AMD XC7VX690T-2FFG1761C

Overview

XC7VX690T-2FFG1761C from AMD is a high-performance 28 nm Virtex-7 FPGA with 693,120 logic cells, 3,648 DSP slices, and 56.9 Mb of block RAM. It features 1,761-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) packaging and supports transceiver line rates up to 13.1 Gb/s, targeting high-speed serial interface implementation in radar signal processing systems.

For engineers reviewing the XC7VX690T-2FFG1761C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage flexibility (1.2 V to 1.8 V), transceiver compliance with PCIe Gen3 and SRIO Gen2, and thermal design power of 39.2 W at typical operating conditions.

Technical Context

The XC7VX690T-2FFG1761C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), integrated multi-gigabit transceivers (MGTs), and hardened IP for PCI Express, Ethernet, and memory controllers. It supports JTAG and SelectMAP configuration modes and includes built-in system monitoring via on-die temperature and supply sensors.

This device integrates 24 GTX transceivers capable of 13.1 Gb/s operation, dual 36-bit wide DDR3 memory interfaces with 800 MHz data rate support, and AXI4-compliant interconnect fabric for heterogeneous system integration in high-throughput compute acceleration applications.

Key Specifications

Pinout & Package

XC7VX690T-2FFG1761C uses a 1761-ball Flip-Chip Fine-Pitch BGA (FFG) package with 1.0 mm ball pitch, designed for high-density PCB layouts and thermal dissipation via internal thermal slug and top-side heat spreader.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XC7VX690T-2FFG1761C, the XCVU13P-2FLGA2577E offers superior transceiver density and lower static power but requires soft PCIe implementation, while the XC7VX980T-2FFG1930I delivers more logic resources and wider temperature tolerance at the expense of larger footprint and higher TDP.

Availability

XC7VX690T-2FFG1761C is available at Aetrix Electronics and suitable for radar signal processing, high-performance computing acceleration, and 10G/40G optical transport applications requiring stable component supply across long-lifecycle programs.

Supply support for XC7VX690T-2FFG1761C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and aerospace markets.

The Virtex-7 family was engineered for high-bandwidth, low-latency signal processing in defense electronics and wired infrastructure, emphasizing transceiver performance, DSP efficiency, and system-level reliability.

FAQ

What is the maximum supported DDR3 memory interface speed for XC7VX690T-2FFG1761C?

The XC7VX690T-2FFG1761C supports DDR3 memory interfaces operating at 800 MHz data rate (1600 MT/s), implemented using dedicated memory controller IP with phase-aligned clocking and write-leveling calibration. This capability is validated in Xilinx UG473 and applies specifically to the XC7VX690T-2FFG1761C's dual 36-bit memory interfaces. The device does not support LPDDR3 or DDR4 natively.

Does XC7VX690T-2FFG1761C include built-in PCIe Gen3 hard IP?

Yes, XC7VX690T-2FFG1761C integrates a hardened PCIe Gen3 x8 endpoint block compliant with PCI Express Base Specification v3.0. This includes physical layer (PHY), data link layer (DLL), and transaction layer (TL) logic, enabling direct connection to host systems without external protocol translation. Configuration is managed through dedicated AXI4-Lite registers accessible via the device's configuration interface.

What is the operating temperature range specified for XC7VX690T-2FFG1761C?

XC7VX690T-2FFG1761C is rated for commercial temperature operation from 0°C to +85°C ambient, with junction temperature limited to 100°C under sustained load. Thermal derating curves and power consumption tables for this grade are published in Xilinx DS182, and the part number suffix 'C' explicitly denotes the commercial temperature grade.

How many GTX transceivers are available on XC7VX690T-2FFG1761C?

XC7VX690T-2FFG1761C contains 24 GTX transceivers, each capable of line rates from 600 Mb/s to 13.1 Gb/s. These are distributed across four I/O banks (111, 112, 113, 114) and support protocols including CPRI, SRIO Gen2, and 10GBASE-R. Transceiver configuration and calibration are handled by the device's internal GT wizard and referenced in UG476.

Is partial reconfiguration supported on XC7VX690T-2FFG1761C?

Yes, XC7VX690T-2FFG1761C fully supports partial reconfiguration through Vivado Design Suite, allowing dynamic replacement of logical modules while the rest of the design remains operational. This feature relies on frame-based bitstream addressing and requires use of the ICAP (Internal Configuration Access Port) and dedicated reconfigurable partition constraints defined in UG908.