AMD XC7VX690T-2FFG1761I
- Part No.:
- XC7VX690T-2FFG1761I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-2FFG1761I.pdf
- Description:
- IC FPGA 850 I/O 1761FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7VX690T-2FFG1761I from AMD is a high-performance 28 nm Virtex-7 FPGA with 693,120 logic cells, 3,648 DSP slices, and 56.9 Mb of block RAM. It features 1761-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) packaging, supports transceivers up to 13.1 Gb/s, and is used in high-end radar signal processing and 100G optical transport line cards.
For engineers reviewing the XC7VX690T-2FFG1761I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver speed grade (-2), thermal performance in FFG1761 package, I/O bank voltage flexibility, and configuration interface compatibility with SPI/BPI.
Technical Context
The XC7VX690T-2FFG1761I implements a 28 nm HKMG process-based architecture with integrated multi-gigabit transceivers (MGTs), configurable logic blocks (CLBs), and hardened IP including PCIe Gen3 x8, 10/25/100G Ethernet MAC, and AXI interconnect. It supports SelectIO standards from 1.2 V to 3.3 V across 32 I/O banks.
Configuration is performed via Master SPI, Slave Parallel, or JTAG, with dual-boot capability and AES-256 bitstream encryption. The -2 speed grade guarantees timing closure at 13.1 Gb/s transceiver operation and 600 MHz system clocking in worst-case industrial temperature conditions (-40°C to +100°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - total programmable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 3,648 - dedicated arithmetic units supporting 25×18 signed multiply-accumulate per slice |
| Block RAM | 56.9 Mb - distributed and block memory resources for buffering and data storage |
| Transceiver Speed | 13.1 Gb/s - maximum line rate per GTHE2 transceiver channel, enabling 100G KR4/CAUI-4 |
| I/O Banks | 32 - independently voltage-configurable banks supporting mixed-voltage interfaces |
| Speed Grade | -2 - guaranteed timing performance at industrial temperature range and 13.1 Gb/s transceivers |
| Package | FFG1761 - 1761-ball flip-chip BGA with 0.8 mm pitch, optimized for thermal dissipation |
Pinout & Package
XC7VX690T-2FFG1761I uses the FFG1761 package: 1761-ball flip-chip BGA with 0.8 mm pitch, 42.5 mm × 42.5 mm body size, and thermal lid for enhanced heat transfer. Pinout follows AMD's Virtex-7 FPGA pinout standard for FFG1761, with dedicated configuration, clock, transceiver, and I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Input clock for Master SPI configuration mode; drives internal config logic at up to 50 MHz |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and device initialization |
| M0–M2 | Mode Select | Three-pin bus setting configuration mode (SPI, BPI, JTAG, etc.) at power-up |
| GTX/GTH RefClk | Transceiver Reference Clock | Dedicated differential input for transceiver PLL reference; supports 10 MHz–750 MHz range |
| VCCINT | Core Supply | 1.0 V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary Supply | 1.8 V supply for configuration logic, transceiver analog circuitry, and select I/O banks |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x8 | Integrated endpoint/root-complex controller eliminating external bridge IC and reducing latency |
| AXI Interconnect | Configurable crossbar supporting up to 16 AXI4 master/slave interfaces for SoC-like subsystem integration |
| AES-256 Encryption | On-chip decryption engine enabling secure bitstream loading without external crypto controller |
| Partial Reconfiguration | Dynamic logic module swapping during operation, enabling adaptive signal processing in radar and comms systems |
| UltraScale-Compatible Toolflow | Supports Vivado 2018.3+ with identical IP reuse path toward Virtex UltraScale+ migration |
Applications
| Radar Signal Processing | 100G Optical Transport |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Primary compute fabric handling FFT, CFAR, and STAP algorithms with deterministic latency under 200 ns. Use Value: 3,648 DSP slices enable concurrent 4K-point FFTs at 100 MHz clock; transceivers interface directly to ADC/DAC JESD204B v1.4 links. | Use Scenario: Line-side termination and OTU4 framing in metro/core DWDM optical line cards. IC Role / Device Role / Timing Role: Protocol-aware packet processor implementing OTN G.709 mapping, FEC, and 100G Ethernet MAC functions. Use Value: Hardened 100G Ethernet MAC and KR4 CAUI-4 support eliminate external PHY; 56.9 Mb block RAM buffers full OTU4 frames. |
| High-Performance Computing Acceleration | Test & Measurement Equipment |
