AMD XC7VX690T-1FFG1157I
- Part No.:
- XC7VX690T-1FFG1157I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-1FFG1157I.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7VX690T-1FFG1157I from AMD is a high-performance 28 nm Virtex-7 FPGA with 693,120 logic cells, 3,648 DSP slices, and 48.5 Mb of block RAM. It features 1157-pin flip-chip BGA (FFG) packaging, supports transceivers up to 13.1 Gb/s, and targets high-speed serial interface and signal processing applications in radar and wired communications.
For engineers reviewing the XC7VX690T-1FFG1157I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O bank voltage support (1.2 V to 3.3 V), thermal design power (31 W typical), and configuration interface compatibility (SPIx4, SelectMAP).
Technical Context
The XC7VX690T-1FFG1157I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and hardened PCIe Gen3 x8 endpoint/switch endpoints. It integrates 72 GTX transceivers with built-in PRBS generators/checkers and 8 clock management tiles (CMTs) each containing a PLL and MMCM.
Configuration occurs via Master SPI or Slave SelectMAP mode using external flash or processor control. The device supports partial reconfiguration, AXI4-Stream interfaces, and JTAG boundary-scan IEEE 1149.1 compliance for debug and test.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| DSP Slices | 3,648 - dedicated arithmetic units supporting 25×18-bit multiply-accumulate with pipeline registers |
| Block RAM | 48.5 Mb - distributed as 36 Kb BRAM primitives usable as dual-port memory or FIFO buffers |
| Transceivers | 72 GTX - serial I/O lanes supporting 600 Mb/s to 13.1 Gb/s with protocol-specific encoding (8B/10B, 64B/66B) |
| I/O Pins | 600 - user-configurable single-ended and differential I/Os across 24 banks with voltage support from 1.2 V to 3.3 V |
| TDP | 31 W typical - thermal design power at maximum operating frequency and junction temperature of 100 °C |
| Configuration Interface | Master SPI x4 / Slave SelectMAP - determines boot source and bitstream loading method during power-up |
Pinout & Package
XC7VX690T-1FFG1157I uses a 1157-pin flip-chip fine-pitch ball grid array (FFG1157) package with 35 × 35 mm body size, 0.8 mm pitch, and thermal lid. Pin assignment follows Xilinx UG475 v1.15 (Virtex-7 Packaging and Pinout) for this specific speed grade (-1) and package variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during Master SPI mode; must be driven by external source or internal oscillator |
| DIN | Serial Data Input | Carries configuration bitstream in Master SPI mode; tied high when unused in SelectMAP |
| INIT_B | Configuration Status Output | Open-drain active-low signal indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset Input | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| M0–M2 | Mode Selection Inputs | Three-pin bus defining configuration mode (SPI, BPI, SelectMAP, JTAG) at power-up |
| GTXREFCLK[0–1] | Transceiver Reference Clock Input | Dedicated differential inputs for GTX transceiver PLL reference; require AC-coupled 100 Ω termination |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 Endpoint | Integrated PHY and data link layer supporting x1/x2/x4/x8 lane widths without soft IP overhead |
| Partial Reconfiguration Support | Enables dynamic module swapping in operational systems without full FPGA reset or system interruption |
| AXI4-Stream Interface Compliance | Native support for high-throughput streaming data transfer between IP cores and external memory/controllers |
| Multi-Voltage I/O Banks | 24 independent banks allow simultaneous interfacing to 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V devices |
| JTAG Boundary-Scan | IEEE 1149.1-compliant test access port enabling board-level interconnect testing and debug visibility |
Applications
| Radar Signal Processing | High-Speed Wired Communications |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: Primary compute fabric executing adaptive filtering, FFT, and CFAR algorithms with deterministic latency. Use Value: 3,648 DSP slices enable concurrent 1024-point FFTs at >1 kHz update rate while maintaining sub-100 ns timing closure. | Use Scenario: Line card implementation in 100 GbE transport switches supporting OTU4 and FlexO framing. IC Role / Device Role / Timing Role: SerDes aggregation and packet classification engine interfacing with MAC and PHY layers. Use Value: 72 GTX transceivers provide 24 × 4-lane groups for independent 100 GbE ports with integrated FEC and scrambling. |
| Medical Imaging Backend | Test & Measurement Instrumentation |
Use Scenario: Raw data preprocessing and image reconstruction pipeline in digital PET/CT scanners. IC Role / Device Role / Timing Role: High-bandwidth data concentrator and real-time histogramming accelerator feeding GPU-based reconstruction. Use Value: 48.5 Mb block RAM enables on-chip storage of 128 million coincidence event bins with zero off-chip latency. | Use Scenario: Modular digitizer platform supporting multi-channel 12-bit @ 1.25 GS/s sampling with real-time spectral analysis. IC Role / Device Role / Timing Role: Time-interleaved ADC controller and FFT co-processor with deterministic trigger synchronization. Use Value: 693,120 logic cells implement 16 parallel 1024-point FFT engines with cycle-accurate sample alignment across channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | 16 nm UltraScale+ architecture; 1,127,200 logic cells; higher transceiver count (128 GTY); lower TDP per logic cell | Targets next-gen 400 GbE and AI inference acceleration where density and bandwidth exceed Virtex-7 capability | Select when migrating to newer process node with need for >100 GbE lane aggregation or embedded DDR4 memory controllers |
| XC7VX980T-2FFG1930I | Larger die size; 979,200 logic cells; 1930-pin FFG package; higher static power and thermal envelope | Suitable for ultra-dense compute tasks requiring >800K LUTs and extended I/O count beyond 600 pins | Choose only if application requires additional logic capacity and can accommodate larger PCB footprint and cooling requirements |
Compared with XC7VX690T-1FFG1157I, the XCVU13P-2FLGA2577E delivers 62% more logic and 78% more transceivers but requires new PCB layout and toolchain migration, while the XC7VX980T-2FFG1930I offers 41% more LUTs in a thermally heavier package-neither is pin-compatible, and both demand revised power delivery and thermal design.
