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AMD XC7VX690T-2FF1761I
- Part No.:
- XC7VX690T-2FF1761I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-2FF1761I.pdf
- Description:
- IC FPGA 850 I/O 1761FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,098
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Product details
Overview
XC7VX690T-2FF1761I from AMD is a high-performance 28 nm Virtex-7 FPGA with 693,120 logic cells, 3,648 DSP slices, and 48.5 Mb of block RAM. It features 1,761-pin Flip-Chip Fine-Pitch BGA (FF) packaging, -2 speed grade, and industrial temperature rating (-40°C to +100°C). It is used in high-bandwidth radar signal processing systems requiring deterministic latency and multi-gigabit serial I/O.
For engineers reviewing the XC7VX690T-2FF1761I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (up to 13.1 Gb/s), I/O voltage support (1.2 V to 3.3 V), configuration interface options (SPI, SelectMAP), and thermal performance under sustained 25 W dynamic power.
Technical Context
The XC7VX690T-2FF1761I implements a heterogeneous architecture integrating programmable logic fabric, hardened IP blocks (PCIe Gen3 x8, 10/100/1000 Ethernet MAC, AXI interconnect), and high-speed serial transceivers. It supports JTAG, ICAP, and fallback configuration modes with dual-boot capability via dedicated configuration pins.
Its transceiver banks operate at 600 Mb/s to 13.1 Gb/s with built-in PRBS generation/checking, 8B/10B encoding, and QPLL/CPLL clocking. The device uses SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 3,648 - enables parallel execution of multiply-accumulate operations for real-time filtering and FFTs |
| Block RAM | 48.5 Mb - provides on-chip memory for frame buffering, coefficient storage, and FIFOs without external DRAM |
| Transceiver Max Rate | 13.1 Gb/s - supports 10G-KR, CPRI, and JESD204B interfaces in wireless infrastructure and test equipment |
| I/O Standards | SSTL-15/18, HSTL-I/II, LVCMOS, LVDS - ensures interoperability with DDR3/DDR4 memory, ADCs, DACs, and FPGAs |
| Configuration Mode | Master SPI, Slave SelectMAP, JTAG - allows flexible boot sources and field-upgradable bitstreams |
| Thermal Rating | Industrial (-40°C to +100°C case) - validated for operation in sealed enclosures without forced airflow |
Pinout & Package
XC7VX690T-2FF1761I is housed in a 1761-ball Flip-Chip Fine-Pitch BGA (FF) package with 0.8 mm pitch, thermal lid, and standard JEDEC MO-271AC footprint. Ball map includes dedicated configuration, clock, and transceiver power domains.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master SPI mode; requires clean 50 MHz source |
| DIN | Serial Configuration Data Input | Accepts bitstream from SPI flash; synchronous to CCLK edge |
| INIT_B | Configuration Status Output | Active-low open-drain signal indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset Input | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| GTX_CLK0_M2C_P/N | Transceiver Reference Clock Input | Differential pair feeding QPLL for GTY transceiver bank 220; must meet jitter < 1 ps RMS |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 Endpoint | Reduces integration effort and verification time for host-facing data acquisition cards |
| AXI Interconnect Fabric | Enables scalable, low-latency communication between multiple masters and slaves without custom bus logic |
| UltraScale+ Compatible Bitstream | Allows migration path to newer families while preserving core RTL and IP integrations |
| Partial Reconfiguration Support | Permits runtime logic updates in specific regions without disrupting active system functions |
| Integrated System Monitor | Provides real-time die temperature, supply voltage, and current telemetry via I2C/JTAG |
Applications
| Radar Signal Processing | High-Speed Test Equipment |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Primary compute engine executing adaptive filtering, FFTs, and digital down-conversion with sub-microsecond latency control. Use Value: 3,648 DSP slices and deterministic routing enable concurrent multi-channel processing at 10 GSPS aggregate sample rate. | Use Scenario: Protocol-aware pattern generation and analysis in 10G Ethernet and CPRI compliance testers. IC Role / Device Role / Timing Role: Dual-role transceiver controller managing both physical layer signaling and packet-level protocol stack offload. Use Value: Hardened PCIe Gen3 x8 and 13.1 Gb/s GTY transceivers eliminate need for external SerDes and reduce board-level timing closure complexity. |
| Medical Imaging Backend | Avionics Data Concentrator |
Use Scenario: Raw sensor data aggregation and preprocessing from multi-slice CT detector arrays before GPU-based reconstruction. IC Role / Device Role / Timing Role: High-throughput I/O bridge and real-time image pipeline accelerator with lossless compression logic. Use Value: 48.5 Mb block RAM buffers full-frame projection data across 128 channels while maintaining strict 200 ns inter-frame jitter. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B network convergence in flight control computers. IC Role / Device Role / Timing Role: Deterministic time-triggered switch fabric with integrated end-system traffic shaping and health monitoring. Use Value: AXI interconnect and hardened Ethernet MAC ensure sub-5 µs end-to-end latency with guaranteed bandwidth allocation per virtual link. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FL1158I | UltraScale+ architecture; higher logic density (1,024K LC), lower static power, but no native PCIe Gen3 hard IP | Better suited for AI inference acceleration where PCIe is handled externally; less optimal for legacy PCIe endpoint designs | Select XC7VX690T-2FF1761I when PCIe Gen3 x8 endpoint integration and proven radiation-tolerant configuration SRAM are required |
| XCKU115-2FLVD1517I | UltraScale architecture; 1,043K logic cells, 5,520 DSP slices, but max transceiver rate limited to 12.5 Gb/s | Preferred for cost-sensitive high-volume production where 13.1 Gb/s is not mandatory and thermal envelope is tighter | Choose XC7VX690T-2FF1761I for applications demanding 13.1 Gb/s JESD204B lane rates and industrial-temperature stability with mature toolchain support |
Compared with XCVU13P-2FL1158I and XCKU115-2FLVD1517I, the XC7VX690T-2FF1761I offers unique value in legacy-compatible PCIe Gen3 endpoint integration, deterministic 13.1 Gb/s transceiver performance at industrial temperature, and long-term availability assurance for defense and aerospace programs.
