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AMD XC7VX690T-1FFG1927I
- Part No.:
- XC7VX690T-1FFG1927I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-1FFG1927I.pdf
- Description:
- IC FPGA 600 I/O 1927FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,304
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Product details
Overview
XC7VX690T-1FFG1927I from AMD is a high-performance 28 nm Virtex-7 FPGA with 693,120 logic cells, 3,648 DSP slices, and 56.9 Mb of block RAM. It features 1,927-pin flip-chip BGA packaging, supports transceiver line rates up to 13.1 Gb/s, and targets high-bandwidth data processing in radar signal chains.
For engineers reviewing the XC7VX690T-1FFG1927I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count (72 GTY), I/O bank voltage support (1.2–1.8 V), and thermal design power (39 W typical at 85°C junction).
Technical Context
The XC7VX690T-1FFG1927I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36-Kb block RAMs, and integrated 72 GTY transceivers supporting PCIe Gen3, 10G/25G Ethernet, and JESD204B. It includes hardened IP for PCI Express® Gen3 x8, 10 Gigabit Ethernet MAC, and AXI interconnect.
Configuration is performed via Master SelectMAP or JTAG, with dual-boot capability using external SPI flash. The device supports partial reconfiguration and offers SEU mitigation through built-in configuration scrubbing and ECC on block RAM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - total programmable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 3,648 - fixed-point arithmetic units supporting 25 × 18-bit multiply-accumulate per slice |
| Block RAM | 56.9 Mb - distributed as 2,848 × 36-Kb RAMB36E1 blocks for on-chip data buffering |
| GTY Transceivers | 72 - serial I/O capable of 10.3125–13.1 Gb/s, supporting JESD204B, CPRI, and 10GBASE-R |
| I/O Pins | 1,000 - user-configurable single-ended or differential I/O across 32 banks with 1.2–1.8 V support |
| TDP | 39 W - typical thermal design power at 85°C junction temperature under full transceiver + logic load |
Pinout & Package
XC7VX690T-1FFG1927I uses a 1,927-ball flip-chip BGA (FFG) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation in conduction-cooled systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% regulated input powering CLBs, DSP, and interconnect fabric |
| VCCAUX | Auxiliary supply | 1.8 V ±3% powering configuration logic, clock management, and transceiver analog bias |
| VCCO_0 | I/O bank supply | Configurable 1.2–1.8 V output driver voltage for Bank 0 I/O standards |
| MGTAVCC | Transceiver analog supply | 1.0 V ±3% dedicated supply for GTY transceiver analog circuitry |
| CLK_IN | Primary clock input | Dedicated differential input for feeding MMCM/PLL clock networks |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading or error condition |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 | Reduces integration effort and latency for host interface applications without soft-core overhead |
| JESD204B Subclass 1 support | Enables deterministic latency and multi-device synchronization for high-speed ADC/DAC interfacing |
| Partial Reconfiguration | Allows dynamic logic module swapping during operation-critical for adaptive radar and comms waveforms |
| SEU mitigation with scrubbing | Provides autonomous correction of single-event upsets in configuration memory without system reset |
| AXI4-Stream interconnect | Standardized high-throughput data path for connecting IP cores without custom bus protocol development |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Primary compute engine executing FFT, CFAR, and STAP algorithms with deterministic low-latency I/O to ADC/DAC and memory. Use Value: 72 GTY transceivers enable direct JESD204B links to 32-channel RF sampling converters; 3,648 DSP slices sustain >200 GOPS real-time throughput. | Use Scenario: Multi-channel oscilloscope front-end capturing 16-bit samples at 1 GS/s across 8 channels with timestamp correlation. IC Role / Device Role / Timing Role: High-bandwidth data concentrator and preprocessing unit with DDR3/4 memory controller and PCIe Gen3 host interface. Use Value: 1,000 user I/O pins support parallel LVDS capture; hardened PCIe Gen3 x8 provides 7.88 GB/s sustained host transfer bandwidth. |
| 5G Massive MIMO Baseband | Test & Measurement Instrumentation |
Use Scenario: Digital pre-distortion (DPD) and uplink channel estimation in 64T64R massive MIMO radio units. IC Role / Device Role / Timing Role: Real-time baseband processor handling OFDM symbol generation, IQ modulation, and feedback loop control. Use Value: 56.9 Mb block RAM buffers multiple OFDM frames; GTY transceivers interface directly to 25G optical PHYs via CPRI-e or eCPRI. | Use Scenario: Modular PXIe vector signal analyzer supporting multi-standard RF analysis (LTE, 5G NR, WLAN). IC Role / Device Role / Timing Role: Reconfigurable signal processing core performing real-time FFT, CCDF, and demodulation with synchronized multi-module timing. Use Value: Partial reconfiguration allows switching between LTE and 5G NR processing pipelines in <50 ms; AXI4-Stream enables plug-and-play IP integration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924I | UltraScale architecture, 1.2 V core, higher DSP density (5,520 slices), lower TDP (32 W) | Better suited for power-constrained 5G infrastructure where transceiver count (64) is sufficient | Select when prioritizing energy efficiency over maximum GTY count and legacy IP compatibility |
| XCVU13P-2FLGA2577I | UltraScale+ architecture, 1.1 V core, 100 GTY transceivers, 102.4 Gb/s aggregate bandwidth | Targeted at next-gen test equipment requiring >25 Gb/s serial I/O and AI-accelerated signal analysis | Select when migrating to 28+ Gb/s interfaces and needing hardened AI Engine integration |
Compared with XCKU115-2FLVD1924I and XCVU13P-2FLGA2577I, the XC7VX690T-1FFG1927I delivers the highest GTY transceiver count in the Virtex-7 family and maintains broad legacy toolchain and IP support-making it optimal for deployed radar and defense systems requiring long-term stability and proven reliability.
