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AMD XC7VX690T-2FFG1158I
- Part No.:
- XC7VX690T-2FFG1158I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-2FFG1158I.pdf
- Description:
- IC FPGA 350 I/O 1158FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,161
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Product details
Overview
XC7VX690T-2FFG1158I from AMD is a high-performance 28 nm Virtex-7 FPGA with 693,120 logic cells, 3,648 DSP slices, and 48.8 Mb of block RAM. It features 1158-pin flip-chip BGA packaging, -2 speed grade, and industrial temperature rating (–40°C to +100°C), deployed in radar signal processing and high-throughput data acquisition systems.
For engineers reviewing the XC7VX690T-2FFG1158I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (700 user I/Os), transceiver line rate (13.1 Gb/s), configuration interface (SelectMAP, JTAG, SPI), and thermal design power (32 W typical).
Technical Context
The XC7VX690T-2FFG1158I implements a 28 nm HKMG process-based architecture with integrated multi-gigabit transceivers supporting PCIe Gen3, SRIO Gen2, and 10G Ethernet protocols. It includes hardened IP blocks for PCI Express® Gen3 x8 endpoint/root port and 10 Gigabit Ethernet MAC.
Configuration is supported via Master SelectMAP, Slave SelectMAP, JTAG, or serial SPI modes. The device supports partial reconfiguration and uses internal voltage regulators for core (VCCINT = 0.95 V) and auxiliary (VCCAUX = 1.8 V) domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - determines maximum combinational/sequential logic capacity for complex algorithm implementation |
| DSP Slices | 3,648 - enables parallel multiply-accumulate operations at up to 352 GMAC/s peak throughput |
| Block RAM | 48.8 Mb - supports large on-chip buffering for streaming data pipelines and FIFO depth scaling |
| User I/O Pins | 700 - provides high-density interconnect for multi-board or high-speed parallel bus interfaces |
| Transceiver Line Rate | 13.1 Gb/s - enables direct connection to 10G Ethernet PHYs and optical modules without retiming |
| Speed Grade | -2 - guarantees timing closure at worst-case industrial temperature and voltage conditions |
| Thermal Design Power | 32 W typical - defines heatsink sizing and airflow requirements for sustained operation |
Pinout & Package
XC7VX690T-2FFG1158I is housed in a 1158-pin flip-chip fine-pitch BGA (FFG) package with 35 × 35 mm body size, 0.8 mm ball pitch, and standard I/O bank voltage assignment (VCCO = 1.2/1.35/1.5/1.8/2.5/3.3 V).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Configuration Mode Select | Determines boot source (SPI, BPI, SelectMAP) and configuration width (x8/x16) |
| CCLK | Configuration Clock | Drives synchronous loading of bitstream during master mode configuration |
| DONE | Configuration Status | Open-drain output indicating successful bitstream load and initialization completion |
| INIT_B | Configuration Initialization | Active-low signal asserting reset during configuration failure or reconfiguration |
| PROGRAM_B | Configuration Reset | Active-low input triggering full reinitialization and clearing of configuration memory |
| GTX/GTH RefClk | Transceiver Reference Clock | Provides low-jitter clock input for multi-gigabit transceiver PLL lock and data recovery |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Hard IP | Reduces integration effort and latency for host interface connectivity without soft-core overhead |
| 10G Ethernet MAC Hard IP | Offloads MAC-layer processing from fabric, enabling deterministic frame handling and reduced resource usage |
| Partial Reconfiguration Support | Allows dynamic module swapping in operational systems without full FPGA reset or service interruption |
| Advanced Clock Management (CMT) | Integrates MMCM and PLL blocks for precise clock synthesis, phase alignment, and jitter filtering across multiple domains |
| Integrated ADC (XADC) | Enables real-time monitoring of on-board supply voltages and die temperature without external sensors |
Applications
| Radar Beamforming System | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time adaptive beam steering using phased array antenna with >1,000 channels. IC Role / Device Role / Timing Role: FPGA fabric performs channel weighting, phase rotation, and digital down-conversion; transceivers interface with ADC/DAC arrays. Use Value: 693K logic cells and 3,648 DSP slices enable simultaneous processing of 32 independent beams at 100 MSPS sample rate. | Use Scenario: Multi-channel oscilloscope capturing 16 analog inputs at 1 GSa/s with deep memory buffer. IC Role / Device Role / Timing Role: Coordinates high-speed parallel ADC interfaces, manages DDR3 memory controller, and implements real-time trigger logic. Use Value: 700 user I/Os support 16× LVDS ADC links; 48.8 Mb block RAM stores up to 256 MSamples per channel before offload. |
| Avionics Flight Control Unit | 5G Baseband Processing |
Use Scenario: DO-254-compliant flight control computer executing dual-redundant servo loop algorithms. IC Role / Device Role / Timing Role: Implements safety-critical closed-loop control logic with lockstep dual-core monitoring and error-correcting memory controllers. Use Value: -2 speed grade and industrial temp rating ensure deterministic timing under vibration, altitude, and thermal stress conditions. | Use Scenario: Massive MIMO baseband unit performing precoding, OFDM modulation, and channel estimation for 64 antenna elements. IC Role / Device Role / Timing Role: Executes real-time FFT/iFFT, matrix inversion, and LDPC decoding using hardened DSP slices and BRAM-based buffers. Use Value: 13.1 Gb/s transceivers connect directly to 25G optical interfaces; 3,648 DSP slices sustain >200 GOPS for 5G NR Layer 1 processing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1517I | UltraScale architecture, higher DSP density (5,520 slices), lower power per logic cell, but fewer transceiver lanes (40 vs. 60) | Better suited for compute-dense, lower I/O-count applications like AI inference acceleration | Select when prioritizing computational efficiency over transceiver count and legacy IP reuse |
| XCVU13P-2FLGA2577I | UltraScale+ architecture, 100G Ethernet support, higher memory bandwidth (HBM2), but larger package (2577-ball) and higher cost | Targeted at next-generation 100G/400G networking and cloud-scale data processing | Select when requiring HBM2 integration or 100G transceiver compliance beyond XC7VX690T-2FFG1158I capability |
Compared with XCKU115-2FLVD1517I and XCVU13P-2FLGA2577I, the XC7VX690T-2FFG1158I offers optimal balance of transceiver count, DSP throughput, and mature toolchain support for radar and instrumentation designs where PCIe Gen3 x8 and 10G Ethernet hard IP are required.
