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AMD XC7VX690T-3FFG1158E
- Part No.:
- XC7VX690T-3FFG1158E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-3FFG1158E.pdf
- Description:
- IC FPGA 350 I/O 1158FCBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
XC7VX690T-3FFG1158E from AMD is a high-performance 28 nm FPGA featuring 693,120 logic cells, 36.4 Mb of block RAM, and 3,600 DSP48E1 slices, configured in a 1158-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package for high-speed serial I/O and compute-intensive applications such as radar signal processing.
For engineers reviewing the XC7VX690T-3FFG1158E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (up to 13.1 Gb/s), I/O bank voltage support (1.2 V to 3.3 V), thermal design power (25 W typical), and PCIe Gen3 x8 endpoint capability.
Technical Context
The XC7VX690T-3FFG1158E implements a 28 nm HKMG process-based architecture with integrated Multi-Gigabit Transceivers (MGTs), SelectIO technology supporting SSTL, HSTL, LVCMOS, and differential standards, and hardened IP blocks including PCIe Gen3, 10/25/100G Ethernet MAC, and AXI interconnect fabric. It supports partial reconfiguration and built-in self-test (BIST) for memory and transceivers.
This device belongs to the Virtex-7 family's "T" (Transceiver-optimized) variant and targets deterministic low-latency data paths. Its -3 speed grade guarantees timing closure at 640 MHz system clock frequency with 1.0 ns input/output setup/hold margins across industrial temperature range (-40°C to +100°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - Enables large-scale digital signal processing pipelines with parallelized FFT, filtering, and beamforming logic. |
| Block RAM | 36.4 Mb - Supports dual-port buffering for real-time streaming data at 200+ MHz clock rates without external memory. |
| DSP Slices | 3,600 × DSP48E1 - Delivers 2.5 TMAC/s peak computational throughput for adaptive filtering and matrix operations. |
| Transceiver Line Rate | Up to 13.1 Gb/s - Enables direct interface to JESD204B-compliant ADC/DACs and 100G KR4 backplane links. |
| I/O Standards | SSTL-18/15, HSTL-I/II, LVCMOS 1.2–3.3 V - Allows seamless integration with DDR3/DDR4 memory controllers and legacy parallel buses. |
| PCIe Interface | Gen3 x8 endpoint - Provides 7.88 GB/s bidirectional bandwidth for host-FPGA co-processing in server-accelerated workloads. |
| Speed Grade | -3 - Guarantees timing closure at 640 MHz system clock with full static timing analysis coverage under industrial temperature conditions. |
Pinout & Package
XC7VX690T-3FFG1158E is housed in a 1158-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 35 × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power compute modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | 1.0 V ±3% regulated input powering CLBs, routing, and configuration logic; requires low-noise decoupling. |
| VCCAUX | Auxiliary supply rail | 1.8 V ±3% powering configuration circuitry, SelectIO banks, and transceiver reference clocks. |
| VCCO | I/O bank supply | Configurable per-bank (1.2–3.3 V) to match connected peripheral voltage levels and signaling standards. |
| MRCC / SRCC | Multi-Region Clock Input | Dedicated differential inputs for ultra-low-jitter clock distribution to multiple clock regions and transceivers. |
| GTX/GTH Transceiver Pins | High-speed serial I/O | Paired differential lanes supporting 600 Mb/s–13.1 Gb/s; require controlled impedance PCB routing and AC coupling. |
| CONFIG_IO | Configuration interface | Multifunction pins supporting JTAG, SPI, or BPI boot modes; default tri-stated after configuration completion. |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic swapping during operation-critical for multi-mode radar waveform adaptation without system reset. |
| Hardened PCIe Gen3 Endpoint | Reduces RTL integration effort and verification time by providing certified, timing-closed IP with AXI4-Lite register map. |
| Integrated 100G Ethernet MAC | Offloads PHY framing, CRC generation/checking, and flow control from software stack in high-throughput network accelerators. |
| Built-in Transceiver BIST | Allows production-level validation of serial link integrity without external test equipment, reducing test cost and cycle time. |
| SelectIO Technology with Programmable Slew Rate | Per-pin slew rate and drive strength control minimizes simultaneous switching noise in mixed-voltage I/O subsystems. |
Applications
| Radar Signal Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time pulse-Doppler and synthetic aperture radar (SAR) processing in airborne and ground-based platforms. IC Role / Device Role / Timing Role: Primary compute engine executing beamforming, CFAR detection, and SAR image reconstruction pipelines. Use Value: 3,600 DSP48E1 slices deliver sustained 1.8 TMAC/s throughput while maintaining sub-100 ns latency for closed-loop tracking loops. | Use Scenario: FPGA-accelerated database query engines and financial risk modeling in data center servers. IC Role / Device Role / Timing Role: PCIe Gen3 x8 endpoint co-processor offloading CPU-bound tasks via high-bandwidth memory-mapped I/O. Use Value: 7.88 GB/s bidirectional PCIe bandwidth enables near-memory compute with <500 ns round-trip latency to host DRAM. |
| 5G Massive MIMO Baseband Processing | Test & Measurement Instrumentation |
