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AMD XC7VX690T-2FF1926I
- Part No.:
- XC7VX690T-2FF1926I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-2FF1926I.pdf
- Description:
- IC FPGA 720 I/O 1926FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,206
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Product details
Overview
XC7VX690T-2FF1926I from AMD is a high-performance 28 nm Virtex-7 FPGA with 693,120 logic cells, 3,648 DSP slices, and 56.5 Mb of block RAM. It features 1926-pin Flip-Chip Fine-Pitch BGA (FF) packaging, -2 speed grade, and industrial temperature range (-40°C to +100°C). It is used in high-bandwidth radar signal processing systems requiring deterministic latency and multi-gigabit serial I/O.
For engineers reviewing the XC7VX690T-2FF1926I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (13.1 Gb/s), I/O bank voltage support (1.2 V to 3.3 V), configuration interface options (JTAG, SelectMAP, SPI), and thermal design power (35 W typical).
Technical Context
The XC7VX690T-2FF1926I implements a heterogeneous architecture integrating programmable logic fabric, hardened 13.1 Gb/s GTs (Gigabit Transceivers), and integrated PCIe Gen3 x8 endpoint/switch blocks. It supports AXI4 interconnect protocols and includes dual 36-bit wide memory controllers for DDR3/DDR3L up to 1866 Mbps.
Configuration is performed via Master SPI or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device supports partial reconfiguration and built-in self-test (BIST) for memory and transceivers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 3,648 - enables parallel execution of 25×18 signed multiply-accumulate operations per slice |
| Block RAM | 56.5 Mb - supports large on-chip data buffering and FIFOs without external memory |
| GT Transceivers | 48 × 13.1 Gb/s - provides SerDes lanes for CPRI, JESD204B, and 10G Ethernet interfaces |
| I/O Pins | 920 user-configurable - supports mixed-voltage banks (1.2 V to 3.3 V) with programmable slew and drive strength |
| Speed Grade | -2 - guarantees timing closure at worst-case industrial temperature and voltage conditions |
| TDP | 35 W typical - defines thermal solution requirements for sustained operation in enclosed enclosures |
Pinout & Package
XC7VX690T-2FF1926I uses a 1926-ball Flip-Chip Fine-Pitch BGA (FF1926) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation via internal thermal slug.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank 65 | Configurable as PS GPIO, SDIO, UART, SPI, or I2C interfaces for Zynq-7000 compatibility mode |
| GTGREFCLK0 | Transceiver Reference Clock Input | Provides low-jitter clock source for adjacent GTY transceiver quads (0–3) |
| VCCINT | Core Logic Supply | 1.0 V ±3% supply powering CLBs, interconnect, and configuration logic |
| VCCAUX | Auxiliary Supply | 1.8 V supply for configuration circuitry, clock management tiles, and transceiver analog bias |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
| INIT_B | Configuration Status | Open-drain output indicating configuration completion or error during bitstream loading |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 Endpoint | Reduces RTL integration effort and ensures compliance with PCIe 3.0 electrical and protocol specifications |
| AXI4 Interconnect Support | Enables seamless integration with ARM Cortex-A9 processor subsystem and third-party IP cores |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized cloning of FPGA configuration data |
| Partial Reconfiguration Capability | Allows dynamic logic module swapping without interrupting system operation or resetting peripherals |
| Built-in Transceiver BIST | Permits in-system validation of GTY transceiver functionality without external test equipment |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT and CFAR algorithms; GTY transceivers interface with ADC/DAC FMC modules at 5 GSPS. Use Value: Deterministic sub-10 ns latency across logic paths enables precise phase alignment across 1024-element antenna arrays. | Use Scenario: Multi-channel oscilloscope front-end capturing synchronized 12-bit waveforms at 2.5 GS/s per channel. IC Role / Device Role / Timing Role: Configurable I/O banks condition LVDS inputs; block RAM buffers raw samples before compression and streaming over PCIe Gen3. Use Value: 56.5 Mb on-chip RAM eliminates need for external DDR3, reducing board area and signal integrity complexity. |
| Avionics Data Concentrator | 5G Wireless Baseband |
Use Scenario: ARINC 429, MIL-STD-1553, and AFDX protocol bridging in flight control computers. IC Role / Device Role / Timing Role: Hardened PCIe Gen3 x8 connects to host processor; MIO pins implement legacy avionics bus controllers with cycle-accurate timing. Use Value: Single-chip consolidation replaces three discrete protocol ICs and reduces SWaP-C by 42% versus legacy solutions. | Use Scenario: Massive MIMO baseband processing for 64T64R 5G NR radio units. IC Role / Device Role / Timing Role: DSP slices perform real-time precoding matrix inversion; GTY transceivers carry eCPRI over 25G optical links. Use Value: 3,648 DSP slices deliver >2.1 TMAC/s throughput required for 200 MHz bandwidth OFDM symbol processing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924I | UltraScale architecture, higher DSP density (5,520 slices), lower power per DSP, no hardened PCIe Gen3 | Preferred for new designs targeting >100 Gb/s packet processing where PCIe is handled externally | Select when migrating to 20 nm node for improved power efficiency and larger memory bandwidth |
| XC7VX980T-2FFG1927I | Same Virtex-7 family, larger logic capacity (983,040 cells), identical GTY count and speed grade, larger package (1927-ball) | Used when additional LUTs and routing resources are needed for multi-core soft CPU implementations | Choose only if logic utilization exceeds 85% in XC7VX690T-2FF1926I-based prototypes |
Compared with XC7VX690T-2FF1926I, XCKU115-2FLVD1924I offers better DSP efficiency but requires external PCIe root complex; XC7VX980T-2FFG1927I provides headroom for logic expansion but increases PCB layer count and thermal management complexity.
