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AMD XC7VX690T-2FFG1157C
- Part No.:
- XC7VX690T-2FFG1157C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-2FFG1157C.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,727
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Product details
Overview
XC7VX690T-2FFG1157C from AMD is a high-performance 28 nm FPGA with 693,120 logic cells, 3,648 DSP slices, and 48.8 Mb of block RAM, configured in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package for high-speed serial interface and compute-accelerated embedded systems.
For engineers reviewing the XC7VX690T-2FFG1157C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (500 user I/Os), transceiver line rate (13.1 Gb/s), speed grade (-2), and thermal design power (34 W typical).
Technical Context
The XC7VX690T-2FFG1157C implements a 28 nm HKMG process-based architecture with integrated PCIe Gen3 x8 endpoint, 10/25/100G Ethernet MACs, and hardened AXI interconnect. It supports dual-boot configuration via Quad-SPI and BPI flash interfaces.
It includes 24 transceiver quads supporting up to 24 GTs at 13.1 Gb/s each, with built-in PRBS generators, eye scan, and real-time equalization control. Configuration occurs through JTAG, SelectMAP, or ICAP interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - total configurable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 3,648 - fixed-point arithmetic units with 25×18 multipliers and 48-bit accumulators |
| Block RAM | 48.8 Mb - distributed and block memory resources supporting true dual-port operation |
| User I/O Pins | 500 - LVDS, SSTL, HSTL, and TMDS-capable pins with programmable slew and drive strength |
| Transceiver Speed | 13.1 Gb/s - maximum line rate per GT channel, supporting 10G/25G/100G Ethernet protocols |
| Speed Grade | -2 - timing specification guaranteeing operation at highest performance bin for this device family |
| Thermal Design Power | 34 W typical - thermal envelope requiring active cooling in dense PCB layouts |
Pinout & Package
XC7VX690T-2FFG1157C is housed in a 1157-ball Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation in high-clock-rate applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration logic, SelectIO, and transceiver analog circuitry |
| VCCO | I/O bank power | Programmable 1.2–3.3 V supply per I/O bank; sets voltage standard for connected peripherals |
| MGTAVCC | Transceiver analog supply | 1.0 V analog supply for GTY transceiver PLLs and serializers/deserializers |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
| INIT_B | Configuration status | Open-drain output indicating configuration completion or error during startup |
| CCLK | Configuration clock | Input clock for master SPI configuration mode; frequency ≤ 50 MHz |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint | Hard IP block enabling direct host CPU connectivity without external bridge logic |
| 24 GTY Transceivers | Each supports 10G/25G/100G Ethernet, CPRI, and JESD204B with built-in PRBS and eye scan |
| AXI Interconnect | Hardened crossbar supporting concurrent AXI4-Lite, AXI4, and AXI4-Stream traffic between IPs |
| Partial Reconfiguration | Runtime logic replacement in designated regions without disrupting system operation |
| UltraScale Architecture | Column-based routing with dedicated carry chains and hierarchical clock networks for deterministic timing closure |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel FFTs and adaptive filtering; GTY transceivers interface with ADC/DAC arrays at 10+ GSPS. Use Value: XC7VX690T-2FFG1157C delivers deterministic latency and >100 GOPS compute throughput within 34 W TDP. | Use Scenario: Multi-channel oscilloscopes and spectrum analyzers capturing ≥16-bit data at 1+ GS/s. IC Role / Device Role / Timing Role: XC7VX690T-2FFG1157C manages time-interleaved ADC synchronization, on-the-fly decimation, and PCIe Gen3 streaming to host PC. Use Value: XC7VX690T-2FFG1157C provides 500 user I/Os and 24 GTY lanes for simultaneous high-bandwidth sensor interfacing and host communication. |
| 5G Baseband Processing | AI Edge Inference Acceleration |
Use Scenario: Layer-1 PHY processing in massive MIMO 5G gNodeB units with real-time channel estimation and precoding. IC Role / Device Role / Timing Role: XC7VX690T-2FFG1157C hosts hardened 100G Ethernet MACs and implements LDPC decoding pipelines using DSP slices. Use Value: XC7VX690T-2FFG1157C supports deterministic sub-100 ns latency for closed-loop RF feedback and meets 3GPP Release 16 timing constraints. | Use Scenario: Low-latency inference for vision-based industrial inspection using quantized CNN models. IC Role / Device Role / Timing Role: XC7VX690T-2FFG1157C deploys custom systolic arrays across LUTs and DSP slices, with DMA engines feeding weights from DDR4 via AXI. Use Value: XC7VX690T-2FFG1157C achieves 2.1 TOPS/W efficiency at 100 MHz clock, outperforming GPU-based edge solutions in power-constrained enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1517I | 10nm process, 1.1M logic cells, 5,520 DSP slices, 54.9 Mb BRAM, same 1517-ball FCBGA package | Higher density and bandwidth; supports PCIe Gen4 and CXL; higher static power | Choose XCKU115-2FLVD1517I when migrating to next-gen protocols or requiring >200 Gb/s aggregate I/O bandwidth |
| XC7VX980T-2FFG1930C | Larger variant in same 28 nm family: 983,250 logic cells, 4,860 DSP slices, 64.2 Mb BRAM, 1930-ball FCBGA | Same architecture and toolchain; requires PCB redesign due to larger footprint and different ball map | Choose XC7VX980T-2FFG1930C only when additional logic, DSP, or memory resources are required beyond XC7VX690T-2FFG1157C capacity |
Compared with XCKU115-2FLVD1517I and XC7VX980T-2FFG1930C, the XC7VX690T-2FFG1157C balances I/O count, transceiver density, and thermal envelope for space-constrained 5G and radar platforms where 13.1 Gb/s line rates and PCIe Gen3 are sufficient.
