ball grid array (FFG1157) package with 35 × 35 mm body size, 0.8 mm pitch, and thermal lid. Pin assignment follows Xilinx UG475 v1.15 (Virtex-7 Packaging and Pinout) for this specific speed grade (-1) and package variant.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration Clock InputDrives internal configuration logic during Master SPI mode; must be driven by external source or internal oscillator
DINSerial Data InputCarries configuration bitstream in Master SPI mode; tied high when unused in SelectMAP
INIT_BConfiguration Status OutputOpen-drain active-low signal indicating configuration status and error detection
PROGRAM_BConfiguration Reset InputActive-low asynchronous reset that clears configuration memory and restarts boot sequence
M0–M2Mode Selection InputsThree-pin bus defining configuration mode (SPI, BPI, SelectMAP, JTAG) at power-up
GTXREFCLK[0–1]Transceiver Reference Clock InputDedicated differential inputs for GTX transceiver PLL reference; require AC-coupled 100 Ω termination

Key Features

FeatureDesign Value
Hardened PCIe Gen3 EndpointIntegrated PHY and data link layer supporting x1/x2/x4/x8 lane widths without soft IP overhead
Partial Reconfiguration SupportEnables dynamic module swapping in operational systems without full FPGA reset or system interruption
AXI4-Stream Interface ComplianceNative support for high-throughput streaming data transfer between IP cores and external memory/controllers
Multi-Voltage I/O Banks24 independent banks allow simultaneous interfacing to 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V devices
JTAG Boundary-ScanIEEE 1149.1-compliant test access port enabling board-level interconnect testing and debug visibility

Applications

Radar Signal ProcessingHigh-Speed Wired Communications

Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems.

IC Role / Device Role / Timing Role: Primary compute fabric executing adaptive filtering, FFT, and CFAR algorithms with deterministic latency.

Use Value: 3,648 DSP slices enable concurrent 1024-point FFTs at >1 kHz update rate while maintaining sub-100 ns timing closure.

Use Scenario: Line card implementation in 100 GbE transport switches supporting OTU4 and FlexO framing.

IC Role / Device Role / Timing Role: SerDes aggregation and packet classification engine interfacing with MAC and PHY layers.

Use Value: 72 GTX transceivers provide 24 × 4-lane groups for independent 100 GbE ports with integrated FEC and scrambling.

Medical Imaging BackendTest & Measurement Instrumentation

Use Scenario: Raw data preprocessing and image reconstruction pipeline in digital PET/CT scanners.

IC Role / Device Role / Timing Role: High-bandwidth data concentrator and real-time histogramming accelerator feeding GPU-based reconstruction.

Use Value: 48.5 Mb block RAM enables on-chip storage of 128 million coincidence event bins with zero off-chip latency.

Use Scenario: Modular digitizer platform supporting multi-channel 12-bit @ 1.25 GS/s sampling with real-time spectral analysis.

IC Role / Device Role / Timing Role: Time-interleaved ADC controller and FFT co-processor with deterministic trigger synchronization.

Use Value: 693,120 logic cells implement 16 parallel 1024-point FFT engines with cycle-accurate sample alignment across channels.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU13P-2FLGA2577E16 nm UltraScale+ architecture; 1,127,200 logic cells; higher transceiver count (128 GTY); lower TDP per logic cellTargets next-gen 400 GbE and AI inference acceleration where density and bandwidth exceed Virtex-7 capabilitySelect when migrating to newer process node with need for >100 GbE lane aggregation or embedded DDR4 memory controllers
XC7VX980T-2FFG1930ILarger die size; 979,200 logic cells; 1930-pin FFG package; higher static power and thermal envelopeSuitable for ultra-dense compute tasks requiring >800K LUTs and extended I/O count beyond 600 pinsChoose only if application requires additional logic capacity and can accommodate larger PCB footprint and cooling requirements

Compared with XC7VX690T-1FFG1157I, the XCVU13P-2FLGA2577E delivers 62% more logic and 78% more transceivers but requires new PCB layout and toolchain migration, while the XC7VX980T-2FFG1930I offers 41% more LUTs in a thermally heavier package-neither is pin-compatible, and both demand revised power delivery and thermal design.

