AMD XC7VX690T-1FFG1761C
- Part No.:
- XC7VX690T-1FFG1761C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-1FFG1761C.pdf
- Description:
- IC FPGA 850 I/O 1761FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7VX690T-1FFG1761C from AMD is a high-performance 28 nm Virtex-7 FPGA with 693,120 logic cells, 3,648 DSP slices, and 56.9 Mb of block RAM. It features 1,761-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) packaging and supports transceiver line rates up to 13.1 Gb/s. It is deployed in high-end radar signal processing systems requiring deterministic low-latency data path implementation.
For engineers reviewing the XC7VX690T-1FFG1761C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count, GTY lane configuration, I/O bank voltage support, thermal design power envelope, and PCIe Gen3 endpoint compliance.
Technical Context
The XC7VX690T-1FFG1761C implements a heterogeneous architecture integrating programmable logic, hardened IP blocks, and high-speed serial transceivers. It includes 24 GTY transceivers supporting protocols including PCIe Gen3, 10G Ethernet, and CPRI, with each GTY capable of 10.3125–12.5 Gb/s operation and built-in PRBS generation/checking.
It supports SelectIO standards across 18 I/O banks with voltage ranges from 1.2 V to 1.8 V, and integrates dual 36-bit AXI-HP slave interfaces for high-bandwidth memory coherency. Configuration is performed via quad-SPI or JTAG, with bitstream encryption and HMAC authentication enabled.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - determines maximum combinational/sequential logic capacity for custom datapath or control logic implementation |
| DSP Slices | 3,648 - enables parallel execution of fixed/floating-point multiply-accumulate operations in radar beamforming |
| Block RAM | 56.9 Mb - supports large on-chip buffering for real-time SAR image frame storage without external DRAM |
| GTY Transceivers | 24 × 13.1 Gb/s - provides native support for 24-lane 10G-KR or 12× PCIe Gen3 x2 endpoints |
| I/O Banks | 18 - allows mixed-voltage interface to ADCs, DACs, and FMC mezzanine cards simultaneously |
| Configuration Interface | Quad-SPI + JTAG - enables secure, field-upgradable bitstream loading with AES-256 decryption |
Pinout & Package
XC7VX690T-1FFG1761C uses a 1761-ball Flip-Chip Fine-Pitch BGA (FFG) package with 1.0 mm ball pitch, thermal lid, and standard JEDEC MO-271AC mechanical outline. The package supports conduction cooling and meets IPC/JEDEC J-STD-020 moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% regulated input powering CLB, BRAM, and DSP logic; requires low-noise filtering |
| VCCAUX | Auxiliary supply | 1.8 V ±3% powering configuration logic, clock management, and GTY reference circuitry |
| VCCO_0 | I/O bank supply | Configurable 1.2–1.8 V output driver voltage for Bank 0; sets signal swing and termination compatibility |
| MGTAVCC | GTY analog supply | 1.0 V ±3% dedicated analog rail for GTY transceiver PLLs and serializers |
| CLK_IN1_N/P | Dedicated clock input | Differential pair for primary system clock; connects directly to MMCM for jitter cleaning and frequency synthesis |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 Endpoint | Integrated PHY and DMA engine enabling direct root-complex-to-endpoint link without external bridge IC |
| AXI4-Interconnect with Coherency | Supports cache-coherent multi-master transactions between processor subsystem and programmable logic |
| UltraScale+ Compatible Bitstream | Enables partial reconfiguration and in-system bitstream updates without full device reset |
| SEU Mitigation Logic | Dual-module redundancy with automatic error detection and correction for critical configuration frames |
Applications
| Radar Signal Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: FPGA fabric implements matched filter, CFAR, and beamformer logic; GTY transceivers interface to RF front-end ADC/DAC modules. Use Value: Deterministic sub-100 ns latency path enables closed-loop adaptive waveform update within pulse repetition interval. | Use Scenario: Offloading FFT and matrix inversion kernels from host CPU in scientific computing clusters. IC Role / Device Role / Timing Role: Configured as PCIe Gen3 x8 endpoint accelerator with AXI-HP interfaces to DDR4 memory controllers. Use Value: 24 GTY lanes enable concurrent 10G Ethernet telemetry and PCIe host communication without bandwidth contention. |
| Medical Imaging Backend | Test & Measurement Instrumentation |
Use Scenario: Digital backend for 3T MRI gradient controller with real-time eddy-current compensation. IC Role / Device Role / Timing Role: Implements time-critical FIR filters and phase-locked loop synchronization to gradient coil drivers. Use Value: 3,648 DSP slices allow simultaneous execution of 128-channel real-time convolution with <1 µs group delay. | Use Scenario: High-resolution oscilloscope digitizer with 12-bit @ 5 GS/s sampling and deep memory capture. IC Role / Device Role / Timing Role: Manages ADC interface, on-chip pattern memory, trigger arbitration, and PCIe streaming to host PC. Use Value: 56.9 Mb block RAM stores >200 ms of raw waveform data at full sample rate before compression or analysis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | 1.3M logic cells, 5,760 DSP slices, 72.2 Mb BRAM, 64 GTY transceivers, 2577-ball FCBGA | Higher transceiver count and logic density; supports 25G Ethernet and PCIe Gen4 | Preferred when upgrading from XC7VX690T-1FFG1761C to meet higher bandwidth or larger algorithm footprint requirements |
| XC7VX485T-2FFG1761I | 485,760 logic cells, 2,880 DSP slices, 37.1 Mb BRAM, 16 GTY transceivers, same 1761-ball FFG package | Lower logic and DSP resources; identical pinout and thermal profile but reduced I/O drive strength | Used where cost reduction is prioritized and system-level performance margin permits resource downscaling |
Compared with XC7VX690T-1FFG1761C, the XCVU13P-2FLGA2577E offers scalable bandwidth for next-generation protocols, while the XC7VX485T-2FFG1761I retains mechanical compatibility but trades off computational throughput for lower power and cost.