Availability
XC7VX690T-2FF1761I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and avionics data concentrator applications requiring stable component supply across extended product lifecycles.
Supply support for XC7VX690T-2FF1761I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with emphasis on performance-per-watt and architectural flexibility.
The Virtex-7 family was designed for high-bandwidth, low-latency signal processing in defense, scientific instrumentation, and wired/wireless infrastructure where deterministic timing and hardened I/O are critical.
FAQ
What is the maximum supported transceiver line rate for XC7VX690T-2FF1761I?
The XC7VX690T-2FF1761I supports a maximum transceiver line rate of 13.1 Gb/s using its GTY transceivers. This rate is validated for JESD204B, CPRI, and 10GBASE-KR protocols under industrial temperature conditions. The device includes built-in PRBS generators and checkers for link integrity testing at this speed. XC7VX690T-2FF1761I requires external reference clocks meeting ≤1 ps RMS jitter specification to maintain BER < 10⁻¹².
Does XC7VX690T-2FF1761I include hardened PCIe Gen3 IP?
Yes, XC7VX690T-2FF1761I integrates a hardened PCIe Gen3 x8 endpoint block compliant with PCI Express Base Specification Revision 3.0. It supports both root port and endpoint configurations, hot-plug, and advanced error reporting. The IP operates without consuming logic resources and delivers sub-100 ns transaction completion latency. XC7VX690T-2FF1761I's PCIe block is fully supported in Vivado Design Suite 2022.2 and later versions.
What configuration modes are supported by XC7VX690T-2FF1761I?
XC7VX690T-2FF1761I supports Master SPI, Slave SelectMAP, JTAG, and ICAP configuration modes. Master SPI is commonly used for single-flash boot; Slave SelectMAP enables high-speed parallel loading from microcontrollers. JTAG supports boundary-scan and partial reconfiguration. All modes are accessible simultaneously, allowing fallback paths. XC7VX690T-2FF1761I also supports dual-boot with watchdog-controlled failover between two bitstreams stored in SPI flash.
What is the industrial temperature range for XC7VX690T-2FF1761I?
XC7VX690T-2FF1761I is rated for industrial temperature operation from –40°C to +100°C case temperature. This rating applies to the full speed grade (-2) and all I/O banks. Thermal derating is not required up to 100°C ambient when using the recommended 4-layer PCB stackup and thermal vias under the package. XC7VX690T-2FF1761I's configuration memory retains state across this range without refresh.
How much block RAM does XC7VX690T-2FF1761I provide?
XC7VX690T-2FF1761I provides 48.5 Mb of total block RAM distributed across 2,848 BRAM primitives, each configurable as 36 Kb dual-port RAM or 18 Kb single-port RAM. This capacity supports large frame buffers, FIR coefficient tables, and deep FIFOs without external memory. XC7VX690T-2FF1761I allows independent read/write clocks per port and true dual-port operation with simultaneous access to same address.
XC7VX690T-2FF1761I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 850
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7VX690T-2FF1761I FAQ
1.How can I place an order for XC7VX690T-2FF1761I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-2FF1761I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-2FF1761I reliable?
The price and inventory of XC7VX690T-2FF1761I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-2FF1761I is usually 5 days.
3.What payment methods are accepted for XC7VX690T-2FF1761I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-2FF1761I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX690T-2FF1761I?
XC7VX690T-2FF1761I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-2FF1761I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-2FF1761I?
For technical support, including XC7VX690T-2FF1761I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-2FF1761I requirements.
6.How does Aetrix verify that XC7VX690T-2FF1761I is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-2FF1761I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-2FF1761I meets industry standards.
7.What is the process for return or replacement of XC7VX690T-2FF1761I?
All XC7VX690T-2FF1761I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-2FF1761I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-2FF1761I part is unused and in its original packaging.
Return procedure for XC7VX690T-2FF1761I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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