AMD XC7VX690T-2FFG1157I

Overview

XC7VX690T-2FFG1157I from AMD is a high-performance 28 nm FPGA with 693,120 logic cells, 3,600 DSP slices, and 48.8 Mb of block RAM, configured in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package for high-speed serial interface and compute-acceleration applications in radar signal processing.

For engineers reviewing the XC7VX690T-2FFG1157I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gbps, and -2 speed grade timing performance under industrial temperature range (-40°C to +100°C).

Technical Context

This FPGA implements a 28 nm HKMG process-based architecture with SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards including LVDS and TMDS. It integrates 24 GTY transceivers capable of protocol-compliant operation in PCIe Gen3, 10G Ethernet, and CPRI.

The device includes hardened IP blocks for PCI Express® Gen3 x8 endpoint/root port, 10 Gigabit Ethernet MAC, and AXI interconnect infrastructure, enabling deterministic latency and low-jitter clocking via dedicated MMCM and PLL resources.

Key Specifications

Pinout & Package

XC7VX690T-2FFG1157I is housed in a 1157-pin Flip-Chip Fine-Pitch BGA (FFG) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-rate designs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCKU115-2FLVD1517I and XCVU13P-2FHGB2104I, the XC7VX690T-2FFG1157I delivers optimal balance of transceiver performance (13.1 Gbps GTY), PCIe Gen3 x8 integration, and industrial temperature reliability-making it ideal for deployed radar and test equipment where Gen4 or ultra-high logic density are unnecessary overhead.

Availability

XC7VX690T-2FFG1157I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and 5G wireless baseband applications requiring stable component supply across long-lifecycle deployments.

Supply support for XC7VX690T-2FFG1157I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and aerospace/defense markets.

The Virtex-7 family, including XC7VX690T-2FFG1157I, was designed for high-throughput, low-latency signal and packet processing in mission-critical infrastructure where deterministic timing and industrial-grade reliability are essential.

FAQ

What is the maximum supported transceiver line rate for XC7VX690T-2FFG1157I?

The XC7VX690T-2FFG1157I supports a maximum transceiver line rate of 13.1 Gbps using its 24 GTY transceivers. This capability enables compliance with 10G Ethernet, CPRI, and JESD204B v1.1 protocols. The -2 speed grade ensures timing closure at this rate under industrial temperature conditions (-40°C to +100°C). Each GTY transceiver includes integrated PMA and PCS layers with built-in PRBS generators and error detectors.

Does XC7VX690T-2FFG1157I include hardened PCIe Gen3 support?

Yes, XC7VX690T-2FFG1157I integrates a hardened PCIe Gen3 x8 endpoint/root port block. This eliminates the need for soft-core implementations, reduces logic utilization, and guarantees sub-100 ns transaction latency. The block supports both link training and power management states defined in the PCIe Base Spec 3.0, and operates at the full -2 speed grade without derating.

What I/O standards does XC7VX690T-2FFG1157I support?

XC7VX690T-2FFG1157I supports SSTL-15/18, HSTL-I/II, LVCMOS (1.2 V to 3.3 V), LVDS, and TMDS across its 500+ user I/O pins. Each I/O bank is independently configurable for voltage and standard, enabling simultaneous interfacing to DDR3 memory, high-speed ADCs, and video PHYs. Bank-specific VCCO settings allow mixed-voltage operation without level-shifting components.

Is XC7VX690T-2FFG1157I qualified for industrial temperature operation?

Yes, XC7VX690T-2FFG1157I is rated for industrial temperature operation from -40°C to +100°C. This qualification applies to all speed grades and includes full characterization of timing parameters, I/O drive strength, and transceiver jitter performance across the range. The FFG1157 package includes a thermal lid to maintain junction temperature within specification during sustained 20 W+ power dissipation.

Can XC7VX690T-2FFG1157I perform partial reconfiguration?

Yes, XC7VX690T-2FFG1157I supports verified partial reconfiguration (PR) through Vivado Design Suite. PR allows dynamic swapping of logical modules-such as radar waveform engines or protocol stacks-without resetting the entire device. This capability has been validated for use cases including real-time waveform adaptation in electronic warfare systems and field-upgradable communication protocols.