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AMD XC7VX690T-2FFG1927C
- Part No.:
- XC7VX690T-2FFG1927C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-2FFG1927C.pdf
- Description:
- IC FPGA 600 I/O 1927FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,890
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Product details
Overview
XC7VX690T-2FFG1927C from AMD is a high-performance 28 nm Virtex-7 FPGA with 693,120 logic cells, 3,648 DSP slices, and 56.5 Mb of block RAM. It features 1,927-pin flip-chip BGA packaging, supports transceiver line rates up to 13.1 Gb/s, and targets high-speed serial interface and signal processing applications in radar and wired communications.
For engineers reviewing the XC7VX690T-2FFG1927C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count (72 GTs), I/O voltage support (1.2 V to 3.3 V), thermal design power (32 W typical), and configuration interface (JTAG, SelectMAP, SPI).
Technical Context
The XC7VX690T-2FFG1927C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 Kb block RAM (BRAM), and integrated 72 multi-gigabit transceivers (GTs). It supports PCIe Gen3 x8, 10G Ethernet, and CPRI protocols via dedicated hard IP.
Configuration is performed through Master SelectMAP or JTAG using external flash or processor-controlled interfaces. The device includes clock management tiles (CMT) with MMCM and PLL for jitter reduction and frequency synthesis across multiple domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - total programmable LUT/FF pairs for complex digital logic implementation |
| DSP Slices | 3,648 - fixed-point arithmetic units supporting 25 × 18-bit multiply-accumulate per slice |
| Block RAM | 56.5 Mb - distributed as 36 Kb BRAM primitives for on-chip data buffering and FIFOs |
| Transceivers | 72 GTs - each supports 1.6–13.1 Gb/s line rates with protocol-specific encoding (8B/10B, 64B/66B) |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - supports mixed-voltage operation across 1.2 V to 3.3 V banks |
| Configuration Interface | JTAG, Master SelectMAP, SPIx4 - enables in-system programming and secure bitstream loading |
| Thermal Design Power | 32 W (typical) - defines heatsink and airflow requirements for sustained operation at -2°C to 85°C junction |
Pinout & Package
XC7VX690T-2FFG1927C uses a 1,927-ball flip-chip BGA (FFG) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation in high-performance compute and communications modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multi-purpose I/O bank | Configurable as GPIO, SDIO, UART, SPI, or I2C interfaces; supports 1.8 V/3.3 V signaling |
| GTGREFCLK[0:3] | Transceiver reference clock input | Dedicated differential inputs for GT tile clocking; requires external 100–700 MHz source |
| CONFIG_IO | Configuration mode select | Defines boot source (SPI/JTAG/SelectMAP); pulled high by default for SPI master mode |
| INIT_B | Configuration status output | Active-low open-drain signal indicating successful bitstream load or error condition |
| PROGRAM_B | Configuration reset input | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| CLK_IN1_P/N | Primary global clock input | Differential pair feeding MMCM/PLL for system-wide clock generation and domain synchronization |
Key Features
| Feature | Design Value |
|---|---|
| 72 Multi-Gigabit Transceivers | Enables 10G Ethernet, CPRI, and PCIe Gen3 x8 links without external retimers or SerDes chips |
| Integrated Clock Management | MMCM + PLL blocks provide sub-100 fs jitter performance and dynamic phase shift for timing-critical interfaces |
| Partial Reconfiguration Support | Allows runtime logic module swapping without full device reset-critical for adaptive radio and real-time protocol stacks |
| Secure Bitstream Encryption | AES-256 decryption with HMAC authentication prevents unauthorized configuration and intellectual property theft |
| UltraScale-Compatible Toolflow | Uses Vivado 2023.1+ for synthesis, place-and-route, and bitstream generation-same flow as newer families |
Applications
| Radar Signal Processing | 10G Base-R Ethernet Switching |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT, CFAR, and STAP algorithms; GTs interface with ADC/DAC over JESD204B. Use Value: 693K logic cells and 3,648 DSP slices enable parallel processing of 16+ RF channels with <10 µs latency. | Use Scenario: Line-rate packet forwarding and classification in Layer 2/3 enterprise switches. IC Role / Device Role / Timing Role: Implements MAC, classifier, and buffer management logic; GTs handle 10GBASE-R PHY layer serialization/deserialization. Use Value: 72 GTs support 8×10G ports with full-duplex operation and hardware-accelerated ACL lookups. |
| CPRI-Based Wireless Infrastructure | High-Performance Test Equipment |
Use Scenario: Remote radio head (RRH) baseband processing in LTE/5G macrocells. IC Role / Device Role / Timing Role: Processes IQ data streams, performs CFR and DPD, and manages CPRI framer/de-framer logic. Use Value: 13.1 Gb/s GT line rate matches CPRI Option 10 (24.33 Gb/s aggregate) with minimal external components. | Use Scenario: High-speed digital pattern generation and acquisition in ATE platforms. IC Role / Device Role / Timing Role: Generates synchronized multi-channel test vectors; captures response data via high-speed I/O banks. Use Value: 1,927-ball FFG package enables >500 MHz I/O toggle rates and deterministic timing closure for 100+ pin tests. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVF1924I | 1.2 million logic cells, 5,520 DSP slices, 100 GTs, 16 nm process; higher density but different pinout and power envelope | Targets next-gen 5G massive MIMO and AI inference acceleration where higher throughput justifies redesign | Select when migrating to UltraScale+ architecture with need for >100 GTs and lower static power |
| XC7VX980T-2FFG1930I | 979,200 logic cells, 4,848 DSP slices, 72 GTs, same 28 nm node; larger die, extended temperature (-40°C to 100°C) | Suitable for aerospace and defense deployments requiring extended thermal range and higher logic capacity | Choose for mission-critical environments needing wider operating temperature and additional CLBs without changing GT count |
Compared with XC7VX690T-2FFG1927C, the XCKU115 offers greater logic and transceiver resources at 16 nm but requires board redesign, while the XC7VX980T provides higher logic density and extended temperature rating within the same Virtex-7 family and compatible toolflow.
