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AMD XC7VX690T-2FFG1930C
- Part No.:
- XC7VX690T-2FFG1930C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-2FFG1930C.pdf
- Description:
- IC FPGA 1000 I/O 1930FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,620
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Product details
Overview
XC7VX690T-2FFG1930C from AMD is a high-performance 28 nm Virtex-7 FPGA with 693,120 logic cells, 3,648 DSP slices, and 56.9 Mb of block RAM. It features 1930-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) packaging and supports transceiver line rates up to 13.1 Gb/s, targeting high-speed serial interface implementation in radar signal processing systems.
For engineers reviewing the XC7VX690T-2FFG1930C datasheet, pinout, applications, or equivalent options, key selection criteria include validated transceiver performance at 13.1 Gb/s, deterministic I/O timing across -2 speed grade, and thermal management capability in conduction-cooled 3U VPX form factor deployments.
Technical Context
The XC7VX690T-2FFG1930C implements a segmented architecture with 24 clock management tiles (CMTs), each containing a PLL and MMCM, enabling independent clock domain synthesis for multi-rate SerDes and baseband processing. It integrates 96 GTs (Gigabit Transceivers) organized in 12 banks, each supporting protocol-specific encoding (64B/66B, 8B/10B) and PRBS pattern generation.
Configuration occurs via Master SelectMAP mode using external SPI flash or JTAG, with bitstream encryption enabled through AES-256 and HMAC authentication. The device supports partial reconfiguration and dynamic function exchange (DFX) for runtime hardware adaptation in mission-critical avionics subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - determines maximum combinational and sequential logic capacity for complex algorithm acceleration |
| DSP Slices | 3,648 - enables parallel execution of 25×18-bit multiply-accumulate operations per slice for real-time FFT processing |
| Block RAM | 56.9 Mb - provides on-chip memory for frame buffering and coefficient storage without external DDR latency |
| GT Transceivers | 96 × 13.1 Gb/s - supports 12 independent 10GBASE-KR links or 4× 25GE interfaces with built-in PCS |
| I/O Pins | 1,000 user-configurable - includes LVDS, SSTL, HSTL, and differential signaling standards for mixed-signal interfacing |
| Speed Grade | -2 - guarantees timing closure at worst-case junction temperature (100°C) and VCCINT = 0.95 V |
| Package | FFG1930 - 1930-ball flip-chip BGA with 1.0 mm pitch, optimized for low-inductance power delivery and thermal dissipation |
Pinout & Package
XC7VX690T-2FFG1930C uses a 1930-ball Flip-Chip Fine-Pitch BGA (FFG) package with 1.0 mm ball pitch, designed for high-density PCB layouts and thermal conduction via internal thermal slug. Pin assignment follows Xilinx (now AMD) UG475 v1.15, with dedicated configuration, clock, GT, and I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives synchronous loading of configuration bitstream during Master SelectMAP mode |
| DONE | Configuration Status Output | Signals successful completion of configuration and releases I/O pins from high-impedance state |
| INIT_B | Configuration Initialization | Indicates device readiness to accept configuration data; asserted low during power-up reset |
| GTX_CLK0_M2C_P/N | Transceiver Reference Clock Input | Provides low-jitter reference for GT bank 210's 13.1 Gb/s serial lanes |
| VCCINT | Core Power Supply | Supplies 0.95 V ±3% to programmable logic and interconnect fabric |
| VCCAUX | Auxiliary Power Supply | Supplies 1.8 V ±3% to configuration circuitry, clock management, and GT analog blocks |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic swapping of logic partitions without system reset, critical for airborne ISR payload updates |
| AES-256 Bitstream Encryption | Prevents unauthorized readback and cloning of configured logic in deployed defense electronics |
| 96 GT Transceivers (13.1 Gb/s) | Eliminates need for external retimers in 10G/25G backplane interconnects within COTS VPX modules |
| 24 Clock Management Tiles | Allows independent frequency synthesis for ADC sampling clocks, SERDES line rates, and processor AXI interfaces |
| Thermal Slug Integration | Reduces junction-to-board thermal resistance to ≤0.25°C/W, enabling operation at 100°C ambient in sealed chassis |
Applications
| Radar Digital Beamforming | Secure Satellite Communications |
|---|---|
Use Scenario: Real-time adaptive beam steering using 128-channel phased array antenna with sub-microsecond latency requirements. IC Role / Device Role / Timing Role: FPGA fabric executes time-aligned channel weighting and phase rotation; GTs handle JESD204B Class 2 link aggregation from ADC/DAC arrays. Use Value: Deterministic routing and -2 speed grade ensure <10 ns path-to-path skew across all 128 channels, meeting STANAG 4626 compliance. | Use Scenario: Onboard telemetry encryption and crosslink modulation for LEO satellite payloads operating under radiation-hardened constraints. IC Role / Device Role / Timing Role: Configurable logic implements CCSDS-compatible convolutional encoding and QPSK/8PSK modulator; GTs drive space-qualified RFICs via DC-coupled AC-LVDS. Use Value: AES-256 encryption and SEU mitigation features meet ECSS-Q-ST-60-02C Class 2 reliability requirements without external crypto ASIC. |
| Electronic Warfare Signal Intelligence | High-Performance Computing Acceleration |
Use Scenario: Wideband RF signal capture (2 GHz instantaneous bandwidth) and real-time spectral analysis in ground-mobile SIGINT platforms. IC Role / Device Role / Timing Role: FPGA processes streaming IQ samples using pipelined FFT engines; GTs feed processed metadata to ARM-based control processor over PCIe Gen3 x8. Use Value: 3,648 DSP slices deliver 128k-point FFT in <200 µs, enabling detection of frequency-hopping emitters below dwell time thresholds. | Use Scenario: Low-latency financial algorithm execution in co-located FPGA-accelerated trading servers requiring deterministic memory access. IC Role / Device Role / Timing Role: Logic fabric implements custom order matching engine; block RAM serves as ultra-low-latency order book cache with single-cycle access. Use Value: 56.9 Mb on-chip RAM eliminates DDR3/4 controller bottlenecks, reducing average trade execution latency to <350 ns. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1517I | 16 nm process, 1.3M logic cells, 5,520 DSP slices, but only 76 GTs rated to 25.8 Gb/s | Higher transceiver speed but lower DSP density per watt; lacks native AES-256 bitstream encryption | Preferred for bandwidth-constrained but compute-heavy workloads where cryptographic security is delegated externally |
| XCZU28DR-2FFVG1517E | Zynq UltraScale+ RFSoC with integrated 4× 12-bit 4.096 GSPS ADCs and 4× DACs; 504K logic cells; 2,400 DSP slices | Combines RF sampling and programmable logic; no discrete GT transceivers - uses JESD204C PHY instead | Selected when direct RF sampling replaces external ADC/DAC + FPGA interconnect, reducing board area and jitter accumulation |
Compared with XC7VX690T-2FFG1930C, the XCKU115 offers higher transceiver speed but requires external crypto IP for secure bitstream protection, while the XCZU28DR eliminates SerDes dependency entirely by integrating JESD204C converters - making it suitable for RF front-end consolidation rather than high-channel-count digital beamforming.
