AMD XC7VX690T-2FFG1158C
- Part No.:
- XC7VX690T-2FFG1158C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-2FFG1158C.pdf
- Description:
- IC FPGA 350 I/O 1158FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7VX690T-2FFG1158C from AMD is a high-performance 28 nm Virtex-7 FPGA with 693,120 logic cells, 3,648 DSP slices, and 48.8 Mb of block RAM. It features 1,158-pin flip-chip BGA packaging, supports transceivers up to 13.1 Gb/s, and is used in high-end radar signal processing systems requiring deterministic low-latency data flow.
For engineers reviewing the XC7VX690T-2FFG1158C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O bank voltage flexibility, thermal performance under sustained 20 W dynamic power, and configuration interface compatibility with SPIx4 or SelectMAP.
Technical Context
The XC7VX690T-2FFG1158C implements a segmented architecture with 24 I/O banks supporting selectable VCCO (1.2–1.8 V), dedicated clock routing networks, and integrated PCI Express Gen3 x8 endpoint capability. Its CLB structure includes dual 6-input LUTs with carry chain and distributed RAM per slice.
Configuration occurs via master SPI or slave SelectMAP mode using 256-bit AES decryption; bitstream integrity is enforced by CRC checking on every configuration frame. The device supports partial reconfiguration through ICAP and includes hardened Ethernet MAC blocks for 10/100/1000BASE-T operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - total configurable resources for complex state machines and datapath logic |
| DSP Slices | 3,648 - fixed-point multiply-accumulate units with 25×18 pre-adder support |
| Block RAM | 48.8 Mb - distributed as 36 Kb BRAM primitives usable as dual-port memory or FIFO |
| Transceiver Speed | 13.1 Gb/s - maximum line rate per GTY transceiver channel, compliant with CPRI v7.0 |
| I/O Banks | 24 - independently powered banks supporting mixed-voltage interfaces including LVDS, SSTL, HSTL |
| Configuration Interface | SPIx4 / SelectMAP - dual-mode boot interface with 256-bit AES encryption and CRC validation |
| Thermal Design Power | 20.1 W - typical active power at 100% toggle rate, requiring heatsink + forced airflow |
Pinout & Package
XC7VX690T-2FFG1158C uses a 1158-pin flip-chip fine-pitch BGA (FFG) package with 35 × 35 mm body size, 0.8 mm pitch, and thermal lid. Pin assignment follows Xilinx UG475 v1.15 for Virtex-7 FPGAs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Input clock for master SPI configuration; must be stable before INIT_B deassertion |
| INIT_B | Configuration Status | Open-drain output indicating configuration memory readiness; pulled high during valid bitstream load |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| M0–M2 | Mode Selection | Three-pin bus setting configuration mode (SPI, BPI, SelectMAP, JTAG) at power-up |
| GTY_RXN/TXN | Transceiver Differential Pair | Negative leg of high-speed serial I/O supporting 13.1 Gb/s with internal termination and equalization |
| VCCAUX | Analog Auxiliary Supply | 1.8 V supply for transceivers, configuration logic, and clock management circuitry |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint | Hardened root port logic enabling direct host connection without external bridge IC |
| Partial Reconfiguration | Runtime module swapping via ICAP interface without full device reset or service interruption |
| UltraScale-Compatible Bitstream | Same configuration file format as later UltraScale devices, easing migration path |
| Integrated 1 GbE MAC | Dedicated Ethernet controller supporting full-duplex 1000BASE-T with IEEE 1588 timestamping |
| Multi-Voltage I/O Banks | 24 independent banks each configurable for 1.2 V to 1.8 V VCCO, enabling mixed-interface PCB design |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Primary compute fabric handling FFT, CFAR, and STAP algorithms with deterministic latency. Use Value: 3,648 DSP slices enable concurrent 1024-point FFTs at 200 MHz clock rate with sub-10 ns pipeline jitter. | Use Scenario: Digitizing and preprocessing multi-channel RF signals from wideband ADCs in test equipment. IC Role / Device Role / Timing Role: High-throughput data concentrator and real-time decimation filter engine. Use Value: 1,158 I/O pins support 48-channel LVDS capture at 500 MSPS with on-chip 128-tap FIR filtering. |
| Avionics Communication Hub | Medical Imaging Backend |
Use Scenario: ARINC 429/664 (AFDX) gateway consolidating sensor and control data across aircraft subsystems. IC Role / Device Role / Timing Role: Deterministic time-triggered switch fabric with hardware timestamping and traffic shaping. Use Value: PCIe Gen3 x8 interface enables 7.8 GB/s backplane throughput to host flight computer with <1 µs packet latency. | Use Scenario: Real-time image reconstruction pipeline for digital PET/CT scanners processing raw detector event streams. IC Role / Device Role / Timing Role: Parallel histogramming engine and GPU-offload co-processor for iterative OSEM reconstruction. Use Value: 48.8 Mb block RAM provides on-chip storage for 16 simultaneous 512×512 sinogram buffers with zero DDR access latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577I | 16 nm UltraScale+ architecture, 1,124,000 LUTs, higher transceiver density (64 GTY vs 48), but no native AFDX MAC | Better suited for AI-accelerated imaging pipelines requiring >1 TFLOPS INT8 throughput | Select when migrating to newer process node and requiring higher DSP density or PCIe Gen4 support |
| XC7K410T-2FFG901I | Same 28 nm process, 405,000 logic cells, 1,920 DSP slices, 27.6 Mb BRAM, 901-pin package, lower TDP (12.3 W) | Targeted at cost-sensitive defense electronics where full VX690T capacity is unused | Choose for legacy-compatible designs needing reduced BOM cost and thermal footprint without sacrificing 10 GbE or PCIe Gen2 |
Compared with XC7VX690T-2FFG1158C, the XCVU13P offers higher compute density and Gen4 PCIe but requires board redesign and new toolchain licensing; the XC7K410T retains pin-compatibility within Kintex-7 family but delivers only 58% of logic and 52% of DSP resources.
