My Inquiry
My Account
AMD XC7VX690T-1FFG1926I
- Part No.:
- XC7VX690T-1FFG1926I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-1FFG1926I.pdf
- Description:
- IC FPGA 720 I/O 1926FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,433
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7VX690T-1FFG1926I from AMD is a high-performance 28 nm Virtex-7 FPGA with 693,120 logic cells, 3,648 DSP slices, and 56.8 Mb of block RAM. It features 1,926 I/O pins in a flip-chip BGA package and supports transceivers up to 13.1 Gb/s for high-speed serial communication in radar signal processing systems.
For engineers reviewing the XC7VX690T-1FFG1926I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage flexibility, thermal performance at -40°C to +100°C, and support for PCI Express Gen3 x8 endpoint configuration.
Technical Context
The XC7VX690T-1FFG1926I implements a 28 nm HKMG process-based architecture with SelectIO technology supporting LVDS, SSTL, HSTL, and TMDS standards across 32 I/O banks. Its transceivers integrate CDR circuits and support protocols including CPRI, SRIO, and 10GBASE-R.
Configuration is performed via Master SPI or JTAG, with dual-boot capability using external BPI Flash. The device includes hardened IP blocks for PCIe Gen3, Gigabit Ethernet MAC, and AXI interconnect infrastructure, all operating within a core voltage range of 0.95–1.05 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - determines maximum combinational/sequential logic capacity for complex algorithm acceleration |
| DSP Slices | 3,648 - enables parallel fixed/floating-point computation for real-time FFT and filtering |
| Block RAM | 56.8 Mb - supports large on-chip data buffering for video frame storage or packet queuing |
| Transceiver Speed | 13.1 Gb/s - meets line-rate requirements for 10G Ethernet and CPRI Option 7 interfaces |
| I/O Pins | 1,926 - provides high-density connectivity for multi-board backplane or RF front-end interfacing |
| Operating Temp | -40°C to +100°C - qualified for industrial and aerospace environments without derating |
| Core Voltage | 0.95–1.05 V - defines tight regulation requirement for power delivery network design |
Pinout & Package
XC7VX690T-1FFG1926I is housed in a 1926-pin flip-chip fine-pitch BGA (FFG) package with 35 × 35 mm body size and 1.0 mm ball pitch. Thermal characteristics include θJA = 2.8°C/W and θJB = 1.2°C/W under JEDEC standard board conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Must be regulated to 0.95–1.05 V with ≤±10 mV ripple for stable LUT/DSP operation |
| VCCAUX | Auxiliary power supply | Supplies configuration logic, PCIe block, and select I/O banks at 1.8 V ±3% |
| MGTAVCC | Transceiver analog supply | Requires ultra-low-noise 1.0 V supply; separate from digital rails to minimize jitter |
| INIT_B | Configuration status indicator | Active-low open-drain output signaling successful bitstream loading or error condition |
| CLK_IN | Primary configuration clock input | Accepts 50–200 MHz single-ended or differential reference for startup and reconfiguration |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Hard IP | Reduces integration effort by eliminating soft-core PCIe PHY and link-layer logic |
| AXI4 Interconnect | Enables plug-and-play integration of multiple masters/slaves without custom bus arbitration |
| UltraScale-compatible Configuration | Supports partial reconfiguration via ICAP port for dynamic function swapping in runtime |
| Multi-Voltage I/O Banks | Allows simultaneous interface to 1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V peripherals |
| System Monitor | Provides real-time die temperature and supply voltage telemetry via I2C or DRP interface |
Applications
| Radar Signal Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Primary compute fabric executing time-critical FFT, CFAR, and STAP algorithms with deterministic latency. Use Value: 3,648 DSP slices deliver >2.1 TFLOPS peak FP16 throughput enabling sub-millisecond response per radar frame. | Use Scenario: Offloading matrix multiplication and sparse tensor operations from CPU in edge inference servers. IC Role / Device Role / Timing Role: Reconfigurable accelerator tightly coupled to DDR4 memory controllers and PCIe Gen3 host interface. Use Value: 56.8 Mb block RAM and 1,926 I/O pins support concurrent high-bandwidth memory access and multi-device interconnect topologies. |
| 5G Wireless Baseband | Test & Measurement Equipment |
Use Scenario: Layer 1 physical layer processing for massive MIMO base stations compliant with 3GPP Release 15+. IC Role / Device Role / Timing Role: Baseband processor handling OFDM modulation/demodulation, channel coding, and precoding with deterministic cycle accuracy. Use Value: 13.1 Gb/s transceivers directly interface to 4×4 or 8×8 RFICs via JESD204B subclass 1 links. | Use Scenario: High-resolution digital oscilloscope with 10 GS/s sampling and real-time protocol decode. IC Role / Device Role / Timing Role: Real-time pattern generator and analyzer managing trigger logic, memory depth control, and serial bus decoding engines. Use Value: Multi-bank I/O supports simultaneous LVDS acquisition channels and PCIe Gen3 data streaming to host PC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924I | 1,143K logic cells, 5,520 DSP slices, 42.5 Mb BRAM, 28.1 Gb/s transceivers, 1924-pin FCBGA | Better DSP density and higher transceiver speed; lacks hardened PCIe Gen3 x8 (only Gen3 x4) | Preferred when floating-point compute throughput exceeds 690T capacity and 28 Gb/s SerDes is required |
| XCVU13P-2FLGA2577I | 1,340K logic cells, 6,840 DSP slices, 57.2 Mb BRAM, 58.0 Gb/s transceivers, 2577-pin FCBGA | Higher logic and memory resources; requires larger PCB area and more complex thermal management | Selected for next-generation systems needing >1.2M LC capacity and PAM4-ready 58 Gb/s links |
Compared with XC7VX690T-1FFG1926I, XCKU115-2FLVD1924I offers higher DSP throughput but reduced PCIe integration, while XCVU13P-2FLGA2577I delivers greater logic scale and bandwidth at the cost of increased board space and power envelope.
