My Inquiry
My Account
AMD XC7VX690T-3FFG1761E
- Part No.:
- XC7VX690T-3FFG1761E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-3FFG1761E.pdf
- Description:
- IC FPGA 850 I/O 1761FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,688
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7VX690T-3FFG1761E from AMD is a high-performance 28 nm FPGA with 693,120 logic cells, 36.4 Mb of block RAM, and 3,600 DSP slices, configured in a 1761-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package for high-speed serial interface and compute-acceleration applications in radar signal processing.
For engineers reviewing the XC7VX690T-3FFG1761E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (13.1 Gb/s), I/O voltage support (1.2 V to 3.3 V), and thermal design power (52 W) under worst-case switching conditions.
Technical Context
The XC7VX690T-3FFG1761E implements a 28 nm HKMG process-based architecture with integrated multi-gigabit transceivers supporting PCIe Gen3, SRIO Gen2, and 10G Ethernet protocols. It includes hardened IP blocks for PCI Express® Endpoint and Root Port, AXI interconnect, and clock management tiles with MMCM and PLL.
Configuration is performed via Master SelectMAP or JTAG, with dual-boot capability using external SPI flash. The device supports partial reconfiguration and dynamic power management through dedicated power rails and on-chip monitoring sensors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - total configurable logic resources for complex RTL implementation |
| Block RAM | 36.4 Mb - distributed memory capacity for FIFOs, buffers, and lookup tables |
| DSP Slices | 3,600 - fixed-point arithmetic units optimized for filtering and FFT acceleration |
| Transceiver Line Rate | 13.1 Gb/s - maximum serial data rate per GTHE2 transceiver channel |
| I/O Standards | LVDS, SSTL, HSTL, TMDS, MIPI D-PHY - supports mixed-voltage board-level interfacing |
| Thermal Design Power | 52 W - peak power dissipation requiring active cooling and thermal vias in PCB layout |
| Configuration Mode | Master SelectMAP, JTAG, Slave Serial - flexible boot options with fallback support |
Pinout & Package
XC7VX690T-3FFG1761E is housed in a 1761-ball Flip-Chip Fine-Pitch BGA (FFG) package with 1.0 mm ball pitch, designed for high-density routing and thermal dissipation in multi-layer PCBs with embedded heat spreaders.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | 1.0 V ±3% regulated input powering CLBs, interconnect, and configuration logic |
| VCCAUX | Auxiliary supply rail | 1.8 V ±3% powering configuration, clocking, and transceiver reference circuits |
| VCCO | I/O bank supply | Configurable 1.2–3.3 V per bank enabling mixed-signal interface compatibility |
| MGTAVCC | Transceiver analog supply | 1.0 V ±3% dedicated rail for GTHE2 transceiver analog circuitry |
| CLK_IN | Dedicated clock input | Differential input supporting 10 MHz–710 MHz frequencies for MMCM/PLL reference |
| PROGRAM_B | Configuration reset | Active-low asynchronous signal initiating full reconfiguration from flash or host |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 Endpoint | Integrated endpoint controller with 8-lane x8 configuration, eliminating external bridge IC and reducing latency |
| Partial Reconfiguration Support | Enables runtime logic updates without system reset, critical for adaptive radar waveform changes |
| UltraScale Architecture | Column-based tile layout with dedicated routing for predictable timing closure in large designs |
| On-Chip Temperature Sensor | Monitors die temperature with ±5°C accuracy to trigger thermal throttling or fan control |
| AXI4-Stream Interface | Native streaming protocol support simplifies integration with ARM-based Zynq SoCs and DMA controllers |
Applications
| Radar Signal Processing | High-Performance Computing Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems. IC Role / Device Role / Timing Role: Primary compute fabric executing FFT, CFAR, and STAP algorithms with deterministic latency. Use Value: 3,600 DSP slices deliver >2.1 TFLOPS FP16-equivalent throughput at 250 MHz clock frequency. | Use Scenario: Offloading matrix multiplication and sparse linear algebra from CPU in edge inference servers. IC Role / Device Role / Timing Role: Co-processor implementing custom accelerator kernels via Vivado HLS-generated RTL. Use Value: Block RAM bandwidth of 1.2 TB/s enables concurrent access to multiple weight matrices without stalling. |
| 5G Baseband Processing | Test & Measurement Equipment |
Use Scenario: Layer 1 PHY processing for massive MIMO base stations including channel estimation and precoding. IC Role / Device Role / Timing Role: Real-time digital front-end (DFE) handling 100+ antenna streams with sub-100 ns latency. Use Value: GTHE2 transceivers support 8× 13.1 Gb/s CPRI/eCPRI links directly to RFICs without retiming. | Use Scenario: High-resolution oscilloscope acquisition engine with 10 GS/s sampling and real-time FFT. IC Role / Device Role / Timing Role: Time-interleaved ADC controller and post-processing pipeline synchronizing multiple channels. Use Value: 1761-ball FFG package provides >400 dedicated I/O pins for parallel LVDS data capture and trigger distribution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA compute-acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | Higher logic density (1,024K LC), 16.3 Gb/s transceivers, but 2577-ball package and higher TDP (65 W) | Better suited for AI training workloads requiring larger on-die memory and wider vector units | Select when >800K logic cells and >15 Gb/s serial I/O are required; verify PCB redesign for larger footprint and thermal mass |
| XC7VX485T-2FFG1157I | Lower logic count (485,760 LC), same 13.1 Gb/s transceivers, 1157-ball FFG package, industrial temp grade | Targeted at cost-sensitive defense electronics where extended temperature range is mandatory | Choose for -40°C to +100°C operation and reduced BOM cost; accept 30% fewer DSP slices and 25% less BRAM |
Compared with XC7VX690T-3FFG1761E, the XCVU13P-2FLGA2577E offers greater scalability for next-gen AI workloads but demands more board area and cooling, while the XC7VX485T-2FFG1157I trades capacity for ruggedization and lower cost in fixed-function radar subsystems.
