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AMD XC7VX690T-1FFG1930I
- Part No.:
- XC7VX690T-1FFG1930I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-1FFG1930I.pdf
- Description:
- IC FPGA 1000 I/O 1930FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,221
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Product details
Overview
XC7VX690T-1FFG1930I from AMD is a high-performance 28 nm Virtex-7 FPGA with 693,120 logic cells, 3,648 DSP slices, and 56.9 Mb of block RAM; supports PCIe Gen3 x8, DDR3-1866 memory interface, and operates at -40°C to +100°C junction temperature for aerospace-grade embedded computing.
For engineers reviewing the XC7VX690T-1FFG1930I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (700), transceiver line rate (13.1 Gb/s), thermal design power (34 W typical), and industrial temperature grade compliance.
Technical Context
The XC7VX690T-1FFG1930I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), hardened IP including PCIe Gen3 endpoints, and multi-gigabit transceivers supporting protocols such as SATA, SRIO, and CPRI. It integrates dual 12-bit 1 MSPS ADCs and clock management tiles with MMCM/PLL for jitter reduction.
Configuration occurs via Master SPI or JTAG, with support for AES-256 bitstream encryption and SEU mitigation using built-in EDAC on configuration memory. The device targets deterministic real-time processing in radar signal chains and high-throughput packet forwarding systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - determines maximum combinational/sequential logic capacity for complex algorithm implementation |
| DSP Slices | 3,648 - enables parallel multiply-accumulate operations for FFT, filtering, and beamforming |
| Block RAM | 56.9 Mb - provides on-chip memory for buffering, FIFOs, and coefficient storage without external DRAM |
| I/O Pins | 700 - supports high-pin-count interfaces including DDR3, PCIe, and custom parallel buses |
| Transceiver Rate | 13.1 Gb/s - enables single-lane CPRI v6.1 or dual-lane 10GBASE-R Ethernet physical layer |
| Operating Temp | -40°C to +100°C - qualified for extended-temperature industrial and avionics environments |
| TDP | 34 W typical - defines thermal solution requirements for conduction-cooled or forced-air enclosures |
Pinout & Package
XC7VX690T-1FFG1930I is housed in a 1930-ball Flip-Chip BGA (FFG) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation via central thermal ball array.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTAVCC / MGTAVTT | Analog transceiver supply | Separate 1.0 V / 1.2 V rails required for stable 13.1 Gb/s serial link operation |
| HR_IO / HP_IO | Configurable I/O bank | HR banks support 1.8/2.5/3.3 V standards; HP banks optimized for 1.2/1.5/1.8 V low-swing interfaces |
| VRP / VRN | Reference voltage inputs | Enable precise termination calibration for SSTL/HSTL I/O standards across temperature and voltage |
| CCLK / INIT_B / DONE | Configuration control | Control FPGA startup sequence, status indication, and configuration clock source selection |
| VCCAUX / VCCINT | Core auxiliary supply | VCCAUX = 1.8 V for configuration logic; VCCINT = 1.0 V for CLB/DSP core logic |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Hard IP | Reduces RTL integration effort and guarantees timing closure for host interface subsystems |
| AES-256 Bitstream Encryption | Prevents unauthorized cloning or reverse engineering of implemented logic functions |
| SEU Detection & Correction | Corrects single-bit upsets in configuration memory without system reset or service interruption |
| Integrated 12-bit ADC | Monitors on-board voltages and temperatures without external analog front-end components |
| Multi-Gigabit Transceivers | Supports protocol-transparent serialization/deserialization up to 13.1 Gb/s per lane |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes beamforming, CFAR detection, and pulse compression; transceivers interface with ADC/DAC FMC modules. Use Value: 3,648 DSP slices enable simultaneous 128-channel FFTs; 13.1 Gb/s transceivers sustain raw ADC data ingestion at 5 GSPS aggregate. | Use Scenario: Multi-channel oscilloscope front-end capturing transient waveforms at ≥1 GS/s per channel. IC Role / Device Role / Timing Role: Configurable I/O banks interface with 12-bit, 1 MSPS on-die ADCs and external high-speed ADCs; CLBs implement trigger logic and waveform memory control. Use Value: On-chip 56.9 Mb block RAM stores up to 4 million samples per channel before offloading; HR I/O supports LVDS input at 1.25 Gb/s. |
| Avionics Communication Hub | 5G Baseband Processing |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B gateway in flight control computers. IC Role / Device Role / Timing Role: PCIe Gen3 x8 connects to host processor; transceivers handle deterministic time-triggered Ethernet traffic shaping. Use Value: -40°C to +100°C rating ensures operation in unpressurized avionics bays; AES-256 protects mission-critical configuration data. | Use Scenario: Massive MIMO baseband unit performing precoding and resource scheduling in sub-6 GHz 5G NR infrastructure. IC Role / Device Role / Timing Role: DSP slices execute matrix inversion and OFDM modulation; transceivers link to RFICs via JESD204B v1.1 at 12.5 Gb/s. Use Value: 693,120 logic cells accommodate full-layer 64×64 precoder; hardened PCIe Gen3 enables fronthaul transport to controller card. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924I | UltraScale architecture; higher DSP density (5,520 slices); lower transceiver max rate (16.3 Gb/s vs 13.1 Gb/s) | Better suited for AI inference acceleration; less mature for legacy radar waveform compatibility | Select when migrating to 20 nm node with emphasis on computational throughput over proven field reliability |
| XCVU13P-2FHGB2104I | UltraScale+ architecture; 100 GbE MAC hard IP; higher TDP (42 W); 2104-ball package | Targeted at 100G optical transport and DPDK-accelerated packet processing | Choose for new designs requiring integrated 100G Ethernet PHY and higher memory bandwidth via HBM2 |
Compared with XCKU115-2FLVD1924I and XCVU13P-2FHGB2104I, the XC7VX690T-1FFG1930I offers superior legacy IP reuse, established qualification for harsh-environment deployment, and tighter thermal envelope-making it preferred for radar and avionics upgrades where certification continuity matters.