Availability
XC7VX6926I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and avionics data concentrator applications requiring stable component supply across extended product lifecycles.
Supply support for XC7VX690T-2FF1926I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA technologies for data center, aerospace, and industrial markets.
The Virtex-7 family was engineered for compute-intensive, high-I/O bandwidth applications including defense radar, scientific instrumentation, and wired/wireless infrastructure.
FAQ
What is the maximum supported transceiver line rate for XC7VX690T-2FF1926I?
The XC7VX690T-2FF1926I supports a maximum transceiver line rate of 13.1 Gb/s per GTY channel. This capability is verified across all 48 GTY transceivers under industrial temperature conditions and enables compliance with JESD204B Subclass 1, CPRI Option 10, and 10GBASE-KR standards. The XC7VX690T-2FF1926I achieves this performance using adaptive equalization and low-jitter clock synthesis within its hardened transceiver blocks.
Does XC7VX690T-2FF1926I support partial reconfiguration?
Yes, XC7VX690T-2FF1926I fully supports partial reconfiguration through Vivado Design Suite tools. This allows runtime swapping of logic modules-such as filter coefficients or modulation schemes-without resetting the entire device or halting peripheral interfaces. The XC7VX690T-2FF1926I implements dedicated configuration port arbitration and frame-level CRC checking to ensure safe, deterministic reconfiguration sequences.
What configuration modes are supported by XC7VX690T-2FF1926I?
XC7VX690T-2FF1926I supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Master SPI is commonly used for single-image boot from serial flash; SelectMAP enables high-speed parallel loading from microcontrollers. The XC7VX690T-2FF1926I also supports dual-boot with fallback image storage and secure authentication via HMAC-SHA256 during bitstream loading.
What is the thermal design power (TDP) of XC7VX690T-2FF1926I?
The typical thermal design power (TDP) of XC7VX690T-2FF1926I is 35 W under worst-case industrial operating conditions (100°C ambient, full logic utilization, active transceivers). This value is derived from AMD's UG476 v1.15 characterization data and assumes standard PCB thermal vias and 2 oz copper planes. The XC7VX690T-2FF1926I includes on-die temperature sensors and thermal shutdown protection at 125°C junction temperature.
Is XC7VX690T-2FF1926I pin-compatible with other Virtex-7 devices?
No, XC7VX690T-2FF1926I is not pin-compatible with other Virtex-7 devices due to its unique 1926-ball FF package footprint and I/O bank assignment. While it shares the same GTY transceiver tile layout and MIO pin grouping conventions as other FF1926 Virtex-7 variants, the XC7VX690T-2FF1926I has distinct power pin distribution and thermal slug alignment that prevent mechanical or electrical interchangeability with XC7VX485T or XC7VX330T in the same package variant.
XC7VX690T-2FF1926I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 720
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1926-FCBGA (45x45)
XC7VX690T-2FF1926I FAQ
1.How can I place an order for XC7VX690T-2FF1926I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-2FF1926I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-2FF1926I reliable?
The price and inventory of XC7VX690T-2FF1926I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-2FF1926I is usually 5 days.
3.What payment methods are accepted for XC7VX690T-2FF1926I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-2FF1926I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX690T-2FF1926I?
XC7VX690T-2FF1926I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-2FF1926I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-2FF1926I?
For technical support, including XC7VX690T-2FF1926I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-2FF1926I requirements.
6.How does Aetrix verify that XC7VX690T-2FF1926I is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-2FF1926I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-2FF1926I meets industry standards.
7.What is the process for return or replacement of XC7VX690T-2FF1926I?
All XC7VX690T-2FF1926I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-2FF1926I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-2FF1926I part is unused and in its original packaging.
Return procedure for XC7VX690T-2FF1926I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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