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AMD XC7VX690T-2FFG1927I
- Part No.:
- XC7VX690T-2FFG1927I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-2FFG1927I.pdf
- Description:
- IC FPGA 600 I/O 1927FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,560
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Product details
Overview
XC7VX690T-2FFG1927I from AMD is a high-performance 28 nm Virtex-7 FPGA with 693,120 logic cells, 3,696 DSP slices, and 4,840 kbits of block RAM. It features 1927-pin flip-chip BGA packaging, supports transceivers up to 13.1 Gb/s, and targets high-speed serial interface and signal processing applications in radar and wired communications.
For engineers reviewing the XC7VX690T-2FFG1927I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O voltage support (1.2 V/1.5 V/1.8 V), thermal design power (29.2 W typical), and -2 speed grade timing closure margin.
Technical Context
The XC7VX690T-2FFG1927I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 × 36-bit signed multipliers in DSP slices, and integrated PCIe Gen3 x8 endpoint capability. It includes 72 transceiver quads supporting protocols including SRIO, CPRI, and 10GBASE-R.
Configuration occurs via dual-mode JTAG or SelectMAP interface; configuration memory is loaded from external SPI flash. The device supports partial reconfiguration and AXI4-Stream interfaces for real-time data path integration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - determines maximum combinational and sequential logic capacity for complex RTL implementation |
| DSP Slices | 3,696 - enables parallel execution of 36-bit multiply-accumulate operations per slice |
| Block RAM | 4,840 kbits - provides on-die memory for FIFOs, buffers, and coefficient storage without external memory |
| Transceiver Speed | 13.1 Gb/s - supports 10G Ethernet, CPRI Option 3, and Interlaken line rates |
| I/O Standards | LVCMOS, SSTL, HSTL, LVDS - allows direct interfacing with DDR3-1866, QDR-IV, and SERDES PHYs |
| Speed Grade | -2 - guarantees timing closure at higher clock frequencies than -1 grade, with tighter setup/hold margins |
| TDP | 29.2 W typical - defines thermal solution requirements for sustained operation under full transceiver + logic load |
Pinout & Package
XC7VX690T-2FFG1927I uses a 1927-ball flip-chip BGA (FFG) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation via internal thermal slug. Pin assignment follows Xilinx (now AMD) Virtex-7 FFG1927 mechanical and electrical specification.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% regulated input powering CLBs, interconnect, and configuration logic |
| VCCAUX | Auxiliary supply | 1.8 V supply for configuration circuitry, transceiver analog bias, and select I/O banks |
| VCCO | I/O bank supply | Configurable per-bank voltage (1.2 V/1.35 V/1.5 V/1.8 V/2.5 V/3.3 V) enabling mixed-voltage interface support |
| MGTAVCC | Transceiver analog supply | 1.0 V analog rail for high-speed serial transceiver PLLs and CDR circuits |
| CONFIG_IO | Configuration I/O | Dedicated pins for JTAG TCK/TMS/TDI/TDO and SelectMAP data/control signals |
| CLK_IN | Global clock input | Dedicated differential inputs routed to MMCM/PLL for low-jitter clock synthesis and distribution |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Endpoint | Integrated hard IP supporting root complex or endpoint mode without soft-core resource consumption |
| Partial Reconfiguration | Enables dynamic logic module swapping during operation, reducing system downtime and enabling adaptive signal processing |
| AXI4-Stream Interface | Standardized streaming data protocol support across all major IP cores for seamless data path composition |
| 72 Transceiver Quads | Each quad delivers four independent 13.1 Gb/s lanes, enabling 288 total transceiver channels for multi-protocol aggregation |
| UltraScale-Compatible Toolflow | Supports Vivado 2018.3+ for synthesis, place-and-route, and bitstream generation with timing-aware optimization |
Applications
| Radar Signal Processing | High-Speed Wired Communications |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT, CFAR, and STAP algorithms; transceivers interface with ADC/DAC over JESD204B v1.1. Use Value: 693K logic cells and 3,696 DSP slices enable concurrent multi-channel processing at 10+ GSPS aggregate throughput. | Use Scenario: Line card implementation in 100G OTN transport equipment with OTU4 framing and FEC offload. IC Role / Device Role / Timing Role: Handles OTU4 mapping, Reed-Solomon decoding, and 100G Ethernet MAC layer; transceivers link to CFP2 optical modules. Use Value: Native 13.1 Gb/s transceivers and PCIe Gen3 x8 support deterministic latency for packet buffering and header inspection. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: Raw data aggregation and preprocessing in MRI and CT scanner backends with multi-sensor synchronization. IC Role / Device Role / Timing Role: Aggregates parallel ADC streams via LVDS I/O banks; performs real-time image reconstruction using pipelined FFT engines. Use Value: 4,840 kbits of block RAM and 1.0 V core supply enable low-power, high-throughput memory-intensive kernels. | Use Scenario: High-resolution digital oscilloscope front-end with 10 GS/s sampling and deep memory capture. IC Role / Device Role / Timing Role: Manages time-interleaved ADC control, real-time trigger detection, and waveform compression before host transfer. Use Value: -2 speed grade ensures sub-100 ps timing margin for 500 MHz internal clocks driving sample alignment logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU190-2FLGB2104I | UltraScale+ architecture, 1.3M logic cells, 5,520 DSP slices, 16.3 Gb/s transceivers, 2104-ball FCBGA | Better DSP density and transceiver speed; requires updated toolchain (Vivado 2019.1+) and revised PCB layout | Select when migrating to newer process node with higher bandwidth and lower power per DSP operation |
| XC7VX980T-2FFG1927I | Same Virtex-7 family, 983,200 logic cells, 4,452 DSP slices, identical 1927-ball FFG package and pinout | Higher logic and DSP capacity; same thermal and board footprint; compatible with existing PCB | Choose for increased algorithm complexity without layout change-requires validation of power delivery headroom |
Compared with XC7VX690T-2FFG1927I, the XC7VX980T-2FFG1927I offers drop-in logic scalability while the XCVU190-2FLGB2104I delivers architectural advancement at the cost of board redesign and tool migration.