Availability
XC7VX690T-2FFG1158C is available at Aetrix Electronics and suitable for radar signal processing, avionics communication hubs, and medical imaging backend systems requiring stable component supply across extended production lifecycles.
Supply support for XC7VX690T-2FFG1158C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms combining FPGA, ACAP, and CPU/GPU architectures for data center, aerospace, and industrial markets.
The Virtex-7 family was originally designed by Xilinx as its flagship high-performance FPGA series targeting applications demanding maximum logic density, transceiver bandwidth, and deterministic timing - especially in defense radar, scientific instrumentation, and wired infrastructure.
FAQ
What is the maximum supported transceiver data rate for XC7VX690T-2FFG1158C?
The XC7VX690T-2FFG1158C supports GTY transceivers with a maximum data rate of 13.1 Gb/s per lane, validated per CPRI v7.0 and 10GBASE-R standards. This rate is achievable under specified junction temperature and power supply conditions, and requires proper PCB stackup with controlled impedance traces and matched length routing for differential pairs. The XC7VX690T-2FFG1158C includes built-in TX pre-emphasis and RX equalization to maintain signal integrity at this speed.
Does XC7VX690T-2FFG1158C support partial reconfiguration?
Yes, XC7VX690T-2FFG1158C supports runtime partial reconfiguration via the Internal Configuration Access Port (ICAP). This allows dynamic swapping of functional modules-such as different filter coefficients or protocol engines-without resetting the entire device or interrupting active I/O operations. The XC7VX690T-2FFG1158C requires bitstream partitioning during implementation and adherence to placement constraints defined in UG909 to ensure timing closure across reconfigurable regions.
What configuration modes does XC7VX690T-2FFG1158C support?
XC7VX690T-2FFG1158C supports four primary configuration modes selected by M0–M2 pins: Master SPI (default), Slave SPI, SelectMAP, and JTAG. It also supports fallback configuration from dual SPI flash and supports 256-bit AES encryption with HMAC authentication for secure bitstream loading. The XC7VX690T-2FFG1158C validates each configuration frame using CRC before committing to configuration memory.
Is XC7VX690T-2FFG1158C pin-compatible with other Virtex-7 devices?
No, XC7VX690T-2FFG1158C is not pin-compatible with other Virtex-7 devices due to its unique 1158-pin FFG package and I/O bank layout optimized for high-density transceiver and memory interface routing. While logic resources and configuration interfaces follow Virtex-7 architecture conventions, physical pin mapping differs significantly from smaller variants like XC7VX485T (FFG1157) or XC7VX330T (FFG1157). Board-level reuse requires package-specific layout verification.
What thermal management is required for XC7VX690T-2FFG1158C in continuous operation?
XC7VX690T-2FFG1158C has a typical thermal design power of 20.1 W under full utilization and requires active cooling: a minimum 25 CFM airflow over a 35 mm × 35 mm copper heatsink attached to its thermal lid. Junction temperature must remain below 100°C per UG475. The XC7VX690T-2FFG1158C includes on-die temperature sensors accessible via XADC for closed-loop thermal monitoring and throttling control.
XC7VX690T-2FFG1158C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 350
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1158-FCBGA (35x35)
XC7VX690T-2FFG1158C FAQ
1.How can I place an order for XC7VX690T-2FFG1158C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-2FFG1158C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-2FFG1158C reliable?
The price and inventory of XC7VX690T-2FFG1158C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-2FFG1158C is usually 5 days.
3.What payment methods are accepted for XC7VX690T-2FFG1158C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-2FFG1158C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX690T-2FFG1158C?
XC7VX690T-2FFG1158C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-2FFG1158C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-2FFG1158C?
For technical support, including XC7VX690T-2FFG1158C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-2FFG1158C requirements.
6.How does Aetrix verify that XC7VX690T-2FFG1158C is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-2FFG1158C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-2FFG1158C meets industry standards.
7.What is the process for return or replacement of XC7VX690T-2FFG1158C?
All XC7VX690T-2FFG1158C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-2FFG1158C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-2FFG1158C part is unused and in its original packaging.
Return procedure for XC7VX690T-2FFG1158C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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