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AMD XC7VX690T-3FFG1157E
- Part No.:
- XC7VX690T-3FFG1157E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-3FFG1157E.pdf
- Description:
- IC FPGA 600 I/O 1157FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,615
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Product details
Overview
XC7VX690T-3FFG1157E from AMD is a high-performance 28 nm Virtex-7 FPGA with 693,120 logic cells, 36.4 Mb of block RAM, and 3,600 DSP slices, configured in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package for high-speed serial interface and compute-acceleration applications in radar signal processing.
For engineers reviewing the XC7VX690T-3FFG1157E datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gb/s, -3 speed grade timing margin, and thermal design power of 33.5 W at typical operating conditions.
Technical Context
The XC7VX690T-3FFG1157E implements a 28 nm HKMG process-based architecture with 24 GTX transceivers supporting PCIe Gen3, SRIO Gen2, and 10G Ethernet protocols. It integrates SelectIO technology with programmable I/O standards including LVDS, SSTL, HSTL, and MIPI D-PHY.
Its configuration logic supports dual-boot via SPIx4 or BPI parallel flash, with AES-256 bitstream encryption and HMAC authentication. The device includes hardened IP blocks for PCI Express® Gen3 x8 endpoint/root complex and 10/100/1000 Mbps Ethernet MAC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| Block RAM | 36.4 Mb - supports large on-die data buffering, FIFOs, and coefficient storage for DSP pipelines |
| DSP Slices | 3,600 - enables high-throughput fixed/floating-point math for radar FFTs and beamforming |
| GTX Transceivers | 24 × 13.1 Gb/s - provides native SerDes links for JESD204B, CPRI, and optical interconnects |
| I/O Standards | LVDS, SSTL-18/25, HSTL-I/II, MIPI D-PHY - ensures compatibility with ADCs, memory, and sensor interfaces |
| Speed Grade | -3 - guarantees timing closure at highest operating frequencies under worst-case voltage/temperature corners |
| TDP | 33.5 W - defines thermal envelope requiring active heatsink and airflow ≥200 LFM |
Pinout & Package
XC7VX690T-3FFG1157E is housed in a 1157-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35×35 mm body size, 0.8 mm pitch, and thermal lid for enhanced heat dissipation in high-power FPGA applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | 1.0 V ±3% input powering CLBs, routing, and configuration logic; requires low-noise regulation |
| VCCAUX | Auxiliary supply rail | 1.8 V ±3% input powering configuration, clocking, and transceiver reference circuits |
| VCCO_0 | I/O bank supply | Programmable 1.2–3.3 V output bank supply enabling mixed-voltage interface design |
| MGTAVCC | Analog transceiver supply | 1.0 V ±3% dedicated rail for GTX analog front-end; sensitive to PSRR and ripple |
| INIT_B | Configuration status | Open-drain active-low signal indicating successful bitstream loading or configuration error |
| CCLK | Configuration clock | Input clock for master SPI/BPI configuration mode; frequency ≤50 MHz |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Hard IP | Reduces integration effort and latency for host CPU/FPGA co-processing systems without soft-core overhead |
| AES-256 + HMAC Security | Enables secure bitstream loading and runtime authentication against cloning or tampering |
| UltraScale-compatible I/O | Supports migration path to newer Xilinx/AMD families while retaining PCB layout and I/O constraints |
| Multi-boot with fallback | Allows field-upgradable firmware with automatic revert to known-good image on boot failure |
| Transceiver eye diagram compliance | Guarantees signal integrity over 10+ inch FR4 traces at 13.1 Gb/s per lane per JEDEC JESD204B spec |
Applications
| Radar Signal Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and synthetic aperture radar (SAR) imaging in airborne platforms. IC Role / Device Role / Timing Role: Primary compute engine executing FFT, CFAR, and beamforming kernels with deterministic latency. Use Value: 3,600 DSP slices and 13.1 Gb/s GTX lanes enable >20 GOPS sustained throughput and direct ADC/DAC interfacing via JESD204B. | Use Scenario: Offloading matrix multiplication and convolution operations from CPU in edge AI inference servers. IC Role / Device Role / Timing Role: Reconfigurable accelerator tightly coupled to DDR3/DDR4 memory controllers and PCIe Gen3 host interface. Use Value: 36.4 Mb block RAM and dual 72-bit DDR3 interfaces provide >25 GB/s memory bandwidth for weight/tensor buffering. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: Digital backend for ultrasound beamforming and real-time image reconstruction in portable scanners. IC Role / Device Role / Timing Role: Time-synchronized acquisition controller managing >128-channel echo digitization and channel compensation. Use Value: 24 GTX transceivers support JESD204B-compliant ADC links at 5 GSPS aggregate, with sub-ns skew control across lanes. | Use Scenario: High-resolution digital oscilloscope with 10 GS/s sampling and real-time FFT analysis. IC Role / Device Role / Timing Role: Real-time trigger processor and waveform post-processor handling deep memory capture and spectral computation. Use Value: 693,120 logic cells implement custom state machines for jitter-tolerant trigger detection and pipelined FFT engines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA compute-acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FHGB2104E | 16 nm UltraScale+ architecture; 1,124K logic cells; higher DSP density (5,520 slices); 58 GTM transceivers up to 28.2 Gb/s | Better suited for next-gen 5G massive MIMO and AI training workloads requiring higher throughput and lower latency | Select when migrating to advanced node with tighter power budget and need for PAM4 or coherent optics support |
| XC7VX980T-3FFG1930E | Larger die size; 979,200 logic cells; 52.8 Mb block RAM; same -3 speed grade and 28 nm process | Preferred for ultra-deep pipeline designs requiring >100k additional LUTs and >16 Mb extra BRAM | Choose when existing XC7VX690T-3FFG1157E design hits resource ceiling but must retain 28 nm toolchain and footprint compatibility |
Compared with XC7VX690T-3FFG1157E, the XCVU13P-2FHGB2104E delivers 62% more logic and double transceiver bandwidth at lower power per GOPS, while the XC7VX980T-3FFG1930E extends legacy 28 nm scalability with 41% more resources in a larger FFG1930 package-both require board redesign but preserve architectural continuity.