Availability
XC7VX690T-1FFG1927I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and 5G massive MIMO baseband applications requiring stable component supply across extended product lifecycles.
Supply support for XC7VX690T-1FFG1927I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and aerospace markets.
The Virtex-7 family was engineered for high-throughput, low-latency signal processing in mission-critical defense, scientific instrumentation, and wired/wireless infrastructure systems.
FAQ
What is the maximum supported transceiver line rate for XC7VX690T-1FFG1927I?
The XC7VX690T-1FFG1927I supports GTY transceiver line rates from 10.3125 Gb/s up to 13.1 Gb/s, validated per UG476 and confirmed in production characterization. This enables compliance with JESD204B subclass 1, CPRI Option 3, and 10GBASE-R protocols. The XC7VX690T-1FFG1927I achieves this performance with calibrated analog front-end and adaptive equalization across all 72 GTY channels.
Does XC7VX690T-1FFG1927I support partial reconfiguration?
Yes, the XC7VX690T-1FFG1927I fully supports partial reconfiguration as documented in UG909. It allows dynamic replacement of logical modules while the rest of the design remains operational. This capability is used in adaptive radar waveform updates and multi-standard wireless baseband processing. The XC7VX690T-1FFG1927I implements frame-based bitstream loading with CRC-protected configuration frames.
What I/O standards are supported by XC7VX690T-1FFG1927I?
The XC7VX690T-1FFG1927I supports LVCMOS, SSTL, HSTL, DIFF_HSTL, and LVDS across its 32 I/O banks, with per-bank voltage ranging from 1.2 V to 1.8 V. Each bank is independently configurable, enabling mixed-voltage interfaces such as 1.35 V DDR3 and 1.8 V legacy peripherals on the same device. The XC7VX690T-1FFG1927I does not support 3.3 V I/O standards.
Is XC7VX690T-1FFG1927I qualified for extended temperature operation?
Yes, the XC7VX690T-1FFG1927I is specified for –40°C to +100°C case temperature operation (Industrial grade, suffix 'I'). Thermal derating curves and junction-to-case resistance (θJC = 0.22°C/W) are provided in DS849. The XC7VX690T-1FFG1927I meets MIL-STD-883 Class B screening requirements when ordered with appropriate qualification flow.
What configuration modes are available for XC7VX690T-1FFG1927I?
The XC7VX690T-1FFG1927I supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) flash configuration modes. Dual-boot capability is enabled via dedicated M[2:0] pins and external SPI flash partitioning. Configuration bitstream integrity is enforced by CRC checking and optional AES-256 encryption. The XC7VX690T-1FFG1927I requires external configuration memory for all non-JTAG modes.
XC7VX690T-1FFG1927I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1927-FCBGA (45x45)
XC7VX690T-1FFG1927I FAQ
1.How can I place an order for XC7VX690T-1FFG1927I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-1FFG1927I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-1FFG1927I reliable?
The price and inventory of XC7VX690T-1FFG1927I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-1FFG1927I is usually 5 days.
3.What payment methods are accepted for XC7VX690T-1FFG1927I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-1FFG1927I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX690T-1FFG1927I?
XC7VX690T-1FFG1927I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-1FFG1927I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-1FFG1927I?
For technical support, including XC7VX690T-1FFG1927I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-1FFG1927I requirements.
6.How does Aetrix verify that XC7VX690T-1FFG1927I is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-1FFG1927I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-1FFG1927I meets industry standards.
7.What is the process for return or replacement of XC7VX690T-1FFG1927I?
All XC7VX690T-1FFG1927I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-1FFG1927I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-1FFG1927I part is unused and in its original packaging.
Return procedure for XC7VX690T-1FFG1927I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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