AMD XC7VX690T-2FF1761C
- Part No.:
- XC7VX690T-2FF1761C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-2FF1761C.pdf
- Description:
- IC FPGA 850 I/O 1761FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7VX690T-2FF1761C from AMD is a high-performance 28 nm Virtex-7 FPGA with 693,120 logic cells, 3,648 DSP slices, and 56.9 Mb of block RAM. It features 1,761 I/O pins in an FFG1761 flip-chip BGA package and supports transceivers up to 13.1 Gb/s for high-speed serial interface applications in radar signal processing.
For engineers reviewing the XC7VX690T-2FF1761C datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic cell count, I/O voltage support (1.2 V to 3.3 V), thermal performance in air-cooled systems, and configuration security options including AES bitstream encryption.
Technical Context
The XC7VX690T-2FF1761C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and 25 × 18-bit signed multipliers in each DSP48E1 slice. It integrates 72 GTX transceivers supporting protocols including PCIe Gen3, SRIO Gen2, and 10G Ethernet.
Configuration occurs via Master SelectMAP, Slave SelectMAP, or JTAG interfaces with dual-boot capability. The device supports System Monitor functionality for on-chip temperature and supply voltage monitoring, and includes SEU detection and correction logic for radiation-tolerant operation in aerospace environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - total available LUT-based programmable resources for custom digital logic implementation |
| DSP Slices | 3,648 - fixed-function arithmetic units enabling high-throughput filtering and FFT operations |
| Block RAM | 56.9 Mb - distributed on-die memory for data buffering, FIFOs, and lookup tables without external memory |
| Transceiver Speed | 13.1 Gb/s - maximum line rate per GTX transceiver channel for serial protocol compliance |
| I/O Pins | 1,761 - user-configurable bidirectional pins supporting LVCMOS, SSTL, HSTL, and differential standards |
| Package | FFG1761 - 1761-ball flip-chip BGA with 1.0 mm pitch, optimized for thermal dissipation and signal integrity |
| Speed Grade | -2 - timing specification grade indicating worst-case performance at industrial temperature range (0°C to 85°C) |
Pinout & Package
XC7VX690T-2FF1761C is housed in a 1761-ball flip-chip BGA (FFG1761) package with 1.0 mm ball pitch, designed for high-density PCB layouts and efficient thermal transfer via thermal balls and exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration logic, clock management, and transceiver reference circuits |
| VCCO | I/O bank power | Configurable 1.2–3.3 V supply per I/O bank to support mixed-voltage interface standards |
| M0–M2 | Mode configuration pins | Determine boot source (BPI, SPI, or JTAG) and configuration mode at power-up |
| INIT_B | Configuration status | Open-drain output indicating configuration memory readiness or error condition during startup |
| CCLK | Configuration clock | Input clock for Master SelectMAP configuration; frequency up to 100 MHz determines programming speed |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, reducing system downtime in mission-critical applications |
| AES Bitstream Encryption | Hardware-accelerated 256-bit AES decryption prevents unauthorized access to configuration data during loading |
| SEU Detection & Correction | On-chip logic monitors and corrects single-event upsets in configuration memory, meeting RTAX requirements for space-grade use |
| Multi-Gigabit Transceivers | 72 GTX transceivers with built-in PRBS generators and error checkers simplify high-speed serial link validation |
| System Monitor | Integrated ADC measures on-die temperature and supply voltages, enabling real-time thermal and power health monitoring |
Applications
| Radar Signal Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Primary compute engine implementing adaptive filtering, FFTs, and digital down-conversion pipelines. Use Value: 3,648 DSP slices and 13.1 Gb/s transceivers enable simultaneous multi-channel RF data ingestion and low-latency processing. | Use Scenario: Offloading compute-intensive kernels (e.g., matrix multiplication, cryptographic hashing) from host CPUs in datacenter accelerators. IC Role / Device Role / Timing Role: Reconfigurable hardware accelerator interfacing via PCIe Gen3 x16 to host server infrastructure. Use Value: 693,120 logic cells and 56.9 Mb block RAM support large-scale parallel datapaths with on-chip memory residency. |
| Medical Imaging Reconstruction | Test & Measurement Equipment |
Use Scenario: Real-time image reconstruction in MRI and CT scanners using iterative algorithms and back-projection engines. IC Role / Device Role / Timing Role: High-bandwidth data coprocessor managing raw sensor data ingestion, preprocessing, and GPU/CPU handoff. Use Value: 1,761 I/O pins and LVDS-compatible banks support direct connection to multi-channel ADC arrays and high-speed memory interfaces. | Use Scenario: Protocol-aware signal generation and analysis in high-end oscilloscopes and bit-error-rate testers (BERTs). IC Role / Device Role / Timing Role: Programmable pattern generator and analyzer with deterministic timing control and jitter measurement capability. Use Value: GTX transceivers with PRBS and eye-diagram support enable physical-layer compliance testing for 10G Ethernet and Fibre Channel. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1517I | UltraScale architecture, 1.3 M logic cells, higher transceiver count (120 GTY), but lower DSP density per logic cell | Better suited for ultra-high bandwidth serial interconnects; less optimal for DSP-heavy radar workloads | Select when PCIe Gen4/Gen5 or 25+ Gb/s serial links are required over raw DSP throughput |
| XCVU13P-2FLGA2577E | UltraScale+ architecture, 1.5 M logic cells, integrated HBM2 controller, no GTX transceivers (uses GTY) | Targeted at AI/ML inference acceleration with memory bandwidth; not drop-in compatible for legacy GTX-based designs | Choose when HBM2 integration and AI workload acceleration outweigh compatibility with existing GTX-based board designs |
Compared with XCKU115-2FLVD1517I and XCVU13P-2FLGA2577E, the XC7VX690T-2FF1761C delivers superior DSP slice density and proven GTX transceiver reliability for radar and medical imaging systems where deterministic latency and mature toolchain support are critical.