Availability
XC7VX690T-3FFG1157E is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, high-performance computing acceleration, and test & measurement equipment requiring stable component supply across extended product lifecycles.
Supply support for XC7VX690T-3FFG1157E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and aerospace/defense markets, with leadership in FPGA, adaptive SoC, and AI acceleration technologies.
The Virtex-7 family, including XC7VX690T-3FFG1157E, was engineered for high-bandwidth, low-latency signal and packet processing in mission-critical infrastructure where deterministic performance and long-term availability are essential.
FAQ
What is the maximum supported transceiver line rate for XC7VX690T-3FFG1157E?
The XC7VX690T-3FFG1157E supports GTX transceivers with a maximum line rate of 13.1 Gb/s, compliant with JESD204B, CPRI, and 10G Ethernet standards. This rate is guaranteed across all 24 transceivers under -3 speed grade conditions at junction temperatures up to 100°C and VCCINT = 1.0 V ±3%.
Does XC7VX690T-3FFG1157E include hard IP for PCI Express Gen3?
Yes, XC7VX690T-3FFG1157E integrates a hardened PCI Express Gen3 x8 endpoint/root complex block, eliminating the need for soft-core implementations. This hard IP supports full link training, ASPM power states, and AXI4 streaming interfaces, and is validated per PCI-SIG specification rev 3.0.
What I/O voltage levels does XC7VX690T-3FFG1157E support?
XC7VX690T-3FFG1157E supports I/O voltages from 1.2 V to 3.3 V across its 24 I/O banks, with per-bank programmability for LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS and MIPI D-PHY. Each bank's VCCO must be set within its specified range before configuration.
Is XC7VX690T-3FFG1157E qualified for aerospace or defense applications?
XC7VX690T-3FFG1157E is not a radiation-hardened or QML-V qualified part. It is rated for commercial and industrial temperature ranges (0°C to 100°C junction). For aerospace/defense use, designers must perform system-level radiation testing and apply external mitigation techniques such as EDAC, TMR, and watchdog supervision.
What configuration modes are supported by XC7VX690T-3FFG1157E?
XC7VX690T-3FFG1157E supports master SPI (x1/x2/x4), slave SPI, BPI parallel, and JTAG configuration modes. Dual-boot capability allows two independent bitstreams stored in external flash, with automatic fallback to backup image if primary fails CRC verification during startup.
XC7VX690T-3FFG1157E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 600
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1157-FCBGA (35x35)
XC7VX690T-3FFG1157E FAQ
1.How can I place an order for XC7VX690T-3FFG1157E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-3FFG1157E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-3FFG1157E reliable?
The price and inventory of XC7VX690T-3FFG1157E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-3FFG1157E is usually 5 days.
3.What payment methods are accepted for XC7VX690T-3FFG1157E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-3FFG1157E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX690T-3FFG1157E?
XC7VX690T-3FFG1157E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-3FFG1157E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-3FFG1157E?
For technical support, including XC7VX690T-3FFG1157E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-3FFG1157E requirements.
6.How does Aetrix verify that XC7VX690T-3FFG1157E is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-3FFG1157E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-3FFG1157E meets industry standards.
7.What is the process for return or replacement of XC7VX690T-3FFG1157E?
All XC7VX690T-3FFG1157E units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-3FFG1157E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-3FFG1157E part is unused and in its original packaging.
Return procedure for XC7VX690T-3FFG1157E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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