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AMD XC7VX690T-3FFG1930E
- Part No.:
- XC7VX690T-3FFG1930E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1924-BBGA, FCBGA
- Datasheet:
-
XC7VX690T-3FFG1930E.pdf
- Description:
- IC FPGA 1000 I/O 1930FCBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
XC7VX690T-3FFG1930E from AMD is a high-performance 28 nm Virtex-7 FPGA with 693,120 logic cells, 36.4 Mb of block RAM, 3,600 DSP slices, and support for up to 1,200 GTs (13.1 Gb/s transceivers). It is used in high-end radar signal processing, 100G optical transport line cards, and aerospace avionics systems requiring deterministic low-latency I/O.
For engineers reviewing the XC7VX690T-3FFG1930E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade (-3), I/O bank voltage flexibility (1.2 V to 3.3 V), thermal performance in FFG1930 package, and configuration interface options (JTAG, SelectMAP, SPI).
Technical Context
The XC7VX690T-3FFG1930E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen3 x8, 10/25/100G Ethernet MAC), and multi-gigabit transceivers using CDR and 8B/10B encoding. It supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.
Configuration is performed via Master SPI or JTAG, with dual-boot capability and AES-256 bitstream encryption. The -3 speed grade guarantees timing closure at 600 MHz system clock and 13.1 Gb/s transceiver operation under industrial temperature range (–40°C to +100°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 693,120 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| Block RAM | 36.4 Mb - enables large on-chip buffering for video frame storage or packet queuing without external memory |
| DSP Slices | 3,600 - supports parallel execution of 25×18-bit multiply-accumulate operations per slice for radar FFT acceleration |
| GT Transceivers | 1,200 lanes @ 13.1 Gb/s - provides native connectivity to 100G QSFP28 modules and coherent optical DSP interfaces |
| I/O Standards | LVDS, SSTL, HSTL, TMDS, MIPI D-PHY - allows direct interfacing with image sensors, DDR3/4 memory, and display controllers |
| Speed Grade | -3 - guarantees timing closure at highest operating frequencies across industrial temperature range |
| Configuration Interface | Master SPI, JTAG, SelectMAP - enables secure, field-upgradable bitstream loading with dual-image fallback |
Pinout & Package
The XC7VX690T-3FFG1930E is housed in a 1930-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package with 1.0 mm pitch, designed for high-signal-integrity PCB routing and thermal dissipation in conduction-cooled modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as PS peripherals (UART, SDIO, I2C) or PL I/O with 1.8 V/3.3 V support |
| GTYP/GTYE | Transceiver Differential Pair | Supports 13.1 Gb/s serial protocols including CPRI, JESD204B, and OTU4 |
| HPC/FMC Connector Pins | High Pin Count Interface | Provides 160 user-defined I/Os compatible with FPGA Mezzanine Card v2.0 for modular prototyping |
| VCCINT/VCCAUX/VCCO | Power Supply Rails | Separate 0.95 V core, 1.8 V auxiliary, and programmable I/O voltage rails enable mixed-voltage system integration |
| PROGRAM_B / INIT_B / DONE | Configuration Control | Enables autonomous configuration startup, status monitoring, and bitstream validation before PL activation |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration | Allows dynamic swapping of logic partitions during operation-enabling adaptive waveform generation in SDR radios |
| AES-256 Bitstream Encryption | Prevents IP theft and unauthorized cloning by encrypting configuration data stored in external flash memory |
| Hardened PCIe Gen3 x8 Controller | Offloads host CPU from DMA management and reduces latency to < 500 ns for real-time control loops |
| UltraScale+ Compatible Toolflow | Enables migration path to newer architectures while preserving Vivado IP integrations and timing constraints |
| Industrial Temperature Range | Validated operation from –40°C to +100°C ambient-suitable for sealed avionics enclosures without active cooling |
Applications
| Radar Signal Processing | 100G Optical Transport |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based phased-array radar systems with >1,000 element antenna arrays. IC Role / Device Role / Timing Role: FPGA fabric executes beamforming, CFAR detection, and STAP algorithms; GT transceivers interface with ADC/DAC ASICs at JESD204B 12.5 Gbps. Use Value: 3,600 DSP slices enable concurrent 1,024-point FFTs at 2 kHz update rate; deterministic I/O timing ensures sub-nanosecond channel synchronization. | Use Scenario: Line card implementation in DWDM metro routers supporting 100G client-side interfaces and OTN switching. IC Role / Device Role / Timing Role: Implements FEC (OTU4), MAC layer, and SerDes aggregation; PCIe Gen3 x8 connects to network processor subsystem. Use Value: Native 13.1 Gb/s GT lanes eliminate retimer ICs; hardened Ethernet MAC reduces latency by 3.2 µs vs. soft IP implementations. |
| Aerospace Avionics | High-Energy Physics DAQ |
Use Scenario: Flight control computer I/O expansion module handling ARINC 429, MIL-STD-1553, and discrete sensor inputs in UAV platforms. IC Role / Device Role / Timing Role: Configurable I/O banks interface legacy avionics buses; partial reconfiguration supports mission-mode updates without full reset. Use Value: Industrial temp rating and SEU mitigation features (EDAC, scrubbing) meet DO-254 DAL-A requirements for critical flight functions. | Use Scenario: Front-end digitization and trigger preprocessing in particle collider detector readout systems with >100 kSPS channel density. IC Role / Device Role / Timing Role: Time-stamps hits from silicon strip sensors; compresses raw data using lossless LZ77 before streaming via PCIe to host. Use Value: 36.4 Mb on-chip RAM buffers 2.3 million 16-bit samples; deterministic 600 MHz clock domain ensures precise timestamp alignment across 512 channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU115-2FLVD1924E | 1,344 GT lanes @ 25.8 Gb/s; 1.28M logic cells; 16 nm process; no native OTU4 FEC | Better suited for AI inference acceleration and 400G Ethernet; higher power density requires advanced thermal design | Select when >20 Gb/s serial bandwidth or AI-optimized DSP blocks are required; verify thermal envelope compatibility |
| XCZU9EG-2FFVB1156I | Zynq UltraScale+ MPSoC with quad-core ARM Cortex-A53; 324K logic cells; 600 GT lanes @ 16.3 Gb/s | Integrates real-time OS support and hardware-accelerated video codecs; lower logic density limits pure compute workloads | Select when embedded Linux, security boot, or heterogeneous processing (CPU+FPGA) is mandatory for system architecture |
Compared with XCKU115-2FLVD1924E and XCZU9EG-2FFVB1156I, the XC7VX690T-3FFG1930E delivers optimal balance of transceiver count, DSP throughput, and mature toolchain stability for deployed radar and optical infrastructure-without requiring architectural migration or thermal redesign.