Availability
XC7VX690T-1FFG1157I is available at Aetrix Electronics and suitable for radar signal processing, high-speed wired communications, medical imaging backend, and test & measurement instrumentation requiring stable component supply across long-life industrial programs.
Supply support for XC7VX690T-1FFG1157I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and software-defined hardware solutions.
The Virtex-7 family was originally designed by Xilinx for high-performance signal processing, high-bandwidth connectivity, and compute-intensive applications in aerospace, defense, and wired infrastructure.
FAQ
What is the maximum supported transceiver data rate for XC7VX690T-1FFG1157I?
The XC7VX690T-1FFG1157I supports GTX transceivers with a maximum data rate of 13.1 Gb/s. This rate applies to individual lanes under specified voltage, temperature, and reference clock conditions per UG476 (Virtex-7 Transceivers User Guide). The XC7VX690T-1FFG1157I achieves this performance using 2.5 V VCCINT and operation within industrial temperature range (–40 °C to +100 °C).
Does XC7VX690T-1FFG1157I support partial reconfiguration?
Yes, XC7VX690T-1FFG1157I supports partial reconfiguration through its configuration logic and ICAP interface. This capability allows dynamic replacement of logic modules without resetting the entire device. The XC7VX690T-1FFG1157I requires use of Vivado Design Suite 2018.3 or later and adherence to floorplanning constraints defined in UG909 (Partial Reconfiguration User Guide).
What configuration modes does XC7VX690T-1FFG1157I support?
XC7VX690T-1FFG1157I supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Mode selection is determined by M0–M2 pin states at power-up. The XC7VX690T-1FFG1157I defaults to Master SPI when all three pins are pulled low, and requires external flash memory with proper address mapping for reliable boot.
What is the I/O voltage range supported by XC7VX690T-1FFG1157I?
XC7VX690T-1FFG1157I supports single-ended and differential I/O standards across 24 banks with VCCO ranging from 1.2 V to 3.3 V per bank. Each bank operates independently, allowing mixed-voltage interfaces. The XC7VX690T-1FFG1157I requires strict decoupling and sequencing per UG475 to prevent I/O damage during power-up.
Is XC7VX690T-1FFG1157I compatible with Vivado Design Suite?
Yes, XC7VX690T-1FFG1157I is fully supported in Vivado Design Suite starting from version 2013.4. Synthesis, implementation, and bitstream generation for XC7VX690T-1FFG1157I require the Virtex-7 device libraries and license entitlements included in the full edition of Vivado.
XC7VX690T-1FFG1157I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7VX690T-1FFG1157I FAQ
1.How can I place an order for XC7VX690T-1FFG1157I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-1FFG1157I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC7VX690T-1FFG1157I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-1FFG1157I is usually 5 days.
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5.How can I obtain technical support or documentation for XC7VX690T-1FFG1157I?
For technical support, including XC7VX690T-1FFG1157I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-1FFG1157I requirements.
6.How does Aetrix verify that XC7VX690T-1FFG1157I is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-1FFG1157I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-1FFG1157I meets industry standards.
7.What is the process for return or replacement of XC7VX690T-1FFG1157I?
All XC7VX690T-1FFG1157I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-1FFG1157I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-1FFG1157I part is unused and in its original packaging.
Return procedure for XC7VX690T-1FFG1157I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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