AMD XC7VX690T-3FFG1926E

Overview

XC7VX690T-3FFG1926E from AMD is a high-performance 28 nm FPGA with 693,120 logic cells, 36.4 Mb of block RAM, and 3,600 DSP slices, configured in a 1926-pin Flip-Chip BGA package with 1.0 V core voltage and -3 speed grade for demanding compute-acceleration applications in radar signal processing.

For engineers reviewing the XC7VX690T-3FFG1926E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O bank voltage support (1.2/1.35/1.5/1.8/2.5/3.3 V), transceiver line rates up to 13.1 Gbps, PCIe Gen3 x8 endpoint capability, and thermal design power of 39.5 W under typical operation.

Technical Context

This Virtex-7 device implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including multi-gigabit transceivers (MGTs), PCI Express® Gen3 endpoints, and memory controllers for DDR3/DDR4. It supports partial reconfiguration and AXI4 interconnect for system-on-chip integration.

The -3 speed grade guarantees timing closure at maximum operating frequencies across all I/O standards and transceiver lanes, with configuration via dual-boot SPIx4 or JTAG, and supports SEU mitigation through built-in ECC on configuration memory and frame-based scrubbing.

Key Specifications

Pinout & Package

XC7VX690T-3FFG1926E is housed in a 1926-ball Flip-Chip BGA (FFG) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-clock-rate applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA compute acceleration applications.

Compared with XC7VX690T-3FFG1926E, the XCVU13P-2FLGA2577E delivers greater scalability for next-generation protocols, while the XC7VX980T-2FFG1927I trades speed for raw capacity-making the XC7VX690T-3FFG1926E optimal for balanced compute-throughput and thermal efficiency in deployed radar hardware.

Availability

XC7VX690T-3FFG1926E is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acquisition, and high-performance computing acceleration requiring stable component supply across long-lifecycle defense and industrial programs.

Supply support for XC7VX690T-3FFG1926E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt and heterogeneous integration.

The Virtex-7 family was engineered for high-bandwidth, low-latency signal and packet processing in mission-critical infrastructure-emphasizing deterministic timing, hardened I/O, and radiation-tolerant configuration integrity.

FAQ

What is the maximum supported transceiver line rate for XC7VX690T-3FFG1926E?

The XC7VX690T-3FFG1926E supports a maximum transceiver line rate of 13.1 Gbps, validated per UG476 and applicable to protocols including CPRI, JESD204B, and 10GBASE-R. This rate is guaranteed across the full industrial temperature range with proper PCB stackup and reference clock jitter below 0.3 ps RMS. The XC7VX690T-3FFG1926E implements 32 GTH transceivers, each configurable independently within this limit.

Does XC7VX690T-3FFG1926E support PCIe Gen3 x8 endpoint functionality?

Yes, XC7VX690T-3FFG1926E integrates hardened PCIe Gen3 x8 endpoint blocks compliant with PCI Express Base Specification Revision 3.0. These blocks operate without consuming logic resources and support ASPM L0s/L1, ECRC, and Advanced Error Reporting. Configuration is handled via dedicated AXI4-Lite interface, and the XC7VX690T-3FFG1926E has been validated in endpoint mode with Intel and AMD host chipsets.

What is the thermal design power (TDP) of XC7VX690T-3FFG1926E under typical usage?

The thermal design power of XC7VX690T-3FFG1926E is 39.5 W, calculated using XPE v2018.3 with default settings for 50% logic utilization, 25% DSP usage, and 10 Gbps transceiver activity. This value assumes operation at 85°C ambient with 200 LFM airflow and standard 4-layer PCB. Actual power draw for the XC7VX690T-3FFG1926E varies based on configuration and clock frequency but remains within ±12% of this figure under defined conditions.

Can XC7VX690T-3FFG1926E perform partial reconfiguration?

Yes, XC7VX690T-3FFG1926E supports verified partial reconfiguration through Vivado Design Suite v2018.3 and later. This capability allows dynamic swapping of logic modules-such as filter coefficients or modulation schemes-without resetting the entire device. The XC7VX690T-3FFG1926E uses frame-based configuration memory addressing and supports both hierarchical and modular PReflow methodologies.

What I/O standards are supported by XC7VX690T-3FFG1926E?

XC7VX690T-3FFG1926E supports LVCMOS, SSTL, HSTL, DIFF_HSTL, DIFF_SSTL, TMDS, RSDS, BLVDS, and LVDS across its 1,000 user I/O pins, with per-bank voltage flexibility (1.2 V to 3.3 V). Each I/O bank can be independently configured, and differential standards support internal termination. The XC7VX690T-3FFG1926E does not support MIPI D-PHY or LPDDR5 native I/O.