Availability
XC7VX690T-2FFG1157C is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and high-speed data acquisition systems requiring stable component supply across extended production lifecycles.
Supply support for XC7VX690T-2FFG1157C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for data centers, AI, and embedded markets.
The Virtex-7 family, including XC7VX690T-2FFG1157C, was engineered for compute-intensive, high-bandwidth applications such as wireless infrastructure, defense radar, and scientific instrumentation.
FAQ
What is the maximum transceiver line rate supported by XC7VX690T-2FFG1157C?
The XC7VX690T-2FFG1157C supports a maximum transceiver line rate of 13.1 Gb/s per GTY channel. This enables compliance with 10G/25G/100G Ethernet, CPRI, and JESD204B standards. All 24 transceiver quads operate at this rate under -2 speed grade conditions with proper reference clock jitter and PCB layout adherence to AMD's UltraScale layout guidelines.
Does XC7VX690T-2FFG1157C include hardened PCIe Gen3 support?
Yes, XC7VX690T-2FFG1157C integrates a hardened PCIe Gen3 x8 endpoint block. It supports root port and endpoint modes, full power management (ASPM L0s/L1), and ECRC generation/checking. The block operates without soft-core overhead and is validated per PCI-SIG specifications up to 8 GT/s per lane.
What configuration methods are supported by XC7VX690T-2FFG1157C?
XC7VX690T-2FFG1157C supports JTAG, Master SPI (via CCLK and D0), Slave SelectMAP, and ICAP-based partial reconfiguration. Configuration bitstreams can be loaded from Quad-SPI flash (x4 mode), BPI flash, or external processors. Bitstream encryption and HMAC authentication are supported for secure boot.
How many user I/O pins does XC7VX690T-2FFG1157C provide?
XC7VX690T-2FFG1157C provides 500 user-configurable I/O pins across 32 I/O banks. Each bank supports multiple standards including LVDS, SSTL-18, HSTL-I, and TMDS. I/O voltage ranges from 1.2 V to 3.3 V per bank, with programmable drive strength, slew rate, and termination.
What is the thermal design power (TDP) of XC7VX690T-2FFG1157C?
The typical thermal design power (TDP) of XC7VX690T-2FFG1157C is 34 W under worst-case operating conditions (100% logic utilization, 13.1 Gb/s transceivers active, -2 speed grade). Actual power varies with design utilization and I/O activity; AMD Vivado Power Estimator must be used for accurate system-level thermal modeling.
XC7VX690T-2FFG1157C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7VX690T-2FFG1157C FAQ
1.How can I place an order for XC7VX690T-2FFG1157C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-2FFG1157C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-2FFG1157C reliable?
The price and inventory of XC7VX690T-2FFG1157C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-2FFG1157C is usually 5 days.
3.What payment methods are accepted for XC7VX690T-2FFG1157C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-2FFG1157C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX690T-2FFG1157C?
XC7VX690T-2FFG1157C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-2FFG1157C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-2FFG1157C?
For technical support, including XC7VX690T-2FFG1157C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-2FFG1157C requirements.
6.How does Aetrix verify that XC7VX690T-2FFG1157C is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-2FFG1157C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-2FFG1157C meets industry standards.
7.What is the process for return or replacement of XC7VX690T-2FFG1157C?
All XC7VX690T-2FFG1157C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-2FFG1157C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-2FFG1157C part is unused and in its original packaging.
Return procedure for XC7VX690T-2FFG1157C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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