Availability
XC7VX690T-1FFG1761C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and high-performance computing acceleration requiring stable component supply across long-life industrial programs.
Supply support for XC7VX690T-1FFG1761C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, AI acceleration, and CPU/GPU architectures.
The Virtex-7 family was designed for ultra-high-bandwidth, low-latency signal processing in defense, aerospace, and scientific instrumentation applications where deterministic timing and hardened protocol engines are critical.
FAQ
What is the maximum supported transceiver line rate for XC7VX690T-1FFG1761C?
The XC7VX690T-1FFG1761C supports GTY transceivers operating at line rates from 10.3125 Gb/s up to 13.1 Gb/s. This range enables compliance with PCIe Gen3 (8.0 Gb/s), 10GBASE-KR (10.3125 Gb/s), and CPRI Option 10 (10.1376 Gb/s). Each GTY channel includes built-in clock data recovery and PRBS pattern generation for link validation.
Does XC7VX690T-1FFG1761C support partial reconfiguration?
Yes, XC7VX690T-1FFG1761C supports dynamic partial reconfiguration through its ICAP interface and hierarchical design flow. This capability allows runtime swapping of logic modules-such as filter coefficients or protocol stacks-without resetting the entire device. The feature is validated in Vivado 2019.2 and later toolchains for mission-critical applications requiring continuous operation.
What I/O standards are supported by XC7VX690T-1FFG1761C?
XC7VX690T-1FFG1761C supports LVCMOS, SSTL, HSTL, DIFF_HSTL, DIFF_SSTL, and TMDS across its 18 I/O banks. Voltage ranges span 1.2 V to 1.8 V per bank, enabling direct interfacing to high-speed ADCs (e.g., AD9680), FMC mezzanine cards, and DDR3/DDR4 memory controllers without level-shifting components.
Is XC7VX690T-1FFG1761C qualified for extended temperature operation?
No, XC7VX690T-1FFG1761C is rated for commercial temperature range (0 °C to +85 °C case temperature). For extended temperature applications (–40 °C to +100 °C), the industrial-grade variant XC7VX690T-1FFG1761I must be selected, which undergoes additional screening and qualification per MIL-STD-883 Class B requirements.
How many PCIe Gen3 lanes does XC7VX690T-1FFG1761C support natively?
XC7VX690T-1FFG1761C integrates 24 GTY transceivers, each configurable as a PCIe Gen3 endpoint lane. It supports up to 24 × 1-lane, 12 × 2-lane, or 8 × 3-lane PCIe Gen3 links. The hardened PCIe block includes integrated DMA, TLP parsing, and MSI-X interrupt handling, eliminating need for external PCIe switch logic in endpoint designs.
XC7VX690T-1FFG1761C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 850
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7VX690T-1FFG1761C FAQ
1.How can I place an order for XC7VX690T-1FFG1761C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-1FFG1761C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC7VX690T-1FFG1761C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-1FFG1761C is usually 5 days.
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5.How can I obtain technical support or documentation for XC7VX690T-1FFG1761C?
For technical support, including XC7VX690T-1FFG1761C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-1FFG1761C requirements.
6.How does Aetrix verify that XC7VX690T-1FFG1761C is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-1FFG1761C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-1FFG1761C meets industry standards.
7.What is the process for return or replacement of XC7VX690T-1FFG1761C?
All XC7VX690T-1FFG1761C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-1FFG1761C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-1FFG1761C part is unused and in its original packaging.
Return procedure for XC7VX690T-1FFG1761C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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