Use Scenario: FPGA-accelerated financial risk modeling and Monte Carlo simulation in low-latency trading platforms. IC Role / Device Role / Timing Role: Co-processor offloading compute-intensive kernels from x86 host via PCIe Gen3 x8 interface. Use Value: PCIe Gen3 x8 hard IP ensures sub-500 ns read/write latency; 693K logic cells implement parallelized pricing engines. | Use Scenario: Real-time spectrum analysis and protocol decoding in 6 GHz+ vector signal analyzers. IC Role / Device Role / Timing Role: Digital down-converter (DDC) and symbol timing recovery engine synchronized to 10 MHz OCXO reference. Use Value: GTX transceivers accept 5 GSPS ADC samples via JESD204B; deterministic CLB routing enables <10 ns jitter on trigger paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU19P-2FLGB2104I | UltraScale+ architecture; higher logic density (1.9M LC), 25.8 Gb/s transceivers, but larger FCBGA2104 package | Better suited for next-gen 400G/800G optical and AI inference acceleration requiring >100 TOPS equivalent throughput | Select when migrating beyond 13.1 Gb/s line rates or requiring >1.5× logic capacity; requires PCB redesign |
| XC7VX980T-2FFG1930I | Same Virtex-7 family and -2 speed grade; 983,040 logic cells, 5,376 DSP slices, FFG1930 package (1930 balls) | Higher resource count supports more parallel channels in wideband electronic warfare systems | Choose for increased DSP and memory bandwidth where FFG1930 board space and thermal budget allow |
Compared with XC7VX690T-2FFG1761I, XCVU19P-2FLGB2104I offers higher transceiver speed and logic density but demands new layout and toolchain upgrades, while XC7VX980T-2FFG1930I provides direct architectural continuity and pin-compatible scalability within the Virtex-7 family at the cost of larger footprint and power.
Availability
XC7VX690T-2FFG1761I is available at Aetrix Electronics and suitable for radar signal processing, 100G optical transport, and high-performance computing acceleration requiring stable component supply over extended production lifecycles.
Supply support for XC7VX690T-2FFG1761I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency.
The Virtex-7 FPGA product line targets high-bandwidth, low-latency applications in aerospace, defense, wired communications, and test equipment where deterministic timing and hardened IP are critical.
FAQ
What is the maximum transceiver line rate supported by XC7VX690T-2FFG1761I?
The XC7VX690T-2FFG1761I supports a maximum transceiver line rate of 13.1 Gb/s per GTHE2 channel. This is guaranteed under the -2 speed grade at industrial temperature range (-40°C to +100°C) and enables protocols including 100G KR4, CAUI-4, and CPRI Option 10. The transceiver architecture includes built-in clock data recovery (CDR) and adaptive equalization.
Does XC7VX690T-2FFG1761I support partial reconfiguration?
Yes, XC7VX690T-2FFG1761I fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic swapping of logic modules during runtime-critical for adaptive radar waveform changes or protocol stack updates in optical transport without full device reset. Configuration security and timing isolation between static and reconfigurable regions are hardware-enforced.
What configuration modes are available for XC7VX690T-2FFG1761I?
XC7VX690T-2FFG1761I supports Master SPI, Slave Parallel, JTAG, and BPI configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Dual-boot capability enables fallback to a secondary bitstream stored in external flash, and AES-256 encryption secures bitstream loading against unauthorized access.
What is the core voltage requirement for XC7VX690T-2FFG1761I?
XC7VX690T-2FFG1761I requires a tightly regulated 1.0 V ±3% supply on VCCINT for the FPGA fabric and CLBs. Deviation beyond this tolerance risks timing violations or configuration failure. AMD recommends using dedicated low-noise DC/DC converters with <10 mV ripple and proper decoupling near the FFG1761 package corners.
Is XC7VX690T-2FFG1761I pin-compatible with other Virtex-7 FFG1761 devices?
Yes, XC7VX690T-2FFG1761I shares identical pinout and package dimensions with other Virtex-7 FPGAs in the FFG1761 footprint, including XC7VX485T and XC7VX550T. However, I/O bank assignments, transceiver locations, and configuration pin behavior remain consistent only within the same speed grade and temperature grade, requiring verification via AMD's pin planning tools.
XC7VX690T-2FFG1761I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 850
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7VX690T-2FFG1761I FAQ
1.How can I place an order for XC7VX690T-2FFG1761I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-2FFG1761I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC7VX690T-2FFG1761I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-2FFG1761I is usually 5 days.
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5.How can I obtain technical support or documentation for XC7VX690T-2FFG1761I?
For technical support, including XC7VX690T-2FFG1761I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-2FFG1761I requirements.
6.How does Aetrix verify that XC7VX690T-2FFG1761I is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-2FFG1761I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-2FFG1761I meets industry standards.
7.What is the process for return or replacement of XC7VX690T-2FFG1761I?
All XC7VX690T-2FFG1761I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-2FFG1761I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-2FFG1761I part is unused and in its original packaging.
Return procedure for XC7VX690T-2FFG1761I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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