Availability
XC7VX690T-3FFG1761E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-performance computing acceleration requiring stable component supply across long production cycles.
Supply support for XC7VX690T-3FFG1761E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI technologies, with leadership in FPGA and heterogeneous processing platforms.
The Virtex-7 family, including XC7VX690T-3FFG1761E, was engineered for high-throughput, low-latency signal and packet processing in aerospace, defense, and wired/wireless infrastructure.
FAQ
What is the maximum supported transceiver line rate for XC7VX690T-3FFG1761E?
The XC7VX690T-3FFG1761E supports a maximum transceiver line rate of 13.1 Gb/s per GTHE2 channel, validated for protocols including PCIe Gen3, SRIO Gen2, and 10GBASE-R. This rate is achievable under standard junction temperature and voltage conditions specified in the Virtex-7 DC and AC Switching Characteristics document.
Does XC7VX690T-3FFG1761E support partial reconfiguration?
Yes, XC7VX690T-3FFG1761E fully supports partial reconfiguration through Vivado Design Suite, allowing dynamic replacement of logical modules without resetting the entire device. This capability is used in adaptive radar and software-defined radio applications where waveform parameters change in real time.
What I/O standards are supported by XC7VX690T-3FFG1761E?
XC7VX690T-3FFG1761E supports LVDS, SSTL-18/25, HSTL-I/II, TMDS, and MIPI D-PHY across its 32 I/O banks. Each bank operates independently at voltages from 1.2 V to 3.3 V, enabling direct connection to DDR3/4 memory, image sensors, and high-speed SerDes devices.
What is the thermal design power (TDP) of XC7VX690T-3FFG1761E?
The thermal design power of XC7VX690T-3FFG1761E is 52 W under worst-case switching activity and junction temperature conditions. This value guides heatsink sizing, airflow requirements, and PCB copper pour design for reliable operation in enclosed chassis environments.
Is XC7VX690T-3FFG1761E compatible with Vivado 2023.1 toolchain?
Yes, XC7VX690T-3FFG1761E is fully supported in Vivado Design Suite 2023.1, including synthesis, implementation, and bitstream generation. Device files, IP integrator templates, and timing constraints are included in the installation, with no additional license required beyond the base Vivado edition.
XC7VX690T-3FFG1761E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 850
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1761-FCBGA (42.5x42.5)
XC7VX690T-3FFG1761E FAQ
1.How can I place an order for XC7VX690T-3FFG1761E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-3FFG1761E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-3FFG1761E reliable?
The price and inventory of XC7VX690T-3FFG1761E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-3FFG1761E is usually 5 days.
3.What payment methods are accepted for XC7VX690T-3FFG1761E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-3FFG1761E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX690T-3FFG1761E?
XC7VX690T-3FFG1761E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-3FFG1761E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-3FFG1761E?
For technical support, including XC7VX690T-3FFG1761E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-3FFG1761E requirements.
6.How does Aetrix verify that XC7VX690T-3FFG1761E is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-3FFG1761E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-3FFG1761E meets industry standards.
7.What is the process for return or replacement of XC7VX690T-3FFG1761E?
All XC7VX690T-3FFG1761E units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-3FFG1761E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-3FFG1761E part is unused and in its original packaging.
Return procedure for XC7VX690T-3FFG1761E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7VX690T-3FFG1761E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