Availability
XC7VX690T-1FFG1930I is available at Aetrix Electronics and suitable for radar signal processing, avionics communication hubs, and 5G baseband processing requiring stable component supply across long product lifecycles.
Supply support for XC7VX690T-1FFG1930I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded, and client markets through FPGA, adaptive SoC, and CPU/GPU technologies.
The Virtex-7 family was engineered for high-bandwidth, low-latency signal and packet processing in defense, aerospace, and wired communications infrastructure.
FAQ
What is the maximum supported DDR3 memory interface speed for XC7VX690T-1FFG1930I?
The XC7VX690T-1FFG1930I supports DDR3-1866 (933 MHz) with 16-bit or 32-bit data bus widths using dedicated memory interface logic. This capability enables direct connection to standard SO-DIMM modules or discrete DDR3 chips without external PHY, reducing latency in real-time buffer management for the XC7VX690T-1FFG1930I.
Does XC7VX690T-1FFG1930I include built-in analog-to-digital conversion capability?
Yes, the XC7VX690T-1FFG1930I integrates two 12-bit, 1 MSPS analog-to-digital converters accessible via dedicated VP/VN pins. These ADCs monitor internal supply voltages and die temperature, providing telemetry data to configuration logic without requiring external sensors or signal conditioning circuits in the XC7VX690T-1FFG1930I.
What transceiver protocols are natively supported by XC7VX690T-1FFG1930I?
The XC7VX690T-1FFG1930I transceivers support native protocol stacks including PCIe Gen3, SATA Gen3, SRIO 2.1, and CPRI v6.1. Protocol selection is configured at runtime via GTHE2 transceiver primitives and associated wizard-generated IP cores, enabling flexible interface assignment across lanes in the XC7VX690T-1FFG1930I.
Is XC7VX690T-1FFG1930I qualified for extended temperature operation?
Yes, the XC7VX690T-1FFG1930I is rated for -40°C to +100°C junction temperature and is manufactured under AMD's extended temperature qualification flow. This makes the XC7VX690T-1FFG1930I suitable for deployment in conduction-cooled avionics chassis and outdoor 5G base station equipment without derating.
How is configuration security implemented in XC7VX690T-1FFG1930I?
XC7VX690T-1FFG1930I implements AES-256 bitstream encryption with HMAC authentication, enforced during Master SPI or BPI configuration. Keys are stored in on-chip eFUSE, preventing extraction or replay attacks. This security model ensures that only authorized, signed bitstreams can configure the XC7VX690T-1FFG1930I.
XC7VX690T-1FFG1930I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 1000
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1930-FCBGA (45x45)
XC7VX690T-1FFG1930I FAQ
1.How can I place an order for XC7VX690T-1FFG1930I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-1FFG1930I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-1FFG1930I reliable?
The price and inventory of XC7VX690T-1FFG1930I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-1FFG1930I is usually 5 days.
3.What payment methods are accepted for XC7VX690T-1FFG1930I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-1FFG1930I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX690T-1FFG1930I?
XC7VX690T-1FFG1930I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-1FFG1930I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-1FFG1930I?
For technical support, including XC7VX690T-1FFG1930I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-1FFG1930I requirements.
6.How does Aetrix verify that XC7VX690T-1FFG1930I is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-1FFG1930I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-1FFG1930I meets industry standards.
7.What is the process for return or replacement of XC7VX690T-1FFG1930I?
All XC7VX690T-1FFG1930I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-1FFG1930I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-1FFG1930I part is unused and in its original packaging.
Return procedure for XC7VX690T-1FFG1930I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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