Availability
XC7VX690T-2FFG1158I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and avionics flight control systems requiring stable component supply across extended product lifecycles.
Supply support for XC7VX690T-2FFG1158I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Virtex-7 family, including XC7VX690T-2FFG1158I, was engineered for high-bandwidth, high-compute applications such as defense radar, scientific instrumentation, and wired communications infrastructure.
FAQ
What is the maximum transceiver line rate supported by XC7VX690T-2FFG1158I?
The XC7VX690T-2FFG1158I supports a maximum transceiver line rate of 13.1 Gb/s per lane. This enables native interoperability with 10G Ethernet PHYs, CPRI interfaces, and optical modules without external retiming. The device integrates 60 GTH transceivers, each configurable for protocols including PCIe Gen3, SRIO Gen2, and 10GBase-R. The XC7VX690T-2FFG1158I achieves this performance using 28 nm HKMG process technology and calibrated CDR circuitry.
Does XC7VX690T-2FFG1158I support partial reconfiguration?
Yes, the XC7VX690T-2FFG1158I fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic replacement of logical modules while the rest of the design remains operational. Use cases include runtime protocol switching, adaptive filter updates, and fault-tolerant system upgrades. The XC7VX690T-2FFG1158I implements dedicated configuration logic and frame-based bitstream addressing to ensure safe, verified reconfiguration sequences.
What configuration modes are available for XC7VX690T-2FFG1158I?
The XC7VX690T-2FFG1158I supports Master SelectMAP, Slave SelectMAP, JTAG, and serial SPI configuration modes. Mode selection is controlled by M0–M2 pins at power-up. SPI mode enables compact flash storage and fast single-bit loading; SelectMAP supports high-speed parallel programming via microprocessor or dedicated PROM. The XC7VX690T-2FFG1158I also supports fallback configuration and multi-boot from dual SPI flash devices.
What is the thermal design power (TDP) of XC7VX690T-2FFG1158I?
The XC7VX690T-2FFG1158I has a typical thermal design power of 32 W under representative high-activity conditions, including 75% logic utilization, active transceivers, and DDR3 memory controller operation. This value is derived from AMD's XPE (Xilinx Power Estimator) v2018.3 simulation with default voltage settings (VCCINT = 0.95 V). Actual power consumption of the XC7VX690T-2FFG1158I varies with design utilization, clock frequency, and I/O standards.
Is XC7VX690T-2FFG1158I qualified for industrial temperature operation?
Yes, the XC7VX690T-2FFG1158I is rated for industrial temperature operation from –40°C to +100°C case temperature. This qualification applies to the -2 speed grade variant in FFG1158 packaging. The XC7VX690T-2FFG1158I undergoes extended burn-in and characterization across temperature and voltage corners to guarantee timing closure and functional reliability under these conditions.
XC7VX690T-2FFG1158I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 350
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1158-FCBGA (35x35)
XC7VX690T-2FFG1158I FAQ
1.How can I place an order for XC7VX690T-2FFG1158I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-2FFG1158I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-2FFG1158I reliable?
The price and inventory of XC7VX690T-2FFG1158I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-2FFG1158I is usually 5 days.
3.What payment methods are accepted for XC7VX690T-2FFG1158I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-2FFG1158I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX690T-2FFG1158I?
XC7VX690T-2FFG1158I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-2FFG1158I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-2FFG1158I?
For technical support, including XC7VX690T-2FFG1158I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-2FFG1158I requirements.
6.How does Aetrix verify that XC7VX690T-2FFG1158I is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-2FFG1158I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-2FFG1158I meets industry standards.
7.What is the process for return or replacement of XC7VX690T-2FFG1158I?
All XC7VX690T-2FFG1158I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-2FFG1158I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-2FFG1158I part is unused and in its original packaging.
Return procedure for XC7VX690T-2FFG1158I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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