Availability
XC7VX690T-1FFG1926I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-performance computing acceleration requiring stable component supply across extended temperature ranges.
Supply support for XC7VX690T-1FFG1926I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, AI, embedded, and client markets with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.
The Virtex-7 family targets high-throughput, low-latency applications in defense electronics, wired/wireless infrastructure, and scientific instrumentation where deterministic timing and silicon-proven reliability are critical.
FAQ
What is the maximum supported transceiver line rate for XC7VX690T-1FFG1926I?
The XC7VX690T-1FFG1926I supports transceiver line rates up to 13.1 Gb/s. This specification is validated across all 36 GTZ transceiver quads and enables compliance with 10GBASE-R, CPRI Option 7, and SRIO Gen2 protocols. Operation at this rate requires proper PCB stackup design, controlled impedance routing, and adherence to AMD's IBIS-AMI model guidelines for signal integrity validation.
Does XC7VX690T-1FFG1926I include hardened PCIe Gen3 support?
Yes, XC7VX690T-1FFG1926I integrates a hardened PCIe Gen3 x8 endpoint block. This includes physical layer (PHY), data link layer (DLL), and transaction layer (TL) logic, eliminating the need for soft IP implementation. The block supports ASPM L0s/L1 states and is verified for interoperability with Intel and AMD root complexes per PCI-SIG compliance test suites.
What I/O standards are supported by XC7VX690T-1FFG1926I?
XC7VX690T-1FFG1926I supports LVDS, SSTL-18/25, HSTL-I/II, TMDS, RSDS, and BLVDS across its 32 I/O banks. Each bank operates independently at voltages from 1.2 V to 3.3 V. Differential standards support internal termination and programmable output swing, while single-ended standards include adjustable drive strength and slew rate control per pin group.
What is the operating temperature grade of XC7VX690T-1FFG1926I?
XC7VX690T-1FFG1926I is rated for industrial temperature operation from -40°C to +100°C (case temperature). This grade is confirmed in AMD's Virtex-7 DC and AC characterization reports and applies to all speed grades (-1, -2, -3) in the FFG1926 package. Thermal derating is not required within this range when used with specified cooling solutions.
How many block RAM resources does XC7VX690T-1FFG1926I provide?
XC7VX690T-1FFG1926I provides 56.8 Mb of total block RAM, composed of 2,840 individual 36 Kb BRAM primitives. Each BRAM can be configured as true dual-port memory, shift register, or FIFO with programmable depth and width. These resources are distributed across the device fabric to minimize routing congestion in large memory-intensive designs.
XC7VX690T-1FFG1926I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1926-FCBGA (45x45)
XC7VX690T-1FFG1926I FAQ
1.How can I place an order for XC7VX690T-1FFG1926I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-1FFG1926I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-1FFG1926I reliable?
The price and inventory of XC7VX690T-1FFG1926I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-1FFG1926I is usually 5 days.
3.What payment methods are accepted for XC7VX690T-1FFG1926I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-1FFG1926I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX690T-1FFG1926I?
XC7VX690T-1FFG1926I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-1FFG1926I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-1FFG1926I?
For technical support, including XC7VX690T-1FFG1926I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-1FFG1926I requirements.
6.How does Aetrix verify that XC7VX690T-1FFG1926I is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-1FFG1926I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-1FFG1926I meets industry standards.
7.What is the process for return or replacement of XC7VX690T-1FFG1926I?
All XC7VX690T-1FFG1926I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-1FFG1926I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-1FFG1926I part is unused and in its original packaging.
Return procedure for XC7VX690T-1FFG1926I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7VX690T-1FFG1926I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