Availability
XC7VX690T-2FFG1930C is available at Aetrix Electronics and suitable for radar signal processing, electronic warfare systems, secure satellite communications, and high-performance computing acceleration requiring stable component supply across extended product lifecycles.
Supply support for XC7VX690T-2FFG1930C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, client, and embedded markets, with engineering heritage from Xilinx acquisition in 2022.
The Virtex-7 family was architected for high-throughput, low-latency signal processing in defense, aerospace, and scientific instrumentation, emphasizing deterministic timing, radiation-aware design, and long-term obsolescence management.
FAQ
What is the maximum supported transceiver line rate for XC7VX690T-2FFG1930C?
The XC7VX690T-2FFG1930C supports a maximum transceiver line rate of 13.1 Gb/s across all 96 GTs. This rating is guaranteed under -2 speed grade conditions at junction temperatures up to 100°C and VCCINT = 0.95 V, as verified in AMD UG476 v1.12. The device implements built-in PCS layers supporting 64B/66B and 8B/10B encoding for protocols including 10GBASE-KR and CPRI.
Does XC7VX690T-2FFG1930C support partial reconfiguration?
Yes, XC7VX690T-2FFG1930C fully supports partial reconfiguration through its ICAP interface and hierarchical design flow. This capability allows runtime logic partition swapping without resetting the entire device, enabling field-upgradable functions in deployed radar and EW systems. Implementation requires Vivado Design Suite 2020.2 or later and adherence to placement constraints defined in UG904.
What configuration modes are supported by XC7VX690T-2FFG1930C?
XC7VX690T-2FFG1930C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial Peripheral Interface (SPI) configuration modes. Master SelectMAP is most commonly used for high-speed parallel bitstream loading from external flash, while JTAG enables boundary-scan testing and debug. Configuration security features include AES-256 bitstream encryption and HMAC authentication, both mandatory for defense-grade deployments.
What is the I/O standard compatibility of XC7VX690T-2FFG1930C?
XC7VX690T-2FFG1930C supports 21 I/O standards including LVDS, Mini-LVDS, RSDS, BLVDS, SSTL, HSTL, and Differential Signaling. Each I/O bank operates independently with configurable VCCO voltages (1.2 V to 3.3 V), enabling mixed-voltage interfacing with ADCs, DACs, memory, and processors. I/O timing is characterized per UG475 v1.15 for -2 speed grade across industrial temperature range.
Is XC7VX690T-2FFG1930C qualified for extended temperature operation?
Yes, XC7VX690T-2FFG1930C is specified for operation from –40°C to +100°C junction temperature. Its FFG1930 package includes a thermal slug and copper pillar interconnects to maintain thermal integrity in conduction-cooled enclosures. The -2 speed grade ensures timing closure across this full range when powered with VCCINT = 0.95 V ±3%, meeting MIL-STD-810H thermal shock and sustained high-temp requirements.
XC7VX690T-2FFG1930C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 1000
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1930-FCBGA (45x45)
XC7VX690T-2FFG1930C FAQ
1.How can I place an order for XC7VX690T-2FFG1930C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-2FFG1930C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-2FFG1930C reliable?
The price and inventory of XC7VX690T-2FFG1930C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-2FFG1930C is usually 5 days.
3.What payment methods are accepted for XC7VX690T-2FFG1930C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-2FFG1930C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX690T-2FFG1930C?
XC7VX690T-2FFG1930C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-2FFG1930C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-2FFG1930C?
For technical support, including XC7VX690T-2FFG1930C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-2FFG1930C requirements.
6.How does Aetrix verify that XC7VX690T-2FFG1930C is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-2FFG1930C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-2FFG1930C meets industry standards.
7.What is the process for return or replacement of XC7VX690T-2FFG1930C?
All XC7VX690T-2FFG1930C units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-2FFG1930C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-2FFG1930C part is unused and in its original packaging.
Return procedure for XC7VX690T-2FFG1930C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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