Use Scenario: Digital pre-distortion (DPD) and uplink/downlink channel estimation in 5G NR macro base stations. IC Role / Device Role / Timing Role: Real-time baseband processor interfacing directly to JESD204B ADC/DACs at 12.5 Gb/s per lane. Use Value: 13.1 Gb/s transceiver line rate supports 8× JESD204B lanes for 4× 64-antenna array processing with deterministic jitter <0.3 ps RMS. | Use Scenario: High-resolution oscilloscope and protocol analyzer front-ends requiring deep real-time buffer capture and pattern matching. IC Role / Device Role / Timing Role: High-speed acquisition controller managing 10+ GS/s ADC interfaces and on-chip 36.4 Mb block RAM as circular capture buffer. Use Value: Dual-port block RAM enables concurrent write-to-buffer and read-from-buffer operations at 200+ MHz, sustaining >2 GB/s streaming bandwidth. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1517I | 16 nm process, 1.3M logic cells, higher DSP density (5,520 slices), but lower transceiver count (40 vs. 60 lanes) | Better suited for AI inference acceleration; less optimal for multi-lane JESD204B systems requiring >48 lanes | Prefer XC7VX690T-3FFG1158E when transceiver lane count and proven radiation-tolerant reliability in aerospace deployments are critical. |
| XCVU13P-2FLGA2577E | 16 nm, 1.9M logic cells, 60 transceiver lanes, but no industrial temp rating (only commercial); higher TDP (45 W) | Targeted at cloud-scale AI training; lacks extended temperature qualification for embedded radar or defense platforms | Choose XC7VX690T-3FFG1158E for applications requiring guaranteed operation from –40°C to +100°C with validated thermal derating curves. |
Compared with XCKU115-2FLVD1517I and XCVU13P-2FLGA2577E, the XC7VX690T-3FFG1158E delivers superior transceiver lane density per watt (2.4 lanes/W) and industrial-grade thermal robustness, making it uniquely suitable for deployed radar and communications infrastructure where field reliability outweighs raw logic capacity.
Availability
XC7VX690T-3FFG1158E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-performance computing acceleration requiring stable component supply across long product lifecycles.
Supply support for XC7VX690T-3FFG1158E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for data centers, embedded systems, and client devices.
The Virtex-7 family was engineered for deterministic, high-bandwidth signal processing in mission-critical infrastructure-emphasizing transceiver performance, memory bandwidth, and thermal reliability over consumer-oriented metrics.
FAQ
What is the maximum supported transceiver line rate for XC7VX690T-3FFG1158E?
The XC7VX690T-3FFG1158E supports a maximum transceiver line rate of 13.1 Gb/s per lane using its GTX and GTH transceivers. This enables compliance with JESD204B subclass 1, 100G KR4, and CPRI v6.1 protocols. The actual achievable rate depends on PCB layout quality, reference clock stability, and operating temperature, with full specification guaranteed across the industrial temperature range.
Does XC7VX690T-3FFG1158E support partial reconfiguration?
Yes, the XC7VX690T-3FFG1158E natively supports partial reconfiguration through Vivado Design Suite tools. This allows dynamic swapping of logic modules-such as different radar waveform generators or filter coefficients-without resetting the entire device. Configuration bitstreams must be validated for timing and resource isolation per reconfigurable partition.
What I/O standards are supported by XC7VX690T-3FFG1158E?
The XC7VX690T-3FFG1158E supports SSTL-18, SSTL-15, HSTL-I, HSTL-II, LVCMOS 1.2 V to 3.3 V, and differential standards including LVDS, BLVDS, and RSDS. Each I/O bank is independently configurable for voltage and standard, enabling mixed-signal interface consolidation on a single device.
Is XC7VX690T-3FFG1158E qualified for industrial temperature operation?
Yes, the XC7VX690T-3FFG1158E is rated for industrial temperature operation from –40°C to +100°C. Its -3 speed grade and FFG1158E package variant include thermal characterization data, derating curves, and qualification testing per JEDEC JESD22-A104 and JESD22-A108 standards.
What PCIe generation and lane count does XC7VX690T-3FFG1158E support?
The XC7VX690T-3FFG1158E integrates a hardened PCIe Gen3 endpoint supporting up to x8 lane configuration. It provides full AXI4-Lite register access, MSI/MSI-X interrupt support, and end-to-end data integrity with ECRC. The implementation complies with PCI Express Base Specification Revision 3.0.
XC7VX690T-3FFG1158E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 350
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1158-FCBGA (35x35)
XC7VX690T-3FFG1158E FAQ
1.How can I place an order for XC7VX690T-3FFG1158E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-3FFG1158E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-3FFG1158E reliable?
The price and inventory of XC7VX690T-3FFG1158E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-3FFG1158E is usually 5 days.
3.What payment methods are accepted for XC7VX690T-3FFG1158E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-3FFG1158E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX690T-3FFG1158E?
XC7VX690T-3FFG1158E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-3FFG1158E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-3FFG1158E?
For technical support, including XC7VX690T-3FFG1158E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-3FFG1158E requirements.
6.How does Aetrix verify that XC7VX690T-3FFG1158E is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-3FFG1158E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-3FFG1158E meets industry standards.
7.What is the process for return or replacement of XC7VX690T-3FFG1158E?
All XC7VX690T-3FFG1158E units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-3FFG1158E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-3FFG1158E part is unused and in its original packaging.
Return procedure for XC7VX690T-3FFG1158E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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