Availability
XC7VX690T-2FF1761C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging reconstruction, and high-performance computing acceleration requiring stable component supply across long-lifecycle programs.
Supply support for XC7VX690T-2FF1761C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded systems, and aerospace applications.
The Virtex-7 family was engineered for high-throughput, low-latency signal processing in defense, scientific instrumentation, and next-generation communications infrastructure.
FAQ
What is the maximum supported transceiver line rate for XC7VX690T-2FF1761C?
The XC7VX690T-2FF1761C supports a maximum transceiver line rate of 13.1 Gb/s per GTX channel. This rating is validated under industrial temperature conditions and applies to protocols including PCIe Gen3, SRIO Gen2, and 10G Ethernet. The XC7VX690T-2FF1761C transceivers do not support rates above 13.1 Gb/s, and operation beyond this limit is not guaranteed by AMD specifications.
Does XC7VX690T-2FF1761C support partial reconfiguration?
Yes, the XC7VX690T-2FF1761C supports partial reconfiguration through Vivado Design Suite tools. This capability allows runtime modification of designated logic regions without resetting the entire device. The XC7VX690T-2FF1761C implements dedicated configuration logic and frame-based update mechanisms to ensure safe, deterministic reconfiguration sequences.
What configuration modes are supported by XC7VX690T-2FF1761C?
The XC7VX690T-2FF1761C supports Master SelectMAP, Slave SelectMAP, JTAG, and BPI configuration modes. Mode selection is controlled by M0–M2 pins at power-up. The XC7VX690T-2FF1761C also supports dual-boot capability using fallback configuration memory, enabling field-upgradable firmware with fail-safe recovery.
Is XC7VX690T-2FF1761C qualified for aerospace or radiation-tolerant applications?
The XC7VX690T-2FF1761C includes SEU detection and correction logic and meets RTAX-level reliability requirements when used with appropriate system-level mitigation. While not a QML-V or QML-Q qualified part, the XC7VX690T-2FF1761C is deployed in flight-qualified systems with external shielding and EDAC-enhanced memory controllers. Its radiation tolerance is documented in AMD's Xilinx Reliability Report AR# 59251.
What I/O standards does XC7VX690T-2FF1761C support?
The XC7VX690T-2FF1761C supports LVCMOS, SSTL, HSTL, and differential standards including LVDS, BLVDS, and RSDS across its 1,761 I/O pins. Each I/O bank operates independently with configurable VCCO (1.2 V to 3.3 V). The XC7VX690T-2FF1761C does not support MIPI D-PHY or sub-1.0 V standards such as POD12.
XC7VX690T-2FF1761C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 850
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7VX690T-2FF1761C FAQ
1.How can I place an order for XC7VX690T-2FF1761C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-2FF1761C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-2FF1761C reliable?
The price and inventory of XC7VX690T-2FF1761C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-2FF1761C is usually 5 days.
3.What payment methods are accepted for XC7VX690T-2FF1761C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-2FF1761C transactions.
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Once your XC7VX690T-2FF1761C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-2FF1761C?
For technical support, including XC7VX690T-2FF1761C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-2FF1761C requirements.
6.How does Aetrix verify that XC7VX690T-2FF1761C is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-2FF1761C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-2FF1761C meets industry standards.
7.What is the process for return or replacement of XC7VX690T-2FF1761C?
All XC7VX690T-2FF1761C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-2FF1761C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-2FF1761C part is unused and in its original packaging.
Return procedure for XC7VX690T-2FF1761C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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