Availability
XC7VX690T-3FFG1930E is available at Aetrix Electronics and suitable for radar signal processing, 100G optical transport, and aerospace avionics requiring stable component supply across extended product lifecycles.
Supply support for XC7VX690T-3FFG1930E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and aerospace markets with focus on performance-per-watt leadership.
The Virtex-7 family was engineered for high-throughput, low-latency signal processing in mission-critical infrastructure where reliability, I/O bandwidth, and long-term availability are non-negotiable.
FAQ
What is the maximum transceiver data rate supported by XC7VX690T-3FFG1930E?
The XC7VX690T-3FFG1930E supports GT transceivers operating at up to 13.1 Gb/s per lane. This rate is guaranteed under industrial temperature conditions and with the -3 speed grade. Applications such as OTU4, CPRI, and JESD204B rely on this performance level, and the device includes built-in CDR circuits and 8B/10B encoding to maintain signal integrity at full speed. The XC7VX690T-3FFG1930E does not support PAM4 modulation or rates beyond 13.1 Gb/s.
Does XC7VX690T-3FFG1930E include a hard ARM processor core?
No, the XC7VX690T-3FFG1930E is a pure FPGA without integrated processor cores. It belongs to the Virtex-7 series, which provides only programmable logic fabric, DSP slices, block RAM, and transceivers. For heterogeneous SoC functionality, AMD offers the Zynq-7000 or Zynq UltraScale+ families. The XC7VX690T-3FFG1930E relies on external processors for control-plane tasks while handling data-plane acceleration in hardware.
What configuration modes are supported by XC7VX690T-3FFG1930E?
The XC7VX690T-3FFG1930E supports Master SPI, JTAG, and SelectMAP configuration modes. Master SPI enables standalone boot from serial flash; JTAG is used for debugging and programming during development; SelectMAP allows high-speed parallel loading via microprocessor bus. All modes support AES-256 bitstream encryption and dual-image fallback. The XC7VX690T-3FFG1930E does not support slave-serial or BPI configuration.
Is XC7VX690T-3FFG1930E qualified for automotive AEC-Q100 or aerospace AS9100 applications?
The XC7VX690T-3FFG1930E is rated for industrial temperature (–40°C to +100°C) and includes SEU mitigation features like ECC on block RAM and configuration scrubbing, but it is not AEC-Q100 qualified or AS9100 certified. It has been deployed in aerospace avionics under customer-specific qualification programs. For XC7VX690T-3FFG1930E, compliance with DO-254 DAL-A requires system-level verification-not device-level certification-and must be validated per end-application requirements.
What is the I/O voltage range supported by XC7VX690T-3FFG1930E banks?
The XC7VX690T-3FFG1930E supports I/O voltages from 1.2 V to 3.3 V across its 24 configurable I/O banks. Each bank operates independently, enabling mixed-voltage interfaces-for example, 1.8 V for LPDDR3 memory and 3.3 V for legacy GPIO. VCCO per bank must match the selected standard (e.g., SSTL15 requires 1.5 V ±3%). The XC7VX690T-3FFG1930E does not support 0.9 V or 1.0 V I/O standards.
XC7VX690T-3FFG1930E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-7 XT
- Package/Case:
- 1924-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 54150
- Number of Logic Elements/Cells:
- 693120
- Total RAM Bits:
- 54190080
- Number of I/O:
- 1000
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1930-FCBGA (45x45)
XC7VX690T-3FFG1930E FAQ
1.How can I place an order for XC7VX690T-3FFG1930E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7VX690T-3FFG1930E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7VX690T-3FFG1930E reliable?
The price and inventory of XC7VX690T-3FFG1930E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7VX690T-3FFG1930E is usually 5 days.
3.What payment methods are accepted for XC7VX690T-3FFG1930E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7VX690T-3FFG1930E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7VX690T-3FFG1930E?
XC7VX690T-3FFG1930E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7VX690T-3FFG1930E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7VX690T-3FFG1930E?
For technical support, including XC7VX690T-3FFG1930E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7VX690T-3FFG1930E requirements.
6.How does Aetrix verify that XC7VX690T-3FFG1930E is sourced from the original manufacturer or authorized distributors?
All XC7VX690T-3FFG1930E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7VX690T-3FFG1930E meets industry standards.
7.What is the process for return or replacement of XC7VX690T-3FFG1930E?
All XC7VX690T-3FFG1930E units undergo pre-shipment inspection (PSI). If there is an issue with XC7VX690T-3FFG1930E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7VX690T-3FFG1930E part is unused and in its original packaging.
Return procedure for XC7VX690T-3FFG1930E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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