Availability
XC7VX690T-2FFG1927C is available at Aetrix Electronics and suitable for radar signal processing, 10G Ethernet switching, and CPRI wireless infrastructure requiring stable component supply and long-term industrial availability.
Supply support for XC7VX690T-2FFG1927C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.
The Virtex-7 family delivers high logic density and serial bandwidth for demanding signal processing, networking, and scientific computing applications-designed for systems requiring deterministic low-latency and multi-protocol flexibility.
FAQ
What is the maximum transceiver line rate supported by XC7VX690T-2FFG1927C?
The XC7VX690T-2FFG1927C supports a maximum transceiver line rate of 13.1 Gb/s per GT channel. This capability enables compliance with CPRI Option 10, 10GBASE-R Ethernet, and PCIe Gen3 protocols. Each of the 72 GTs can be independently configured for this rate, provided reference clock quality and PCB interconnect meet IBIS-AMI simulation requirements.
Does XC7VX690T-2FFG1927C support partial reconfiguration?
Yes, XC7VX690T-2FFG1927C fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic replacement of logic modules during operation without resetting the entire device. Use cases include adaptive filtering in radar, protocol stack updates in wireless infrastructure, and real-time test pattern changes in ATE systems.
What configuration modes are available for XC7VX690T-2FFG1927C?
XC7VX690T-2FFG1927C supports three primary configuration modes: Master SPI (default), JTAG, and Master SelectMAP. SPI mode loads bitstream from external quad-SPI flash; JTAG enables debugging and programming via boundary-scan; SelectMAP allows processor-controlled parallel configuration using 8- or 16-bit bus interface.
What is the operating temperature grade of XC7VX690T-2FFG1927C?
XC7VX690T-2FFG1927C is rated for commercial temperature operation (0°C to 85°C ambient, -2°C to 85°C junction). It is not qualified for industrial (-40°C to 100°C) or extended temperature ranges. For such environments, consider the XC7VX980T-2FFG1930I variant, which shares the same GT count and architecture but is specified across -40°C to 100°C.
How many block RAM bits does XC7VX690T-2FFG1927C provide?
XC7VX690T-2FFG1927C provides 56.5 Mb of total block RAM capacity, implemented as 1,570 instances of 36 Kb BRAM primitives. These are configurable as true dual-port RAM, ROM, or FIFO, and support byte-write enable and parity generation for safety-critical applications.
XC7VX690T-2FFG1927C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1927-FCBGA (45x45)
XC7VX690T-2FFG1927C FAQ
1.How can I place an order for XC7VX690T-2FFG1927C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-2FFG1927C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-2FFG1927C reliable?
The price and inventory of XC7VX690T-2FFG1927C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-2FFG1927C is usually 5 days.
3.What payment methods are accepted for XC7VX690T-2FFG1927C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-2FFG1927C transactions.
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XC7VX690T-2FFG1927C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-2FFG1927C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-2FFG1927C?
For technical support, including XC7VX690T-2FFG1927C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-2FFG1927C requirements.
6.How does Aetrix verify that XC7VX690T-2FFG1927C is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-2FFG1927C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-2FFG1927C meets industry standards.
7.What is the process for return or replacement of XC7VX690T-2FFG1927C?
All XC7VX690T-2FFG1927C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-2FFG1927C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-2FFG1927C part is unused and in its original packaging.
Return procedure for XC7VX690T-2FFG1927C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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