Availability
XC7VX690T-2FFG1927I is available at Aetrix Electronics and suitable for radar signal processing, 100G communications infrastructure, and medical imaging backend systems requiring stable component supply across extended production lifecycles.
Supply support for XC7VX690T-2FFG1927I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions through FPGA, adaptive SoC, and AI processor technologies acquired from Xilinx in 2022.
The Virtex-7 family was originally developed by Xilinx to serve high-bandwidth, compute-intensive applications in aerospace, defense, and wired infrastructure where deterministic latency and multi-protocol transceiver flexibility are critical.
FAQ
What is the maximum transceiver data rate supported by XC7VX690T-2FFG1927I?
The XC7VX690T-2FFG1927I supports a maximum transceiver line rate of 13.1 Gb/s per lane. This enables compliance with 10GBASE-R, CPRI Option 3, and Interlaken protocols. The device contains 72 transceiver quads, each with four independent lanes, and operates within specified jitter tolerance limits defined in DS183 and UG476 documentation.
Does XC7VX690T-2FFG1927I support partial reconfiguration?
Yes, XC7VX690T-2FFG1927I supports partial reconfiguration through dedicated configuration logic and frame-based bitstream loading. This capability allows dynamic replacement of logic modules without resetting the entire device, enabling adaptive signal processing workflows. Implementation requires Vivado Design Suite 2017.4 or later and adherence to hierarchical design constraints.
What I/O standards are supported by XC7VX690T-2FFG1927I?
XC7VX690T-2FFG1927I supports LVCMOS (1.2 V to 3.3 V), SSTL (Class I/II), HSTL (Class I/III), and differential standards including LVDS, BLVDS, and RSDS. Each I/O bank is independently configurable for voltage and standard, allowing mixed-interface designs such as DDR3-1866 memory controllers alongside JESD204B ADC links.
Is XC7VX690T-2FFG1927I pin-compatible with other Virtex-7 FFG1927 devices?
Yes, XC7VX690T-2FFG1927I shares the same 1927-ball FFG package footprint and pinout with other Virtex-7 devices in the FFG1927 variant, including XC7VX980T-2FFG1927I and XC7VX1140T-2FFG1927I. Power and configuration pin assignments are identical; however, unused I/O pins may differ in bank allocation and voltage support.
What is the thermal design power (TDP) of XC7VX690T-2FFG1927I?
The typical thermal design power (TDP) of XC7VX690T-2FFG1927I is 29.2 W under worst-case operating conditions with full transceiver and logic utilization. This value is derived from Xilinx UG476 and DS183 characterization data and assumes 85°C junction temperature, 1.0 V VCCINT, and active cooling. Actual power varies based on design utilization and I/O activity.
XC7VX690T-2FFG1927I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1927-FCBGA (45x45)
XC7VX690T-2FFG1927I FAQ
1.How can I place an order for XC7VX690T-2FFG1927I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-2FFG1927I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-2FFG1927I reliable?
The price and inventory of XC7VX690T-2FFG1927I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-2FFG1927I is usually 5 days.
3.What payment methods are accepted for XC7VX690T-2FFG1927I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-2FFG1927I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX690T-2FFG1927I?
XC7VX690T-2FFG1927I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-2FFG1927I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-2FFG1927I?
For technical support, including XC7VX690T-2FFG1927I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-2FFG1927I requirements.
6.How does Aetrix verify that XC7VX690T-2FFG1927I is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-2FFG1927I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-2FFG1927I meets industry standards.
7.What is the process for return or replacement of XC7VX690T-2FFG1927I?
All XC7VX690T-2FFG1927I units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-2FFG1927I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-2FFG1927I part is unused and in its original packaging.
Return procedure for XC7VX690T-2FFG1927I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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