Availability

XC7VX690T-1FFG1157I is available at Aetrix Electronics and suitable for radar signal processing, high-speed wired communications, medical imaging backend, and test & measurement instrumentation requiring stable component supply across long-life industrial programs.

Supply support for XC7VX690T-1FFG1157I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and software-defined hardware solutions.

The Virtex-7 family was originally designed by Xilinx for high-performance signal processing, high-bandwidth connectivity, and compute-intensive applications in aerospace, defense, and wired infrastructure.

FAQ

What is the maximum supported transceiver data rate for XC7VX690T-1FFG1157I?

The XC7VX690T-1FFG1157I supports GTX transceivers with a maximum data rate of 13.1 Gb/s. This rate applies to individual lanes under specified voltage, temperature, and reference clock conditions per UG476 (Virtex-7 Transceivers User Guide). The XC7VX690T-1FFG1157I achieves this performance using 2.5 V VCCINT and operation within industrial temperature range (–40 °C to +100 °C).

Does XC7VX690T-1FFG1157I support partial reconfiguration?

Yes, XC7VX690T-1FFG1157I supports partial reconfiguration through its configuration logic and ICAP interface. This capability allows dynamic replacement of logic modules without resetting the entire device. The XC7VX690T-1FFG1157I requires use of Vivado Design Suite 2018.3 or later and adherence to floorplanning constraints defined in UG909 (Partial Reconfiguration User Guide).

What configuration modes does XC7VX690T-1FFG1157I support?

XC7VX690T-1FFG1157I supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Mode selection is determined by M0–M2 pin states at power-up. The XC7VX690T-1FFG1157I defaults to Master SPI when all three pins are pulled low, and requires external flash memory with proper address mapping for reliable boot.

What is the I/O voltage range supported by XC7VX690T-1FFG1157I?

XC7VX690T-1FFG1157I supports single-ended and differential I/O standards across 24 banks with VCCO ranging from 1.2 V to 3.3 V per bank. Each bank operates independently, allowing mixed-voltage interfaces. The XC7VX690T-1FFG1157I requires strict decoupling and sequencing per UG475 to prevent I/O damage during power-up.

Is XC7VX690T-1FFG1157I compatible with Vivado Design Suite?

Yes, XC7VX690T-1FFG1157I is fully supported in Vivado Design Suite starting from version 2013.4. Synthesis, implementation, and bitstream generation for XC7VX690T-1FFG1157I require the Virtex-7 device libraries and license entitlements included in the full edition of Vivado.

XC7VX690T-1FFG1157I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-7 XT
Package/Case:
1156-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
54150
Number of Logic Elements/Cells:
693120
Total RAM Bits:
54190080
Number of I/O:
600
Number of Gates:
-
Voltage - Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1157-FCBGA (35x35)

XC7VX690T-1FFG1157I FAQ

1.How can I place an order for XC7VX690T-1FFG1157I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7VX690T-1FFG1157I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7VX690T-1FFG1157I reliable?

The price and inventory of XC7VX690T-1FFG1157I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-1FFG1157I is usually 5 days.

3.What payment methods are accepted for XC7VX690T-1FFG1157I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-1FFG1157I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7VX690T-1FFG1157I?

XC7VX690T-1FFG1157I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7VX690T-1FFG1157I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7VX690T-1FFG1157I?

For technical support, including XC7VX690T-1FFG1157I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-1FFG1157I requirements.

6.How does Aetrix verify that XC7VX690T-1FFG1157I is sourced from the original manufacturer or authorized distributors?

All XC7VX690T-1FFG1157I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-1FFG1157I meets industry standards.

7.What is the process for return or replacement of XC7VX690T-1FFG1157I?

All XC7VX690T-1FFG1157I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-1FFG1157I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7VX690T-1FFG1157I part is unused and in its original packaging.

Return procedure for XC7VX690T-1FFG1157I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7VX690T-1FFG1157I Tags

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